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公开(公告)号：USD307911S
公开(公告)日：1990-05-15
申请号：US922637
申请日：1986-10-24
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公开(公告)号：USD310189S
公开(公告)日：1990-08-28
申请号：US100136
申请日：1987-09-23
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公开(公告)号：US20150152124A1
公开(公告)日：2015-06-04
申请号：US14406679
申请日：2012-08-31
申请人： Kunio Mori , Yusuke Matsuno , Katsuhito Mori , Takahiro Kudo , Shuukichi Takii , Shigeru Michiwaki , Manabu Miyawaki , Masanori Yanai , Kouichi Kamiyama , Hitomi Chiba , Yasuyuki Masuda
发明人： Kunio Mori , Yusuke Matsuno , Katsuhito Mori , Takahiro Kudo , Shuukichi Takii , Shigeru Michiwaki , Manabu Miyawaki , Masanori Yanai , Kouichi Kamiyama , Hitomi Chiba , Yasuyuki Masuda
IPC分类号： C07F7/18
CPC分类号： C07F7/1804 , Y10T428/31678
摘要： Provided is a surface treatment technique whereby excellent adhering function, excellent reacting function and rich diversity can be established. A surface treatment method that comprises applying a solution containing compound (α) to a substrate and thus providing compound (α) thereon, wherein: said compound (α) has at least an M-OH group and/or a group capable of forming M-OH (wherein M represents a metal atom), an amino group and a triazine ring; one or more said M-OH groups and/or groups capable of forming M-OH (wherein M represents a metal atom) are present; said amino group is bonded to a terminal; one or more said amino groups bonded to the terminal are present; and one or more said triazine rings are present.
摘要翻译： 提供了一种表面处理技术，其具有优异的粘附功能，优异的反应功能和丰富的多样性。 一种表面处理方法，其特征在于，将含有化合物（α）的溶液涂布在基材上，从而在其上提供化合物（α），其中：所述化合物（α）至少具有M-OH基团和/或能够形成M -OH（其中M表示金属原子），氨基和三嗪环; 存在一个或多个所述M-OH基团和/或能够形成M-OH（其中M表示金属原子）的基团; 所述氨基键合到末端; 存在一个或多个与末端键合的所述氨基; 并且存在一个或多个所述三嗪环。
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公开(公告)号：US10385076B2
公开(公告)日：2019-08-20
申请号：US15672145
申请日：2017-08-08
申请人： Kunio Mori , Yusuke Matsuno , Katsuhito Mori , Takahiro Kudo , Shuukichi Takii , Shigeru Michiwaki , Manabu Miyawaki , Masanori Yanai , Kouichi Kamiyama , Hitomi Chiba , Yasuyuki Masuda
发明人： Kunio Mori , Yusuke Matsuno , Katsuhito Mori , Takahiro Kudo , Shuukichi Takii , Shigeru Michiwaki , Manabu Miyawaki , Masanori Yanai , Kouichi Kamiyama , Hitomi Chiba , Yasuyuki Masuda
IPC分类号： C07D251/70 , A61K31/53 , C07F7/18
摘要： A surface treatment agent including a compound (α) is provided. The compound (α) has one or more M-OH groups and/or groups capable of forming M-OH (wherein M represents a metal atom), an amino group and a triazine ring; wherein said amino group is bonded to a terminal; one or more said amino groups bonded to the terminal are present; and one or more said triazine rings are present.
