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    Electronic device package, electronic device, and electronic apparatus
    1.
    发明授权
    Electronic device package, electronic device, and electronic apparatus 有权
    电子设备封装，电子设备和电子设备

    公开(公告)号：US08804316B2

    公开(公告)日：2014-08-12

    申请号：US13539982

    申请日：2012-07-02

    申请人： Manabu Shiraki ,  Tadanori Yamada ,  Kazumi Hara ,  Kazuhiko Shimodaira

    发明人： Manabu Shiraki ,  Tadanori Yamada ,  Kazumi Hara ,  Kazuhiko Shimodaira

    IPC分类号： H05K7/00 ,  H05K5/00 ,  H01L23/28 ,  H05K7/14

    CPC分类号： G01C19/5783 ,  H01L2224/16225

    摘要： A package includes a base member and a lid member joined to the base member while forming, between the lid and base members, an internal space which stores an electronic component. A joined section of the base and lid members includes a first welded section formed by joining the base and lid members along an x axis direction using seam welding and a second welded section formed by joining the base and lid members along a y axis direction using the seam welding. In plan view, the first and second welded sections do not overlap each other. An area where an area formed by extending the first welded section in the x axis direction and an area formed by extending the second welded section in the y axis direction overlap each other is located on the outer side with respect to the contour of the lid member.

    摘要翻译： 一种包装盒，其包括基部构件和盖构件，该盖构件在盖和基座构件之间形成存储电子部件的内部空间。 基部和盖部件的接合部分包括通过使用接缝焊接沿x轴方向接合基部和盖部件而形成的第一焊接部分和通过使用接缝将基部和盖部件沿着y轴方向接合而形成的第二焊接部分 焊接。 在平面图中，第一和第二焊接部分彼此不重叠。 通过使第一焊接部沿x轴方向延伸而形成的区域和通过使第二焊接部沿y轴方向延伸而形成的区域彼此重叠的区域位于相对于盖部件的轮廓的外侧 。

    Semiconductor device and manufacturing method thereof
    3.
    发明授权
    Semiconductor device and manufacturing method thereof 有权
    半导体装置及其制造方法

    公开(公告)号：US09431326B2

    公开(公告)日：2016-08-30

    申请号：US13984971

    申请日：2012-03-30

    申请人： Toshio Denta ,  Tadanori Yamada ,  Eiji Mochizuki

    发明人： Toshio Denta ,  Tadanori Yamada ,  Eiji Mochizuki

    IPC分类号： H01L23/495 ,  H01L25/07 ,  H01L21/50 ,  H01L23/31 ,  H01L25/16

    CPC分类号： H01L23/495 ,  H01L21/50 ,  H01L23/3107 ,  H01L23/49537 ,  H01L25/072 ,  H01L25/165 ,  H01L2224/4903 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/00

    摘要： In a semiconductor device, semiconductor chips and lead frames are soldered at the same time on an insulating circuit board by one reflow soldering, and the positions of the externally led out lead frames undergo no change. In manufacturing the semiconductor device, after power semiconductor chips and control ICs are mounted on an insulating circuit board, and lead frames are disposed thereon, the semiconductor chips and lead frames are soldered at the same time on the insulating circuit board by one reflow soldering. Furthermore, after a primary bending work is carried out on the lead frames, and a terminal case is mounted over the insulating circuit board, a secondary bending work is carried out on the lead frames.

    摘要翻译： 在半导体装置中，半导体芯片和引线框架通过一次回流焊接同时在绝缘电路板上焊接，并且外部引出引线框架的位置不发生变化。 在制造半导体器件时，将功率半导体芯片和控制IC安装在绝缘电路板上，并且引线框架设置在其上，半导体芯片和引线框架通过一次回流焊接同时焊接在绝缘电路板上。 此外，在引线框架上进行一次弯曲加工之后，在绝缘电路板上安装端子壳体，在引线框架上进行二次弯曲加工。

    SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
    4.
    发明申请
    SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF 有权
    半导体器件及其制造方法

    公开(公告)号：US20130334672A1

    公开(公告)日：2013-12-19

    申请号：US13984971

    申请日：2012-03-30

    申请人： Toshio Denta ,  Tadanori Yamada ,  Eiji Mochizuki

    发明人： Toshio Denta ,  Tadanori Yamada ,  Eiji Mochizuki

    IPC分类号： H01L23/495 ,  H01L21/50

    CPC分类号： H01L23/495 ,  H01L21/50 ,  H01L23/3107 ,  H01L23/49537 ,  H01L25/072 ,  H01L25/165 ,  H01L2224/4903 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/00

    摘要： In a semiconductor device, semiconductor chips and lead frames are soldered at the same time on an insulating circuit board by one reflow soldering, and the positions of the externally led out lead frames undergo no change. In manufacturing the semiconductor device, after power semiconductor chips and control ICs are mounted on an insulating circuit board, and lead frames are disposed thereon, the semiconductor chips and lead frames are soldered at the same time on the insulating circuit board by one reflow soldering. Furthermore, after a primary bending work is carried out on the lead frames, and a terminal case is mounted over the insulating circuit board, a secondary bending work is carried out on the lead frames.

    摘要翻译： 在半导体装置中，半导体芯片和引线框架通过一次回流焊接同时在绝缘电路板上焊接，并且外部引出引线框架的位置不发生变化。 在制造半导体器件时，将功率半导体芯片和控制IC安装在绝缘电路板上，并且引线框架设置在其上，半导体芯片和引线框架通过一次回流焊接同时焊接在绝缘电路板上。 此外，在引线框架上进行一次弯曲加工之后，在绝缘电路板上安装端子壳体，在引线框架上进行二次弯曲加工。