POLYMER PATTERNED DISK STACK MANUFACTURING
    6.
    发明公开

    公开(公告)号:US20240329282A1

    公开(公告)日:2024-10-03

    申请号:US18740415

    申请日:2024-06-11

    CPC classification number: G02B3/0062 B29C39/026 G02B27/4272

    Abstract: A system includes a first chuck operable to support a stencil including a plurality of apertures, a wafer chuck operable to support and move a wafer including a plurality of incoupling gratings, a first light source operable to direct light to impinge on a first surface of the stencil, and one or more second light sources operable to direct light to impinge on the wafer. The system also includes one or more lens and camera assemblies operable to receive light from the first light source passing through the plurality of apertures in the stencil and receive light from the one or more second light sources diffracted from the plurality of incoupling gratings in the wafer. The system also includes an alignment system operable to move the wafer with respect to the stencil to reduce an offset between aperture locations and incoupling grating locations.

    Polymer patterned disk stack manufacturing

    公开(公告)号:US12038591B2

    公开(公告)日:2024-07-16

    申请号:US16909760

    申请日:2020-06-23

    CPC classification number: G02B3/0062 B29C39/026 G02B27/4272

    Abstract: A method of aligning a stencil to an eyepiece wafer includes providing the stencil, positioning the stencil with respect to a first light source, and determining locations of at least two stencil apertures. The method also includes providing the eyepiece wafer. The eyepiece wafer includes at least two eyepiece waveguides, each eyepiece waveguide including an incoupling grating and a corresponding diffraction pattern. The method further includes directing light from one or more second light sources to impinge on each of the corresponding diffraction patterns, imaging light diffracted from each incoupling grating, determining at least two incoupling grating locations, determining offsets between corresponding stencil aperture locations and incoupling grating locations, and aligning the stencil to the eyepiece wafer based on the determined offsets.

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