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公开(公告)号：US08753748B2
公开(公告)日：2014-06-17
申请号：US13823526
申请日：2011-09-30
申请人： Kunio Mori , Yusuke Matsuno , Katsuhito Mori , Takahiro Kudo , Shigeru Michiwaki , Manabu Miyawaki
发明人： Kunio Mori , Yusuke Matsuno , Katsuhito Mori , Takahiro Kudo , Shigeru Michiwaki , Manabu Miyawaki
CPC分类号： C23C18/1608 , C23C18/1612 , C23C18/1653 , C23C18/20 , C23C18/204 , C23C18/2086 , C23C18/285 , C23C18/30 , C25D5/56 , C25D11/00 , H05K3/389 , H05K2203/072 , H05K2203/122 , H05K2203/124 , Y10T428/31663 , Y10T428/31678
摘要： The purpose of the present invention is to provide a wiring substrate from which a metal film cannot be detached easily. A process for forming a metal film comprises a step (X) of applying an agent containing a compound (α) onto the surface of a base and a step (Y) of forming a metal film on the surface of the compound (α) by a wet-mode plating technique, wherein the compound (α) is a compound having either an OH group or an OH-generating group, an azide group and a triazine ring per molecule, and the base comprises a polymer.
摘要翻译： 本发明的目的在于提供一种金属膜不容易脱离的布线基板。 形成金属膜的方法包括在化合物（α）的表面上将含有化合物（α）的试剂涂布在基材表面上的步骤（X）和在化合物（α）的表面上形成金属膜的工序（Y） 湿式电镀技术，其中化合物（α）是每分子具有OH基或OH生成基团，叠氮基和三嗪环的化合物，并且碱包含聚合物。
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公开(公告)号：US09790242B2
公开(公告)日：2017-10-17
申请号：US14406679
申请日：2012-08-31
申请人： Kunio Mori , Yusuke Matsuno , Katsuhito Mori , Takahiro Kudo , Shuukichi Takii , Shigeru Michiwaki , Manabu Miyawaki , Masanori Yanai , Kouichi Kamiyama , Hitomi Chiba , Yasuyuki Masuda
发明人： Kunio Mori , Yusuke Matsuno , Katsuhito Mori , Takahiro Kudo , Shuukichi Takii , Shigeru Michiwaki , Manabu Miyawaki , Masanori Yanai , Kouichi Kamiyama , Hitomi Chiba , Yasuyuki Masuda
CPC分类号： C07F7/1804 , Y10T428/31678
摘要： A surface treatment technique having excellent adhering function, excellent reacting function and rich diversity is provided. The surface treatment includes applying a solution containing compound (α) to a substrate and thus providing compound (α) thereon, wherein: the compound (α) is at least one of Formula [IV] and Formula [V]: wherein A is —N(Ra)Rb—Si(Rc)n(ORd)3−n, or —N{Rb—Si(Rc)n(ORd)3−n}2, B is ——N(Re)Rf(NH2)m, or —N{Rf(NH2(m}2, C is A, B, or —N(Rg)Rh, D is Ri and wherein each of Ra, Re, and Rg is independently H or a hydrocarbon group, Rb, Rc, Rd, Rf, Rh, and Ri are hydrocarbon groups, n is 0, 1, or 2, and m is 1 or 2.
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公开(公告)号：US20130183534A1
公开(公告)日：2013-07-18
申请号：US13823526
申请日：2011-09-30
CPC分类号： C23C18/1608 , C23C18/1612 , C23C18/1653 , C23C18/20 , C23C18/204 , C23C18/2086 , C23C18/285 , C23C18/30 , C25D5/56 , C25D11/00 , H05K3/389 , H05K2203/072 , H05K2203/122 , H05K2203/124 , Y10T428/31663 , Y10T428/31678
摘要： The purpose of the present invention is to provide a wiring substrate from which a metal film cannot be detached easily. A process for forming a metal film comprises a step (X) of applying an agent containing a compound (α) onto the surface of a base and a step (Y) of forming a metal film on the surface of the compound (α) by a wet-mode plating technique, wherein the compound (α) is a compound having either an OH group or an OH-generating group, an azide group and a triazine ring per molecule, and the base comprises a polymer.
摘要翻译： 本发明的目的在于提供一种金属膜不容易脱离的布线基板。 形成金属膜的方法包括将含有化合物（α）的试剂施加到基材表面上的步骤（X）和在化合物（α）的表面上形成金属膜的步骤（Y） 湿法电镀技术，其中化合物（α）是每分子具有OH基或OH生成基团，叠氮基和三嗪环的化合物，并且所述碱包含聚合物。
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