公开(公告)号：US20150152124A1

公开(公告)日：2015-06-04

申请号：US14406679

申请日：2012-08-31

申请人： Kunio Mori ,  Yusuke Matsuno ,  Katsuhito Mori ,  Takahiro Kudo ,  Shuukichi Takii ,  Shigeru Michiwaki ,  Manabu Miyawaki ,  Masanori Yanai ,  Kouichi Kamiyama ,  Hitomi Chiba ,  Yasuyuki Masuda

发明人： Kunio Mori ,  Yusuke Matsuno ,  Katsuhito Mori ,  Takahiro Kudo ,  Shuukichi Takii ,  Shigeru Michiwaki ,  Manabu Miyawaki ,  Masanori Yanai ,  Kouichi Kamiyama ,  Hitomi Chiba ,  Yasuyuki Masuda

IPC分类号： C07F7/18

CPC分类号： C07F7/1804 ,  Y10T428/31678

摘要： Provided is a surface treatment technique whereby excellent adhering function, excellent reacting function and rich diversity can be established. A surface treatment method that comprises applying a solution containing compound (α) to a substrate and thus providing compound (α) thereon, wherein: said compound (α) has at least an M-OH group and/or a group capable of forming M-OH (wherein M represents a metal atom), an amino group and a triazine ring; one or more said M-OH groups and/or groups capable of forming M-OH (wherein M represents a metal atom) are present; said amino group is bonded to a terminal; one or more said amino groups bonded to the terminal are present; and one or more said triazine rings are present.

摘要翻译： 提供了一种表面处理技术，其具有优异的粘附功能，优异的反应功能和丰富的多样性。 一种表面处理方法，其特征在于，将含有化合物（α）的溶液涂布在基材上，从而在其上提供化合物（α），其中：所述化合物（α）至少具有M-OH基团和/或能够形成M -OH（其中M表示金属原子），氨基和三嗪环; 存在一个或多个所述M-OH基团和/或能够形成M-OH（其中M表示金属原子）的基团; 所述氨基键合到末端; 存在一个或多个与末端键合的所述氨基; 并且存在一个或多个所述三嗪环。

公开(公告)号：US09790242B2

公开(公告)日：2017-10-17

申请号：US14406679

申请日：2012-08-31

申请人： Kunio Mori ,  Yusuke Matsuno ,  Katsuhito Mori ,  Takahiro Kudo ,  Shuukichi Takii ,  Shigeru Michiwaki ,  Manabu Miyawaki ,  Masanori Yanai ,  Kouichi Kamiyama ,  Hitomi Chiba ,  Yasuyuki Masuda

发明人： Kunio Mori ,  Yusuke Matsuno ,  Katsuhito Mori ,  Takahiro Kudo ,  Shuukichi Takii ,  Shigeru Michiwaki ,  Manabu Miyawaki ,  Masanori Yanai ,  Kouichi Kamiyama ,  Hitomi Chiba ,  Yasuyuki Masuda

IPC分类号： B05D3/02 ,  C07F7/18

CPC分类号： C07F7/1804 ,  Y10T428/31678

摘要： A surface treatment technique having excellent adhering function, excellent reacting function and rich diversity is provided. The surface treatment includes applying a solution containing compound (α) to a substrate and thus providing compound (α) thereon, wherein: the compound (α) is at least one of Formula [IV] and Formula [V]: wherein A is —N(Ra)Rb—Si(Rc)n(ORd)3−n, or —N{Rb—Si(Rc)n(ORd)3−n}2, B is ——N(Re)Rf(NH2)m, or —N{Rf(NH2(m}2, C is A, B, or —N(Rg)Rh, D is Ri and wherein each of Ra, Re, and Rg is independently H or a hydrocarbon group, Rb, Rc, Rd, Rf, Rh, and Ri are hydrocarbon groups, n is 0, 1, or 2, and m is 1 or 2.

公开(公告)号：US10385076B2

公开(公告)日：2019-08-20

申请号：US15672145

申请日：2017-08-08

申请人： Kunio Mori ,  Yusuke Matsuno ,  Katsuhito Mori ,  Takahiro Kudo ,  Shuukichi Takii ,  Shigeru Michiwaki ,  Manabu Miyawaki ,  Masanori Yanai ,  Kouichi Kamiyama ,  Hitomi Chiba ,  Yasuyuki Masuda

发明人： Kunio Mori ,  Yusuke Matsuno ,  Katsuhito Mori ,  Takahiro Kudo ,  Shuukichi Takii ,  Shigeru Michiwaki ,  Manabu Miyawaki ,  Masanori Yanai ,  Kouichi Kamiyama ,  Hitomi Chiba ,  Yasuyuki Masuda

IPC分类号： C07D251/70 ,  A61K31/53 ,  C07F7/18

摘要： A surface treatment agent including a compound (α) is provided. The compound (α) has one or more M-OH groups and/or groups capable of forming M-OH (wherein M represents a metal atom), an amino group and a triazine ring; wherein said amino group is bonded to a terminal; one or more said amino groups bonded to the terminal are present; and one or more said triazine rings are present.

