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公开(公告)号：US08804316B2
公开(公告)日：2014-08-12
申请号：US13539982
申请日：2012-07-02
CPC分类号： G01C19/5783 , H01L2224/16225
摘要： A package includes a base member and a lid member joined to the base member while forming, between the lid and base members, an internal space which stores an electronic component. A joined section of the base and lid members includes a first welded section formed by joining the base and lid members along an x axis direction using seam welding and a second welded section formed by joining the base and lid members along a y axis direction using the seam welding. In plan view, the first and second welded sections do not overlap each other. An area where an area formed by extending the first welded section in the x axis direction and an area formed by extending the second welded section in the y axis direction overlap each other is located on the outer side with respect to the contour of the lid member.
摘要翻译： 一种包装盒，其包括基部构件和盖构件，该盖构件在盖和基座构件之间形成存储电子部件的内部空间。 基部和盖部件的接合部分包括通过使用接缝焊接沿x轴方向接合基部和盖部件而形成的第一焊接部分和通过使用接缝将基部和盖部件沿着y轴方向接合而形成的第二焊接部分 焊接。 在平面图中，第一和第二焊接部分彼此不重叠。 通过使第一焊接部沿x轴方向延伸而形成的区域和通过使第二焊接部沿y轴方向延伸而形成的区域彼此重叠的区域位于相对于盖部件的轮廓的外侧 。
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公开(公告)号：US07576476B2
公开(公告)日：2009-08-18
申请号：US11727151
申请日：2007-03-23
申请人： Yugo Koyama , Kazuhiko Shimodaira
发明人： Yugo Koyama , Kazuhiko Shimodaira
IPC分类号： H01L41/08
CPC分类号： H03H9/0552 , H01L24/73 , H01L2924/01005 , H01L2924/01006 , H01L2924/0102 , H01L2924/01029 , H01L2924/01033 , H01L2924/01074 , H01L2924/01079 , H01L2924/07802 , H01L2924/12042 , H01L2924/14 , H01L2924/181 , H03H3/02 , H03H9/1021 , H01L2924/00
摘要： A piezoelectric device includes: a substrate having an electrode terminal portion on an upper surface thereof; an electronic part arranged on an upper side of the substrate; and a piezoelectric resonator arranged on an upper side of the electronic part, wherein a surface of the electronic part opposite to a surface having a pad portion is bonded to a lower surface of the piezoelectric resonator having an external terminal portion and the pad portion of the electronic part and the external terminal portion of the piezoelectric resonator are wire-bonded to each other, and wherein the surface of the electronic part having the pad portion is mounted face down on the upper surface of the substrate.
摘要翻译： 一种压电器件，包括：在其上表面上具有电极端子部分的衬底; 设置在所述基板的上侧的电子部件; 以及布置在电子部件的上侧的压电谐振器，其中与具有焊盘部分的表面相对的电子部件的表面接合到具有外部端子部分的压电谐振器的下表面，并且焊盘部分 电子部件和压电谐振器的外部端子部分彼此线接合，并且其中具有焊盘部分的电子部件的表面朝下安装在基板的上表面上。
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3.发明授权
公开(公告)号：US5745012A
公开(公告)日：1998-04-28
申请号：US785299
申请日：1997-01-21
IPC分类号： H01L21/60 , H01L23/50 , H03B1/00 , H03B5/12 , H03B5/32 , H03B5/36 , H03H9/02 , H03H9/05 , H01L41/053
CPC分类号： H03H9/0542 , H03B5/32 , H01L2224/45144 , H01L2224/48091 , H01L2224/48247 , H01L2224/49171 , H01L2924/01079 , H01L2924/14 , H01L2924/19041 , H03B2201/0208 , H03B2201/0291 , H03B5/368 , H03J2200/10 , Y10T29/42
摘要： A voltage-controlled oscillator is provided having a semiconductor integrated circuit and a piezoelectric resonator. A variable-capacitance diode may be connected in series with the piezoelectric resonator. The variable-capacitance diode may be further mounted a land of a lead frame. The piezoelectric resonator, variable-capacitance diode and lead frame may be resin molded into a single unit. In operation, a signal may be applied to a node located between the variable-capacitance diode and the DC-cutting capacitor.
摘要翻译： 提供了具有半导体集成电路和压电谐振器的压控振荡器。 可变电容二极管可以与压电谐振器串联连接。 变容二极管可以进一步安装在引线框架的平台上。 压电谐振器，可变电容二极管和引线框架可以树脂模制成单个单元。 在操作中，可以向位于可变电容二极管和直流切割电容器之间的节点施加信号。
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公开(公告)号：US07969072B2
公开(公告)日：2011-06-28
申请号：US12568012
申请日：2009-09-28
IPC分类号： H01L41/053
CPC分类号： B29C39/10 , H01L2224/73265 , H03H9/0547 , H03H9/1021
摘要： An electronic device includes: a package including a lid and a package base, the package being formed by bonding the lid to a joint surface of the package base using a bonding material; and a resin portion covering the package. The resin portion covers at least the package base and the bonding material, and at least a part of the resin portion has a section outline. The section outline has an outermost portion thereof in a direction parallel with a mount surface of the electronic device. The outermost portion is located below a lower surface of the lid in a direction perpendicular to the mount surface of the electronic device.
