公开(公告)号：US06357888B1

公开(公告)日：2002-03-19

申请号：US09401806

申请日：1999-09-22

申请人： Manabu Takata ,  Takayoshi Tanabe

发明人： Manabu Takata ,  Takayoshi Tanabe

IPC分类号： F21V704

CPC分类号： G02B6/0053

摘要： A surface illuminant device includes a surface illuminant having a light distribution characteristic with no directivity relative to specific directions, and a prism sheet having a plurality of prisms each having a predetermined apical angle. The prism sheet is placed on the light emission side of the surface illuminant. One side of the prism sheet on which a plurality of prisms are placed is opposite to the light emission side of the surface illuminant. Accordingly, light can be emitted in a plurality of specific directions in concentrative manner to enhance luminance in that plurality of directions. Further, the surface illuminant device includes an optical sheet which condenses the incident light. In the luminance distribution (light distribution characteristic) thus obtained, the luminance gently decreases in the vicinity of the directions in which light is emitted in concentrative manner.

摘要翻译： 表面发光器件包括具有相对于特定方向没有方向性的光分布特性的表面发光体，以及具有各自具有预定顶角的多个棱镜的棱镜片。 棱镜片放置在表面光源的发光侧。 配置有多个棱镜的棱镜片的一侧与表面光源的发光侧相反。 因此，能够以多个特定方向发光，以提高多个方向的亮度。 此外，表面光源装置包括冷凝入射光的光学片。 在这样得到的亮度分布（配光特性）中，在以集中方式发光的方向附近，亮度缓慢降低。

公开(公告)号：US07759224B2

公开(公告)日：2010-07-20

申请号：US12170020

申请日：2008-07-09

申请人： Chuichi Miyazaki ,  Yoshiyuki Abe ,  Toshihide Uematsu ,  Minoru Kimura ,  Kazunari Suzuki ,  Masao Odagiri ,  Hideyuki Suga ,  Manabu Takata

发明人： Chuichi Miyazaki ,  Yoshiyuki Abe ,  Toshihide Uematsu ,  Minoru Kimura ,  Kazunari Suzuki ,  Masao Odagiri ,  Hideyuki Suga ,  Manabu Takata

IPC分类号： H01L21/00

CPC分类号： H01L21/6835 ,  H01L21/02238 ,  H01L21/02255 ,  H01L21/30625 ,  H01L21/314 ,  H01L21/31654 ,  H01L21/31675 ,  H01L21/6836 ,  H01L21/78 ,  H01L2221/68327 ,  H01L2221/6834

摘要： A technique capable of stably releasing chips from a dicing tape, includes grinding a back surface of a semiconductor wafer, while adhering a pressure sensitive adhesive tape to a circuit forming surface of the semiconductor wafer formed with an integrated circuit, to achieve a predetermined thickness and forcibly oxidizing the back surface of the semiconductor wafer. Then, the pressure sensitive adhesive tape adhered to the circuit forming surface of the semiconductor wafer is released, and a dicing tape is adhered to the back surface of the semiconductor wafer. Further, the semiconductor wafer is divided by dicing it into individual chips, and then the back surface of the chip is pressed by way of the dicing tape, thereby releasing the chips from the dicing tape.

摘要翻译： 一种能够从切割带稳定地释放芯片的技术包括：将压敏粘合带粘附到形成有集成电路的半导体晶片的电路形成表面上，研磨半导体晶片的背面，以实现预定厚度， 强制氧化半导体晶片的背面。 然后，剥离粘附到半导体晶片的电路形成表面的压敏粘合带，并将切割带粘附到半导体晶片的背面。 此外，通过将半导体晶片切割成单独的芯片来分割半导体晶片，然后通过切割带对芯片的背面进行压制，从而从切割带释放芯片。

公开(公告)号：US4492336A

公开(公告)日：1985-01-08

申请号：US473437

申请日：1983-03-09

申请人： Manabu Takata ,  Shojiro Inoue ,  Keiichi Mori

发明人： Manabu Takata ,  Shojiro Inoue ,  Keiichi Mori

IPC分类号： A47J27/62 ,  G05B13/02 ,  G05D23/19 ,  F23N1/08 ,  F24C3/00

CPC分类号： A47J27/62 ,  F24C7/087 ,  G05B13/02 ,  G05D23/1917

摘要： A high performance automatic temperature control system enables fries and Japanese tempura to be prepared in optimum condition.The temperature of the outer bottom surface of a container being heated is measured by a temperature sensor a given time later. A temperature rise gradient of the temperature sensor established at a given time in the initial stage of heating is used as a temperature correction value peculiar to the container, while a temperature rise gradient of the temperature sensor established after a certain temperature has been reached is used as a temperature correction value for the amount of food being cooked. The former and latter temperature correction values are converted into preset temperature values and serve as operating temperatures for the temperature sensor.When the temperature sensor reaches the operating temperature, the heating rate is controlled to hold the operating temperature. Thus, the system performs automatic temperature control irrespective of the kind of the material, wall thickness and size of the container, by means of the temperature rise gradients of the temperature sensor so as to ensure that the preset temperature and the temperature of the food are equal.