公开(公告)号：US08753748B2

公开(公告)日：2014-06-17

申请号：US13823526

申请日：2011-09-30

申请人： Kunio Mori ,  Yusuke Matsuno ,  Katsuhito Mori ,  Takahiro Kudo ,  Shigeru Michiwaki ,  Manabu Miyawaki

发明人： Kunio Mori ,  Yusuke Matsuno ,  Katsuhito Mori ,  Takahiro Kudo ,  Shigeru Michiwaki ,  Manabu Miyawaki

IPC分类号： C23C18/16 ,  C23C18/20

CPC分类号： C23C18/1608 ,  C23C18/1612 ,  C23C18/1653 ,  C23C18/20 ,  C23C18/204 ,  C23C18/2086 ,  C23C18/285 ,  C23C18/30 ,  C25D5/56 ,  C25D11/00 ,  H05K3/389 ,  H05K2203/072 ,  H05K2203/122 ,  H05K2203/124 ,  Y10T428/31663 ,  Y10T428/31678

摘要： The purpose of the present invention is to provide a wiring substrate from which a metal film cannot be detached easily. A process for forming a metal film comprises a step (X) of applying an agent containing a compound (α) onto the surface of a base and a step (Y) of forming a metal film on the surface of the compound (α) by a wet-mode plating technique, wherein the compound (α) is a compound having either an OH group or an OH-generating group, an azide group and a triazine ring per molecule, and the base comprises a polymer.

摘要翻译： 本发明的目的在于提供一种金属膜不容易脱离的布线基板。 形成金属膜的方法包括在化合物（α）的表面上将含有化合物（α）的试剂涂布在基材表面上的步骤（X）和在化合物（α）的表面上形成金属膜的工序（Y） 湿式电镀技术，其中化合物（α）是每分子具有OH基或OH生成基团，叠氮基和三嗪环的化合物，并且碱包含聚合物。

公开(公告)号：US20130183534A1

公开(公告)日：2013-07-18

申请号：US13823526

申请日：2011-09-30

申请人： Kunio Mori ,  Yusuke Matsuno ,  Takahiro Kudo ,  Shigeru Michiwaki ,  Manabu Miyawaki

发明人： Kunio Mori ,  Yusuke Matsuno ,  Takahiro Kudo ,  Shigeru Michiwaki ,  Manabu Miyawaki

IPC分类号： C23C18/20 ,  C25D11/00

CPC分类号： C23C18/1608 ,  C23C18/1612 ,  C23C18/1653 ,  C23C18/20 ,  C23C18/204 ,  C23C18/2086 ,  C23C18/285 ,  C23C18/30 ,  C25D5/56 ,  C25D11/00 ,  H05K3/389 ,  H05K2203/072 ,  H05K2203/122 ,  H05K2203/124 ,  Y10T428/31663 ,  Y10T428/31678

摘要： The purpose of the present invention is to provide a wiring substrate from which a metal film cannot be detached easily. A process for forming a metal film comprises a step (X) of applying an agent containing a compound (α) onto the surface of a base and a step (Y) of forming a metal film on the surface of the compound (α) by a wet-mode plating technique, wherein the compound (α) is a compound having either an OH group or an OH-generating group, an azide group and a triazine ring per molecule, and the base comprises a polymer.

摘要翻译： 本发明的目的在于提供一种金属膜不容易脱离的布线基板。 形成金属膜的方法包括将含有化合物（α）的试剂施加到基材表面上的步骤（X）和在化合物（α）的表面上形成金属膜的步骤（Y） 湿法电镀技术，其中化合物（α）是每分子具有OH基或OH生成基团，叠氮基和三嗪环的化合物，并且所述碱包含聚合物。

公开(公告)号：US09540403B2

公开(公告)日：2017-01-10

申请号：US14954147

申请日：2015-11-30

申请人： Kunio Mori ,  Yusuke Matsuno ,  Katsuhito Mori ,  Takahiro Kudo

发明人： Kunio Mori ,  Yusuke Matsuno ,  Katsuhito Mori ,  Takahiro Kudo

IPC分类号： C07F7/08 ,  C08K5/3492 ,  C08K5/544 ,  C07D215/54 ,  C07F7/18 ,  C07F5/06 ,  C09J5/00 ,  C07D251/54

CPC分类号： C07F7/0814 ,  C07D251/54 ,  C07F5/068 ,  C07F7/1804 ,  C08K5/3492 ,  C08K5/5442 ,  C09J5/00 ,  C09J2205/31 ,  C09J2483/00 ,  Y10T428/31536

