公开(公告)号：US20090160044A1

公开(公告)日：2009-06-25

申请号：US12343597

申请日：2008-12-24

申请人： Makoto Taniguchi ,  Hideki Kabune ,  Katsunori Tanaka ,  Yukari Tanaka

发明人： Makoto Taniguchi ,  Hideki Kabune ,  Katsunori Tanaka ,  Yukari Tanaka

IPC分类号： H01L23/04 ,  H01L23/48 ,  H01L23/34 ,  H01L23/14

CPC分类号： H01L23/492 ,  H01L23/04 ,  H01L23/3677 ,  H01L23/40 ,  H01L23/433 ,  H01L23/49844 ,  H01L24/16 ,  H01L24/28 ,  H01L24/33 ,  H01L24/35 ,  H01L24/37 ,  H01L24/40 ,  H01L24/73 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/13099 ,  H01L2224/371 ,  H01L2224/37147 ,  H01L2224/37599 ,  H01L2224/40225 ,  H01L2224/73153 ,  H01L2224/73253 ,  H01L2224/83801 ,  H01L2224/84801 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01023 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01058 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/10253 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/1306 ,  H01L2924/13091 ,  H01L2924/16152 ,  H01L2924/19041 ,  H01L2924/19043 ,  H01L2924/00 ,  H01L2224/05599

摘要： The semiconductor module mounting structure includes a semiconductor module including therein a semiconductor device and electrodes exposed to both surfaces thereof, a wiring substrate having a mounting surface on which the semiconductor module is mounted, and a heat radiating body for dissipating heat from the semiconductor module. The wiring substrate is formed with a ground wiring such that at least a part of the ground wiring is exposed to a back surface thereof opposite to the mounting surface. The exposed surface of the ground wiring exposed to the back surface is in thermal contact with the heat radiating body. At least one of the electrodes exposed to one of the both surfaces opposed to the wiring substrate is in electrical contact with the ground wiring through a through hole formed in the wiring substrate.

摘要翻译： 半导体模块安装结构包括其中包括半导体器件和暴露于其两个表面的电极的半导体模块，具有安装半导体模块的安装表面的布线基板和用于从半导体模块散热的散热体。 布线基板形成有接地布线，使得至少一部分接地布线暴露于与安装表面相对的背面。 暴露于后表面的接地布线的暴露表面与散热体热接触。 暴露于与布线基板相对的两个表面中的一个的电极中的至少一个通过形成在布线基板上的通孔与接地布线电接触。

公开(公告)号：US20090134700A1

公开(公告)日：2009-05-28

申请号：US12274445

申请日：2008-11-20

申请人： Katsunori Tanaka ,  Yukari Tanaka ,  Makoto Taniguchi

发明人： Katsunori Tanaka ,  Yukari Tanaka ,  Makoto Taniguchi

IPC分类号： F02P9/00 ,  H02J7/00 ,  B60L1/00

CPC分类号： B62D5/046 ,  H02J7/1423 ,  Y10T307/352

摘要： In a power supply system, a controller is electrically connected with a plurality of switching elements of a multiphase inverter. The controller switches the plurality of switching elements on and off during a multiphase motor being activated. This converts a voltage of a first power storage device into a multiphase AC voltage so as to supply the multiphase AC voltage to the multiphase motor. This also boosts a voltage of a second power storage device to charge the first power storage device by the boosted voltage via multiphase windings of the motor. The controller switches the plurality of switching elements on and off during the multiphase motor being inactivated to thereby boost the voltage of the second power storage device to charge the first power storage device by the boosted voltage.

摘要翻译： 在电源系统中，控制器与多相逆变器的多个开关元件电连接。 控制器在多相电动机被激活期间打开和关闭多个开关元件。 这将第一蓄电装置的电压转换成多相交流电压，以将多相交流电压提供给多相电动机。 这还提高了第二蓄电装置的电压，以通过电动机的多相绕组通过升高的电压对第一蓄电装置充电。 所述控制器在所述多相电机处于非激活状态期间将所述多个开关元件接通和断开，从而提高所述第二蓄电装置的电压，以通过所述升压电压对所述第一蓄电装置充电。