摘要翻译： 一种电子设备，包括：具有盖和封装基座的封装，所述封装通过使用接合材料将盖结合到封装基座的接合表面而形成; 以及覆盖所述包装的树脂部分。 树脂部分至少覆盖封装基部和接合材料，并且树脂部分的至少一部分具有截面轮廓。 截面轮廓具有与电子装置的安装表面平行的方向的最外侧部分。 最外面部分位于与电子装置的安装表面垂直的方向上的盖的下表面下方。
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公开(公告)号：US20060022319A1
公开(公告)日：2006-02-02
申请号：US11188766
申请日：2005-07-26
IPC分类号： H01L31/0203
CPC分类号： H01L23/10 , H01L2924/0002 , H01L2924/01079 , H01L2924/00
摘要： An airtight package has an insulating base having an opening approximately in the center and a recessed portion penetrating the insulating base in a thickness direction on a circumferential surface of the insulating base. The airtight package also has a lid sealed against the insulating base so as to block the opening. The lid is bonded to the insulating base in a manner that an edge of the lid overlaps the recessed portion exposed on an opening-side surface of the insulating base.
摘要翻译： 气密包装具有绝缘基部，其绝缘基部具有大致中心的开口，以及在绝缘基底的圆周表面上沿着厚度方向穿透绝缘基底的凹部。 气密包装还具有密封在绝缘基底上的盖子，从而阻挡开口。 盖以绝缘基底的开口侧表面露出的凹部重叠的方式接合到绝缘基底。
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6.发明授权公开(公告)号：US07429814B2
公开(公告)日：2008-09-30
申请号：US10278971
申请日：2002-10-24
申请人： Kazuhiko Shimodaira
发明人： Kazuhiko Shimodaira
IPC分类号： H01L41/053
CPC分类号： H03H9/0542
摘要： The invention provides a piezoelectric resonator device having excellent frequency accuracy and aging characteristics. The piezoelectric resonator element can be packaged in an exclusive hollow space formed in the package in advance to packaging an IC chip. After mounting a lid on the opening of the hollow space while the hollow space is in communication with an external atmosphere, the external conduit is shut in vacuum and the hollow space for packaging the resonator element is tightly sealed, and an IC chip is packaged after an optimality discrimination treatment of the piezoelectric resonator element. The piezoelectric resonator element is formed into a tuning fork type resonator element, and the lid is made of a glass. The conduit to the external atmosphere is shielded by embedding with a gold base material to capture the materials scattered by frequency adjustment of the piezoelectric resonator element.
摘要翻译： 本发明提供了具有优异的频率精度和老化特性的压电谐振器装置。 压电谐振元件可以预先封装在封装中形成的专用中空空间中以封装IC芯片。 在中空空间与外部大气连通的同时将盖子安装在中空空间的开口上时，外部管道在真空中闭合，并且用于封装谐振元件的中空空间被密封，并且在IC封装之后封装IC芯片 压电谐振器元件的最佳判别处理。 压电谐振元件形成为音叉式谐振器元件，盖由玻璃制成。 通过嵌入金基材料来遮蔽外部大气的导管，以通过压电谐振元件的频率调节来捕获散射的材料。
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7.发明授权公开(公告)号：US07408291B2
公开(公告)日：2008-08-05
申请号：US11471710
申请日：2006-06-21
IPC分类号： H01L41/22 , H01L41/053 , H01L41/04 , H03H9/02
CPC分类号： H03H9/1014 , H01L2224/48091 , H01L2224/48247 , H01L2224/49109 , H01L2924/01077 , H01L2924/01078 , H01L2924/1532 , H01L2924/181 , H01L2924/19041 , H03H9/0547 , H03H9/1021 , H01L2924/00014 , H01L2924/00 , H01L2924/00012
摘要： To provide a piezoelectric oscillator which can be reduced in size by reducing the planar size. With regard to a layered lead frame comprising two lead frames and, connection leads for connection with a piezoelectric resonator are formed on the upper lead frame and the connection leads are erected upwards so as to form connection terminals, and mounting leads for mounting to a mounting board are formed on the lower lead frame and the mounting leads are erected downwards so as to form mounting terminals, and an IC forming an oscillating circuit is mounted on the layered lead frame, the piezoelectric resonator formed by sealing a piezoelectric resonator element within a package is mounted on the layered lead frame, and the layered lead frame and the piezoelectric resonator are sealed within a resin package such that the principal surface of the mounting terminals are exposed outwards, thereby forming a completed article.
