公开(公告)号：US20140204975A1

公开(公告)日：2014-07-24

申请号：US14239352

申请日：2012-08-22

申请人： Mamoru Kosakai ,  Kazunori Ishimura ,  Takeshi Watanabe ,  Hitoshi Kouno ,  Ryuuji Hayahara

发明人： Mamoru Kosakai ,  Kazunori Ishimura ,  Takeshi Watanabe ,  Hitoshi Kouno ,  Ryuuji Hayahara

IPC分类号： G01K13/00 ,  H01L21/66

CPC分类号： G01K13/00 ,  H01L21/67248 ,  H01L21/6833 ,  H01L22/12 ,  H01L2924/0002 ,  H05B1/0233 ,  H05B3/265 ,  H05B2203/002 ,  H01L2924/00

摘要： There are provided a plate-shaped body for temperature measurement which, simply by being mounted on a mounting surface of an electrostatic chuck apparatus and without using a semiconductor wafer itself which is a product, is able to easily optimize the in-plane temperature distribution of the mounting surface of the electrostatic chuck apparatus, the temperature rising characteristics, and the cooling characteristics during decreases in temperature, and a temperature measuring apparatus provided with the same. In such a wafer for temperature measurement (plate-shaped body for temperature measurement) (1), an insulating adhesive (3) is bonded to the entirety of a surface (2a) of a wafer (2), a heater element (4) is provided on the insulating adhesive (3), a temperature measurement region (5) is provided used to measure the temperature of the surface (2a) of the wafer (2) in a region excluding the heater element (4) on the surface (3a) of the insulating adhesive (3), and the heater element (4) and the temperature measurement region (5) are coated with an insulating film (6).

摘要翻译： 提供了一种用于温度测量的板状体，其简单地通过安装在静电卡盘装置的安装表面上而不使用作为产品的半导体晶片本身，能够容易地优化面内温度分布 静电吸盘装置的安装面，升温特性以及降温时的冷却特性，以及设置有该温度的温度测定装置。 在这种用于温度测量的晶片（温度测量用板状体）（1））中，绝缘性粘合剂（3）与晶片（2）的表面（2a）的整体，加热元件（4） 设置在绝缘粘合剂（3）上，设置用于测量在表面上的除了加热器元件（4）之外的区域中的晶片（2）的表面（2a）的温度的温度测量区域（5） 绝缘胶（3）的表面（3a），以及加热元件（4）和温度测量区域（5）都涂覆有绝缘膜（6）。

公开(公告)号：US20120281334A1

公开(公告)日：2012-11-08

申请号：US13513380

申请日：2010-12-08

申请人： Yasuharu Sasaki ,  Kenji Masuzawa ,  Toshiyuki Makabe ,  Mamoru Kosakai ,  Takashi Satou ,  Kazunori Ishimura ,  Ryuuji Hayahara ,  Hitoshi Kouno

发明人： Yasuharu Sasaki ,  Kenji Masuzawa ,  Toshiyuki Makabe ,  Mamoru Kosakai ,  Takashi Satou ,  Kazunori Ishimura ,  Ryuuji Hayahara ,  Hitoshi Kouno

IPC分类号： H02N13/00

CPC分类号： H01L21/6831 ,  H01J37/32642 ,  H01J2237/332 ,  H01J2237/338 ,  H01L21/67069 ,  H01L21/67103 ,  H01L21/67109 ,  H01L21/67248

摘要： Disclosed is an electrostatic chuck apparatus which is configured of: an electrostatic chuck section; an annular focus ring section provided to surround the electrostatic chuck section; and a cooling base section which cools the electrostatic chuck section and the focus ring section. The focus ring section is provided with an annular focus ring, an annular heat conducting sheet, an annular ceramic ring, a nonmagnetic heater, and an electrode section that supplies power to the heater.

摘要翻译： 公开了一种静电卡盘装置，其包括：静电卡盘部; 设置成围绕静电吸盘部分的环形聚焦环部分; 以及冷却静电吸盘部和聚焦环部的冷却基部。 聚焦环部分设置有环形聚焦环，环形导热片，环形陶瓷环，非磁性加热器和向加热器供电的电极部分。

公开(公告)号：US08981263B2

公开(公告)日：2015-03-17

申请号：US13513380

申请日：2010-12-08

申请人： Yasuharu Sasaki ,  Kenji Masuzawa ,  Toshiyuki Makabe ,  Mamoru Kosakai ,  Takashi Satou ,  Kazunori Ishimura ,  Ryuuji Hayahara ,  Hitoshi Kouno

发明人： Yasuharu Sasaki ,  Kenji Masuzawa ,  Toshiyuki Makabe ,  Mamoru Kosakai ,  Takashi Satou ,  Kazunori Ishimura ,  Ryuuji Hayahara ,  Hitoshi Kouno

IPC分类号： H05B3/68 ,  C23C16/00 ,  H01L21/683 ,  H01L21/67

CPC分类号： H01L21/6831 ,  H01J37/32642 ,  H01J2237/332 ,  H01J2237/338 ,  H01L21/67069 ,  H01L21/67103 ,  H01L21/67109 ,  H01L21/67248

摘要： Disclosed is an electrostatic chuck apparatus which is configured of: an electrostatic chuck section; an annular focus ring section provided to surround the electrostatic chuck section; and a cooling base section which cools the electrostatic chuck section and the focus ring section. The focus ring section is provided with an annular focus ring, an annular heat conducting sheet, an annular ceramic ring, a nonmagnetic heater, and an electrode section that supplies power to the heater.