摘要： To provide a technique by which an —OH group can be effectively formed on a material surface for the purpose of making the material suitable for bonding (for example, for molecular bonding) that utilizes a chemical reaction (chemical binding). [Solution] A bonding method for bonding a substrate A and a substrate B, which comprises: a step for applying an agent that contains the compound (α) described below on the surface of the substrate A; a step for arranging the substrate B so as to face the compound (α) that is present on the surface of the substrate A; and a step for integrally bonding the substrate A and the substrate B by applying a force onto the substrate A and/or the substrate B. The compound (α) is a compound that has an OH group or an OH-forming group, an azide group and a triazine ring in each molecule, and the substrate A is configured using a polymer.

摘要翻译： 为了提供一种可以在材料表面上有效形成-OH基团的技术，其目的在于使材料适合于利用化学反应（化学结合）的结合（例如，用于分子键合）。 [解决方案]接合基板A和基板B的接合方法，其包括：在基板A的表面上涂覆含有下述化合物（α）的试剂的工序; 将基板B配置成与基板A的表面上存在的化合物（α）相对的步骤; 以及通过对基板A和/或基板B施加力将基板A和基板B一体接合的步骤。化合物（α）是具有OH基或OH形成基的化合物，叠氮化物 基团和三嗪环，并且基材A使用聚合物构成。

公开(公告)号：US09238757B2

公开(公告)日：2016-01-19

申请号：US13823759

申请日：2011-09-28

申请人： Kunio Mori ,  Yusuke Matsuno ,  Katsuhito Mori ,  Takahiro Kudo

发明人： Kunio Mori ,  Yusuke Matsuno ,  Katsuhito Mori ,  Takahiro Kudo

IPC分类号： C09J5/00 ,  C07F7/18 ,  C07F5/06

CPC分类号： C07F7/0814 ,  C07D251/54 ,  C07F5/068 ,  C07F7/1804 ,  C08K5/3492 ,  C08K5/5442 ,  C09J5/00 ,  C09J2205/31 ,  C09J2483/00 ,  Y10T428/31536

摘要： To provide a technique by which an —OH group can be effectively formed on a material surface for the purpose of making the material suitable for bonding (for example, for molecular bonding) that utilizes a chemical reaction (chemical binding). [Solution] A bonding method for bonding a substrate A and a substrate B, which comprises: a step for applying an agent that contains the compound (α) described below on the surface of the substrate A; a step for arranging the substrate B so as to face the compound (α) that is present on the surface of the substrate A; and a step for integrally bonding the substrate A and the substrate B by applying a force onto the substrate A and/or the substrate B. The compound (α) is a compound that has an OH group or an OH-forming group, an azide group and a triazine ring in each molecule, and the substrate A is configured using a polymer.

摘要翻译： 为了提供一种可以在材料表面上有效形成-OH基团的技术，其目的在于使材料适合于利用化学反应（化学结合）的结合（例如，用于分子键合）。 [解决方案]接合基板A和基板B的接合方法，其包括：在基板A的表面上涂覆含有下述化合物（α）的试剂的工序; 将基板B配置成与基板A的表面上存在的化合物（α）相对的步骤; 以及通过对基板A和/或基板B施加力将基板A和基板B一体接合的步骤。化合物（α）是具有OH基或OH形成基的化合物，叠氮化物 基团和三嗪环，并且基材A使用聚合物构成。

公开(公告)号：US20130177770A1

公开(公告)日：2013-07-11

申请号：US13823759

申请日：2011-09-28

申请人： Kunio Mori ,  Yusuke Matsuno ,  Katsuhito Mori ,  Takahiro Kudo

发明人： Kunio Mori ,  Yusuke Matsuno ,  Katsuhito Mori ,  Takahiro Kudo

IPC分类号： C09J5/00

CPC分类号： C07F7/0814 ,  C07D251/54 ,  C07F5/068 ,  C07F7/1804 ,  C08K5/3492 ,  C08K5/5442 ,  C09J5/00 ,  C09J2205/31 ,  C09J2483/00 ,  Y10T428/31536

摘要： To provide a technique by which an —OH group can be effectively formed on a material surface for the purpose of making the material suitable for bonding (for example, for molecular bonding) that utilizes a chemical reaction (chemical binding). [Solution] A bonding method for bonding a substrate A and a substrate B, which comprises: a step for applying an agent that contains the compound (α) described below on the surface of the substrate A; a step for arranging the substrate B so as to face the compound (α) that is present on the surface of the substrate A; and a step for integrally bonding the substrate A and the substrate B by applying a force onto the substrate A and/or the substrate B. The compound (α) is a compound that has an OH group or an OH-forming group, an azide group and a triazine ring in each molecule, and the substrate A is configured using a polymer.

