METHODS FOR FORMING COMPOSITE NANOPARTICLE-METAL METALLIZATION CONTACTS ON A SUBSTRATE
    5.
    发明申请
    METHODS FOR FORMING COMPOSITE NANOPARTICLE-METAL METALLIZATION CONTACTS ON A SUBSTRATE 失效
    在基材上形成复合纳米金属金属化接触的方法

    公开(公告)号:US20090239330A1

    公开(公告)日:2009-09-24

    申请号:US12050635

    申请日:2008-03-18

    IPC分类号: H01L21/00

    摘要: A method for forming a contact to a substrate is disclosed. The method includes providing a substrate, the substrate being doped with a first dopant; and diffusing a second dopant into at least a first side of the substrate to form a second dopant region, the first side further including a first side surface area. The method also includes forming a dielectric layer on the first side of the substrate. The method further includes forming a set of composite layer regions on the dielectric layer, wherein each composite layer region of the set of composite layer regions further includes a set of Group IV semiconductor nanoparticles and a set of metal particles. The method also includes heating the set of composite layer regions to a first temperature, wherein at least some composite layer regions of the set of composite layer regions etch through the dielectric layer and form a set of contacts with the second dopant region.

    摘要翻译: 公开了一种用于形成与基板的接触的方法。 所述方法包括提供衬底,所述衬底被掺杂有第一掺杂剂; 并且将第二掺杂剂扩散到所述衬底的至少第一侧中以形成第二掺杂剂区域,所述第一侧还包括第一侧表面区域。 该方法还包括在基板的第一侧上形成介电层。 该方法还包括在电介质层上形成一组复合层区域,其中该组复合层区域的每个复合层区域还包括一组IV族半导体纳米颗粒和一组金属颗粒。 该方法还包括将该组复合层区域加热到第一温度,其中该组复合层区域中的至少一些复合层区域蚀刻通过介电层并与第二掺杂剂区域形成一组接触。

    GROUP IV NANOPARTICLE FLUID
    7.
    发明申请
    GROUP IV NANOPARTICLE FLUID 审中-公开
    第四组纳米流体

    公开(公告)号:US20110012066A1

    公开(公告)日:2011-01-20

    申请号:US12889925

    申请日:2010-09-24

    IPC分类号: H01B1/12

    摘要: A Group IV based nanoparticle fluid is disclosed. The nanoparticle fluid includes a set of nanoparticles-comprising a set of Group IV atoms, wherein the set of nanoparticles is present in an amount of between about 1 wt % and about 20 wt % of the nanoparticle fluid. The nanoparticle fluid also includes a set of HMW molecules, wherein the set of HMW molecules is present in an amount of between about 0 wt % and about 5 wt % of the nanoparticle fluid. The nanoparticle fluid further includes a set of capping agent molecules, wherein at least some capping agent molecules of the set of capping agent molecules are attached to the set of nanoparticles.

    摘要翻译: 公开了基于IV族的纳米颗粒流体。 纳米颗粒流体包括一组纳米颗粒,其包含一组IV族原子,其中所述纳米颗粒组以纳米颗粒流体的约1重量%至约20重量%的量存在。 纳米颗粒流体还包括一组HMW分子,其中该组HMW分子以纳米颗粒流体的约0重量%至约5重量%的量存在。 纳米颗粒流体还包括一组封端剂分子,其中所述一组封端剂分子的至少一些封端剂分子连接到该组纳米颗粒上。

    Methods for forming composite nanoparticle-metal metallization contacts on a substrate
    10.
    发明授权
    Methods for forming composite nanoparticle-metal metallization contacts on a substrate 失效
    在基板上形成复合纳米颗粒金属化接触的方法

    公开(公告)号:US07704866B2

    公开(公告)日:2010-04-27

    申请号:US12050635

    申请日:2008-03-18

    摘要: A method for forming a contact to a substrate is disclosed. The method includes providing a substrate, the substrate being doped with a first dopant; and diffusing a second dopant into at least a first side of the substrate to form a second dopant region, the first side further including a first side surface area. The method also includes forming a dielectric layer on the first side of the substrate. The method further includes forming a set of composite layer regions on the dielectric layer, wherein each composite layer region of the set of composite layer regions further includes a set of Group IV semiconductor nanoparticles and a set of metal particles. The method also includes heating the set of composite layer regions to a first temperature, wherein at least some composite layer regions of the set of composite layer regions etch through the dielectric layer and form a set of contacts with the second dopant region.

    摘要翻译: 公开了一种用于形成与基板的接触的方法。 所述方法包括提供衬底,所述衬底被掺杂有第一掺杂剂; 并且将第二掺杂剂扩散到所述衬底的至少第一侧中以形成第二掺杂剂区域,所述第一侧还包括第一侧表面区域。 该方法还包括在基板的第一侧上形成介电层。 该方法还包括在电介质层上形成一组复合层区域,其中该组复合层区域的每个复合层区域还包括一组IV族半导体纳米颗粒和一组金属颗粒。 该方法还包括将该组复合层区域加热到第一温度,其中该组复合层区域中的至少一些复合层区域蚀刻通过介电层并与第二掺杂剂区域形成一组接触。