摘要翻译： 公开了一种静电卡盘装置，其包括：静电卡盘部; 设置成围绕静电吸盘部分的环形聚焦环部分; 以及冷却静电吸盘部和聚焦环部的冷却基部。 聚焦环部分设置有环形聚焦环，环形导热片，环形陶瓷环，非磁性加热器和向加热器供电的电极部分。

公开(公告)号：US08130499B2

公开(公告)日：2012-03-06

申请号：US12530277

申请日：2008-11-28

申请人： Tohru Ohnishi ,  Hitoshi Kouno ,  Toshiyuki Taniguchi ,  Koji Nakashima ,  Toshiyuki Nakata ,  Tsunetsugu Imanishi ,  Keiichi Nakao

发明人： Tohru Ohnishi ,  Hitoshi Kouno ,  Toshiyuki Taniguchi ,  Koji Nakashima ,  Toshiyuki Nakata ,  Tsunetsugu Imanishi ,  Keiichi Nakao

IPC分类号： H05K7/20

CPC分类号： H01L23/3735 ,  H01L23/053 ,  H01L23/49861 ,  H01L23/645 ,  H01L25/162 ,  H01L2023/4025 ,  H01L2224/45124 ,  H01L2224/48091 ,  H01L2224/73265 ,  H01L2924/19105 ,  H05K1/0201 ,  H05K7/1432 ,  H05K7/209 ,  Y10T29/4935 ,  H01L2924/00014 ,  H01L2924/00

摘要： The present invention relates to a heat dissipation structure board and a module using this heat dissipation structure used for purpose required of high reliability such as a hybrid vehicle or an electric vehicle and to a method of manufacturing the heat dissipation structure. A resin structure is disposed on a lead frame constituting a heat dissipation board and an odd-shaped electronic component or the like mounted on this lead frame or the like to cover up the lead frame and the odd-shaped electronic component or the like, and this resin structure is fixed to a metal plate, a chassis of a device and the like to constitute the heat dissipation structure board as a whole, whereby fixing strengths of fixing the lead frame and the odd-shaped electronic component or the like, a bonding strength at an interface between the lead frame and the heat transfer layer and the like can be reinforced.

摘要翻译： 本发明涉及一种散热结构板和使用这种用于混合动力车辆或电动车辆等可靠性高的目的的散热结构的模块以及制造散热结构的方法。 树脂结构设置在安装在该引线框架等上的构成散热板和异型电子部件等的引线框架上以覆盖引线框架和异型电子部件等，以及 该树脂结构固定在金属板，装置的底盘等上，构成散热结构板整体，由此固定引线框和异型电子部件等的固定强度， 可以增强在引线框架和传热层之间的界面处的强度等。

公开(公告)号：US20100091464A1

公开(公告)日：2010-04-15

申请号：US12530277

申请日：2008-11-28

申请人： Tohru Ohnishi ,  Hitoshi Kouno ,  Toshiyuki Taniguchi ,  Koji Nakashima ,  Toshiyuki Nakata ,  Tsunetsugu Imanishi ,  Keiichi Nakao

发明人： Tohru Ohnishi ,  Hitoshi Kouno ,  Toshiyuki Taniguchi ,  Koji Nakashima ,  Toshiyuki Nakata ,  Tsunetsugu Imanishi ,  Keiichi Nakao

IPC分类号： H05K7/20 ,  B21D53/02

CPC分类号： H01L23/3735 ,  H01L23/053 ,  H01L23/49861 ,  H01L23/645 ,  H01L25/162 ,  H01L2023/4025 ,  H01L2224/45124 ,  H01L2224/48091 ,  H01L2224/73265 ,  H01L2924/19105 ,  H05K1/0201 ,  H05K7/1432 ,  H05K7/209 ,  Y10T29/4935 ,  H01L2924/00014 ,  H01L2924/00

摘要： The present invention relates to a heat dissipation structure board and a module using this heat dissipation structure used for purpose required of high reliability such as a hybrid vehicle or an electric vehicle and to a method of manufacturing the heat dissipation structure. A resin structure is disposed on a lead frame constituting a heat dissipation board and an odd-shaped electronic component or the like mounted on this lead frame or the like to cover up the lead frame and the odd-shaped electronic component or the like, and this resin structure is fixed to a metal plate, a chassis of a device and the like to constitute the heat dissipation structure board as a whole, whereby fixing strengths of fixing the lead frame and the odd-shaped electronic component or the like, a bonding strength at an interface between the lead frame and the heat transfer layer and the like can be reinforced.

摘要翻译： 本发明涉及一种散热结构板和使用这种用于混合动力车辆或电动车辆等可靠性高的目的的散热结构的模块以及制造散热结构的方法。 树脂结构设置在安装在该引线框架等上的构成散热板和异型电子部件等的引线框架上以覆盖引线框架和异型电子部件等，以及 该树脂结构固定在金属板，装置的底盘等上，构成散热结构板整体，由此固定引线框和异型电子部件等的固定强度， 可以增强在引线框架和传热层之间的界面处的强度等。