摘要翻译： 高性能自动温度控制系统可以在最佳条件下制作薯条和日本天妇罗。 被加热的容器的外底表面的温度通过一定时间后的温度传感器测量。 使用在加热的初始阶段在给定时间建立的温度传感器的温度升高梯度作为容器特有的温度校正值，而在达到一定温度之后建立的温度传感器的温度升高梯度被使用 作为烹调食物量的温度校正值。 前一个和后一个温度校正值被转换成预设的温度值并且用作温度传感器的工作温度。 当温度传感器达到工作温度时，控制加热速率以保持工作温度。 因此，系统通过温度传感器的温度升高梯度来进行自动温度控制，而不管材料的种类，壁厚和尺寸如何，以确保食品的预设温度和温度为 等于。

公开(公告)号：US20080286948A1

公开(公告)日：2008-11-20

申请号：US12170020

申请日：2008-07-09

申请人： Chuichi Miyazaki ,  Yoshiyuki Abe ,  Toshihide Uematsu ,  Minoru Kimura ,  Kazunari Suzuki ,  Masao Odagiri ,  Hideyuki Suga ,  Manabu Takata

发明人： Chuichi Miyazaki ,  Yoshiyuki Abe ,  Toshihide Uematsu ,  Minoru Kimura ,  Kazunari Suzuki ,  Masao Odagiri ,  Hideyuki Suga ,  Manabu Takata

IPC分类号： H01L21/00

CPC分类号： H01L21/6835 ,  H01L21/02238 ,  H01L21/02255 ,  H01L21/30625 ,  H01L21/314 ,  H01L21/31654 ,  H01L21/31675 ,  H01L21/6836 ,  H01L21/78 ,  H01L2221/68327 ,  H01L2221/6834

摘要： A technique capable of stably releasing chips from a dicing tape, includes grinding a back surface of a semiconductor wafer, while adhering a pressure sensitive adhesive tape to a circuit forming surface of the semiconductor wafer formed with an integrated circuit, to achieve a predetermined thickness and forcibly oxidizing the back surface of the semiconductor wafer. Then, the pressure sensitive adhesive tape adhered to the circuit forming surface of the semiconductor wafer is released, and a dicing tape is adhered to the back surface of the semiconductor wafer. Further, the semiconductor wafer is divided by dicing it into individual chips, and then the back surface of the chip is pressed by way of the dicing tape, thereby releasing the chips from the dicing tape.

摘要翻译： 一种能够从切割带稳定地释放芯片的技术包括：将压敏粘合带粘附到形成有集成电路的半导体晶片的电路形成表面上，研磨半导体晶片的背面，以实现预定厚度， 强制氧化半导体晶片的背面。 然后，剥离粘附到半导体晶片的电路形成表面的压敏粘合带，并将切割带粘附到半导体晶片的背面。 此外，通过将半导体晶片切割成单独的芯片来分割半导体晶片，然后通过切割带对芯片的背面进行压制，从而从切割带释放芯片。

公开(公告)号：US20050142815A1

公开(公告)日：2005-06-30

申请号：US11020049

申请日：2004-12-23

申请人： Chuichi Miyazaki ,  Yoshiyuki Abe ,  Toshihide Uematsu ,  Minoru Kimura ,  Kazunari Suzuki ,  Masao Odagiri ,  Hideyuki Suga ,  Manabu Takata

发明人： Chuichi Miyazaki ,  Yoshiyuki Abe ,  Toshihide Uematsu ,  Minoru Kimura ,  Kazunari Suzuki ,  Masao Odagiri ,  Hideyuki Suga ,  Manabu Takata

IPC分类号： H01L21/301 ,  H01L21/304 ,  H01L21/306 ,  H01L21/314 ,  H01L21/316 ,  H01L21/46 ,  H01L21/52 ,  H01L21/60 ,  H01L21/68 ,  H01L21/78 ,  H01L21/82

