公开(公告)号：US20170125998A1

公开(公告)日：2017-05-04

申请号：US15336328

申请日：2016-10-27

Applicant: Magneti Marelli S.p.A.

Inventor： Roberto TIZIANI ,  Fabrizio SOGLIO ,  Giovanni Franco GIULIANI

IPC: H02H5/04 ,  H05K1/18 ,  G01K13/00 ,  G01K1/14 ,  G01K7/22

CPC classification number: H02H5/042 ,  G01K1/14 ,  G01K1/16 ,  G01K7/22 ,  G01K13/00 ,  H01L23/34 ,  H01L25/162 ,  H05K1/181

Abstract: It is described an electronic device 1 comprising a temperature detection component 2 and an integrated electronic power component 3, the device being adapted to be mounted on the substrate S.The electronic integrated power component 3 has a first surface portion 31, adapted to be mounted on the substrate S, and a second surface portion 32, opposite to the first surface portion.The temperature detection component 2 comprises two sensor terminals 21, 22, adapted to be connected to the substrate S by means of wire bonding W, and further comprises a temperature sensor 20, configured to detect a temperature T representative of the temperature T3 of the integrated electronic power component 3 and to provide, by means of the two sensor terminals 21, 22, an electrical signal V representative of the detected temperature T.The temperature detection component 2 further comprises an electrically insulating support 23, having a gluing surface 24 glued on said second surface portion 32 of the integrated electronic power component 3.The temperature sensor 20 and the sensor terminals 21, 22 are arranged in a planar configuration on a surface 25 of the support 23 opposite to the gluing surface 24, so that the temperature detection component 2 is superimposed on the integrated electronic power component 3 and so that the temperature sensor 20 and the two sensor terminals 21, 22 are electrically insulated with respect to the integrated electronic power component 3.

公开(公告)号：US20160105997A1

公开(公告)日：2016-04-14

申请号：US14881216

申请日：2015-10-13

Applicant: MAGNETI MARELLI S.P.A.

Inventor： Roberto TIZIANI ,  Enrico TAGLIAFERRI

IPC: H05K7/20

CPC classification number: H05K7/20254 ,  H05K7/20927

Abstract: A liquid cooling system for an electronic component, comprising an exchanger plate having a first wall suitable to be at least partially interfaced to an electronic component to be cooled and a second wall, placed in contact with a cooling liquid, a plurality of heat sink elements, associated to said second wall and influenced by the cooling fluid so as to dissipate heat, wherein the heat sink elements are shaped according to regular patterns that extend parallel to a main extension direction and that comprise a plurality of loops, wherein each loop comprises a continuous curvilinear section that extends cantilevered from a first to a second attachment end fixed to the second wall. Advantageously, the continuous curvilinear section is shaped so that, a first and a second plane being traced perpendicular to the second wall passing respectively through said first and second ends, the continuous curvilinear section extends at least partially outside the space defined between said perpendicular planes.

Abstract translation: 一种用于电子部件的液体冷却系统，包括具有适于至少部分地与要冷却的电子部件接口的第一壁的交换器板和与冷却液接触放置的第二壁，多个散热元件 ，其与所述第二壁相关联并受到冷却流体的影响以散热，其中所述散热元件根据平行于主延伸方向延伸并且包括多个环的规则图案成形，其中每个环包括 连续曲线部分，其从固定到第二壁的第一附接端到第二附接端悬臂延伸。 有利地，连续曲线部分被成形为使得垂直于第二壁跟踪的第一和第二平面分别穿过所述第一和第二端部，所述连续曲线部分至少部分地延伸到在所述垂直平面之间限定的空间的外部。