摘要翻译： 提供一种通过减小平面尺寸可以减小尺寸的压电振荡器。 关于包括两个引线框架的分层引线框架，并且在上引线框架上形成用于与压电谐振器连接的连接引线，并且连接引线竖立在上方，以形成连接端子，以及用于安装到安装件的安装引线 板形成在下引线框架上，并且安装引线向下竖立以形成安装端子，并且形成振荡电路的IC安装在分层引线框架上，压电谐振器通过将压电谐振元件密封在封装 安装在分层引线框架上，层叠引线框架和压电谐振器被密封在树脂封装内，使得安装端子的主表面向外露出，从而形成完整的物品。
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8.发明授权公开(公告)号：US07218036B2
公开(公告)日：2007-05-15
申请号：US10865970
申请日：2004-06-14
IPC分类号： H01L41/08
CPC分类号： H03B5/36 , H01L2224/05554 , H01L2224/48091 , H01L2224/49171 , H01L2924/181 , H03H9/0552 , H03H9/1021 , H03H9/21 , H03H2003/0492 , H01L2924/00012 , H01L2924/00014
摘要： The invention provides a piezoelectric oscillator that allows for fine adjustment of the frequency after resin molding, a manufacturing method therefor, and a mobile phone and an electronic apparatus using the piezoelectric oscillator. The piezoelectric oscillator can include a resonator package, in which a piezoelectric resonator element is housed, and a semiconductor device, in which an oscillation circuit that is electrically connected to the resonator package is incorporated. The resonator package and the semiconductor device can be fixed to corresponding different surfaces of an island portion of a lead frame, and resin molding is performed so that a transparent lid of the resonator package is exposed to the outside.
摘要翻译： 本发明提供了一种压电振荡器，其允许在树脂模制之后的频率的精细调整，其制造方法以及使用压电振荡器的移动电话和电子设备。 压电振荡器可以包括其中容纳压电谐振元件的谐振器封装，以及其中结合有电连接到谐振器封装的振荡电路的半导体器件。 谐振器封装和半导体器件可以固定到引线框架的岛部分的对应的不同表面，并且执行树脂模制，使得谐振器封装的透明盖暴露于外部。
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9.发明申请公开(公告)号：US20060238080A1
公开(公告)日：2006-10-26
申请号：US11471710
申请日：2006-06-21
IPC分类号： H01L41/053
CPC分类号： H03H9/1014 , H01L2224/48091 , H01L2224/48247 , H01L2224/49109 , H01L2924/01077 , H01L2924/01078 , H01L2924/1532 , H01L2924/181 , H01L2924/19041 , H03H9/0547 , H03H9/1021 , H01L2924/00014 , H01L2924/00 , H01L2924/00012
摘要： To provide a piezoelectric oscillator which can be reduced in size by reducing the planar size. With regard to a layered lead frame comprising two lead frames and, connection leads for connection with a piezoelectric resonator are formed on the upper lead frame and the connection leads are erected upwards so as to form connection terminals, and mounting leads for mounting to a mounting board are formed on the lower lead frame and the mounting leads are erected downwards so as to form mounting terminals, and an IC forming an oscillating circuit is mounted on the layered lead frame, the piezoelectric resonator formed by sealing a piezoelectric resonator element within a package is mounted on the layered lead frame, and the layered lead frame and the piezoelectric resonator are sealed within a resin package such that the principal surface of the mounting terminals are exposed outwards, thereby forming a completed article.
摘要翻译： 提供一种通过减小平面尺寸可以减小尺寸的压电振荡器。 关于包括两个引线框架的分层引线框架，并且在上引线框架上形成用于与压电谐振器连接的连接引线，并且连接引线竖立在上方，以形成连接端子，以及用于安装到安装件的安装引线 板形成在下引线框架上，并且安装引线向下竖立以形成安装端子，并且形成振荡电路的IC安装在分层引线框架上，压电谐振器通过将压电谐振元件密封在封装 安装在分层引线框架上，层叠引线框架和压电谐振器被密封在树脂封装内，使得安装端子的主表面向外露出，从而形成完整的物品。
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公开(公告)号：US07123107B2
公开(公告)日：2006-10-17
申请号：US10729010
申请日：2003-12-08
IPC分类号： H03B1/00
CPC分类号： H03H9/1014 , H01L2224/48091 , H01L2224/48247 , H01L2224/49109 , H01L2924/01077 , H01L2924/01078 , H01L2924/1532 , H01L2924/181 , H01L2924/19041 , H03H9/0547 , H03H9/1021 , H01L2924/00014 , H01L2924/00 , H01L2924/00012
摘要： To provide a piezoelectric oscillator which can be reduced in size by reducing the planar size. With regard to a layered lead frame comprising two lead frames and, connection leads for connection with a piezoelectric resonator are formed on the upper lead frame and the connection leads are erected upwards so as to form connection terminals, and mounting leads for mounting to a mounting board are formed on the lower lead frame and the mounting leads are erected downwards so as to form mounting terminals, and an IC forming an oscillating circuit is mounted on the layered lead frame, the piezoelectric resonator formed by sealing a piezoelectric resonator element within a package is mounted on the layered lead frame, and the layered lead frame and the piezoelectric resonator are sealed within a resin package such that the principal surface of the mounting terminals are exposed outwards, thereby forming a completed article.
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