摘要翻译： 为了提供一种可以在材料表面上有效形成-OH基团的技术，其目的在于使材料适合于利用化学反应（化学结合）的结合（例如，用于分子键合）。 [方案]一种用于接合基板A和基板B的接合方法，其包括：在基板A的表面上涂覆含有下述化合物（α）的试剂的步骤; 将基板B布置成面向存在于基板A的表面上的化合物（a）的步骤; 以及通过对基板A和/或基板B施加力使基板A和基板B一体接合的步骤。化合物（α）是具有OH基或OH形成基的化合物，叠氮化物 基团和三嗪环，并且基材A使用聚合物构成。

公开(公告)号：US20110104505A1

公开(公告)日：2011-05-05

申请号：US12999213

申请日：2009-06-04

申请人： Kunio Mori ,  Yusuke Matsuno

发明人： Kunio Mori ,  Yusuke Matsuno

IPC分类号： B32B7/12 ,  B32B15/06 ,  B32B25/04 ,  B32B37/12

CPC分类号： B32B7/12 ,  B32B15/06 ,  B32B15/08 ,  B32B25/04 ,  B32B25/14 ,  B32B27/06 ,  B32B27/32 ,  C09J121/02 ,  H05K3/386 ,  H05K3/389 ,  H05K2201/0133 ,  Y10T428/31663

摘要： Provided is a laminated body which solves, all at once, the issues of conventional methods, such as adhesiveness to a board having low surface roughness, stress concentration relaxing, reliability improvement, high adhesiveness (especially, that of a conductor layer), heat resistance, almighty characteristics (being adherable irrespective of the type of an adhesive), in manufacture of laminated bodies. The laminated body is formed by having an entropically elastic molecular adhesive layer between two boards, and the entropically elastic molecular adhesive layer is composed of an entropically elastic material layer, and a layer of a molecular adhesive having a group which can be bonded to the entropically elastic material layer.

摘要翻译： 提供一种能够一次解决诸如对具有低表面粗糙度的板的粘合性，应力集中放松，可靠性改进，高粘合性（特别是导体层的粘合性），耐热性的常规方法的问题的层压体 全能的特性（与粘合剂的类型无关）可以粘合在层压体的制造中。 层叠体通过在两个板之间具有弹性分子粘合剂层而形成，并且该弹性分子粘合剂层由具有弹性的材料层构成，并且具有可以与熵共聚的基团的分子粘合剂层 弹性材料层。

公开(公告)号：US09593423B2

公开(公告)日：2017-03-14

申请号：US14218670

申请日：2014-03-18

申请人： Kunio Mori ,  Sulfur Chemical Laboratory Incorporated ,  Meiko Electronics Co., Ltd.

发明人： Kunio Mori ,  Yusuke Matsuno ,  Katsuhito Mori ,  Takahiro Kudo ,  Shigeru Michiwaki ,  Manabu Miyawaki

IPC分类号： C23C18/20 ,  C23C18/16 ,  C25D11/00 ,  C25D5/56 ,  C23C18/28 ,  C23C18/30 ,  H05K3/38

CPC分类号： C23C18/1608 ,  C23C18/1612 ,  C23C18/1653 ,  C23C18/20 ,  C23C18/204 ,  C23C18/2086 ,  C23C18/285 ,  C23C18/30 ,  C25D5/56 ,  C25D11/00 ,  H05K3/389 ,  H05K2203/072 ,  H05K2203/122 ,  H05K2203/124 ,  Y10T428/31663 ,  Y10T428/31678

摘要： The purpose of the present invention is to provide a wiring substrate from which a metal film cannot be detached easily. A process for forming a metal film comprises a step (X) of applying an agent containing a compound (α) onto the surface of a base and a step (Y) of forming a metal film on the surface of the compound (α) by a wet-mode plating technique, wherein the compound (α) is a compound having either an OH group or an OH-generating group, an azide group and a triazine ring per molecule, and the base comprises a polymer.

摘要翻译： 本发明的目的在于提供一种金属膜不容易脱离的布线基板。 形成金属膜的方法包括在化合物（α）的表面上将含有化合物（α）的试剂涂布在基材表面上的步骤（X）和在化合物（α）的表面上形成金属膜的工序（Y） 湿式电镀技术，其中化合物（α）是每分子具有OH基或OH生成基团，叠氮基和三嗪环的化合物，并且碱包含聚合物。