CPC分类号： H01L21/6835 ,  H01L21/02238 ,  H01L21/02255 ,  H01L21/30625 ,  H01L21/314 ,  H01L21/31654 ,  H01L21/31675 ,  H01L21/6836 ,  H01L21/78 ,  H01L2221/68327 ,  H01L2221/6834

摘要： A technique capable of stably releasing chips from a dicing tape, includes grinding a back surface of a semiconductor wafer, while adhering a pressure sensitive adhesive tape to a circuit forming surface of the semiconductor wafer formed with an integrated circuit, to achieve a predetermined thickness and forcibly oxidizing the back surface of the semiconductor wafer. Then, the pressure sensitive adhesive tape adhered to the circuit forming surface of the semiconductor wafer is released, and a dicing tape is adhered to the back surface of the semiconductor wafer. Further, the semiconductor wafer is divided by dicing it into individual chips, and then the back surface of the chip is pressed by way of the dicing tape, thereby releasing the chips from the dicing tape.

摘要翻译： 一种能够从切割带稳定地释放芯片的技术包括：将压敏粘合带粘附到形成有集成电路的半导体晶片的电路形成表面上，研磨半导体晶片的背面，以实现预定厚度， 强制氧化半导体晶片的背面。 然后，剥离粘附到半导体晶片的电路形成表面的压敏粘合带，并将切割带粘附到半导体晶片的背面。 此外，通过将半导体晶片切割成单独的芯片来分割半导体晶片，然后通过切割带对芯片的背面进行压制，从而从切割带释放芯片。

公开(公告)号：US07452787B2

公开(公告)日：2008-11-18

申请号：US11020049

申请日：2004-12-23

申请人： Chuichi Miyazaki ,  Yoshiyuki Abe ,  Toshihide Uematsu ,  Minoru Kimura ,  Kazunari Suzuki ,  Masao Odagiri ,  Hideyuki Suga ,  Manabu Takata

发明人： Chuichi Miyazaki ,  Yoshiyuki Abe ,  Toshihide Uematsu ,  Minoru Kimura ,  Kazunari Suzuki ,  Masao Odagiri ,  Hideyuki Suga ,  Manabu Takata

IPC分类号： H01L21/00

CPC分类号： H01L21/6835 ,  H01L21/02238 ,  H01L21/02255 ,  H01L21/30625 ,  H01L21/314 ,  H01L21/31654 ,  H01L21/31675 ,  H01L21/6836 ,  H01L21/78 ,  H01L2221/68327 ,  H01L2221/6834

摘要： A technique capable of stably releasing chips from a dicing tape, includes grinding a back surface of a semiconductor wafer, while adhering a pressure sensitive adhesive tape to a circuit forming surface of the semiconductor wafer formed with an integrated circuit, to achieve a predetermined thickness and forcibly oxidizing the back surface of the semiconductor wafer. Then, the pressure sensitive adhesive tape adhered to the circuit forming surface of the semiconductor wafer is released, and a dicing tape is adhered to the back surface of the semiconductor wafer. Further, the semiconductor wafer is divided by dicing it into individual chips, and then the back surface of the chip is pressed by way of the dicing tape, thereby releasing the chips from the dicing tape.

摘要翻译： 一种能够从切割带稳定地释放芯片的技术包括：将压敏粘合带粘附到形成有集成电路的半导体晶片的电路形成表面上，研磨半导体晶片的背面，以实现预定厚度， 强制氧化半导体晶片的背面。 然后，剥离粘附到半导体晶片的电路形成表面的压敏粘合带，并将切割带粘附到半导体晶片的背面。 此外，通过将半导体晶片切割成单独的芯片来分割半导体晶片，然后通过切割带对芯片的背面进行压制，从而从切割带释放芯片。

公开(公告)号：US4901705A

公开(公告)日：1990-02-20

申请号：US218295

申请日：1988-07-13

申请人： Manabu Takata ,  Junzo Tanaka ,  Yoshiharu Shimada ,  Yoshiteru Kagomoto

发明人： Manabu Takata ,  Junzo Tanaka ,  Yoshiharu Shimada ,  Yoshiteru Kagomoto

IPC分类号： F24C3/08 ,  F24C15/32

CPC分类号： F24C3/087 ,  F24C15/322

摘要： A gas heating cooker to be used as a grill or an oven, wherein the blow-off air current of the blowing apparatus blows along the flames of the lower burner to get the hot current to reach far, so that the heating chamber becomes superwide enough to allow a lot of cooking, with the result that the heating operation may be effected with uniform heat distribution in the full face of the heating chamber, and a superior cooking property from even cooking is provided.