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公开(公告)号：US06710348B1
公开(公告)日：2004-03-23
申请号：US09720938
申请日：2001-05-02
申请人： Manfred Rothley , Roland Mueller-Fiedler , Erich Zabler , Lars Erdmann , Wilhelm Leneke , Marion Simon , Karlheinz Storck , Joerg' Schieferdecker
发明人： Manfred Rothley , Roland Mueller-Fiedler , Erich Zabler , Lars Erdmann , Wilhelm Leneke , Marion Simon , Karlheinz Storck , Joerg' Schieferdecker
IPC分类号： G01J502
CPC分类号： G01J1/42 , G01J1/06 , G01J5/04 , G01J5/0806 , G01J5/12
摘要： An apparatus for sensing electromagnetic radiation with local resolution for image-producing sensors that can be economically produced and installed is decribed. This is achieved, in that a micromechanically producible optical imaging system is provided.
摘要翻译： 用于感测具有局部分辨率的用于可经济地生产和安装的图像产生传感器的电磁辐射的装置被描述。 这是通过提供微机械制造的光学成像系统来实现的。
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公开(公告)号：US08592765B2
公开(公告)日：2013-11-26
申请号：US13005853
申请日：2011-01-13
申请人： Bodo Forg , Frank Herrmann , Wilhelm Leneke , Joerg Schieferdecker , Marion Simon , Karlheinz Storck , Mischa Schulze
发明人： Bodo Forg , Frank Herrmann , Wilhelm Leneke , Joerg Schieferdecker , Marion Simon , Karlheinz Storck , Mischa Schulze
IPC分类号： G01J5/12
CPC分类号： G01J5/10 , G01J5/02 , G01J5/023 , G01J5/04 , G01J5/045 , G01J5/08 , G01J5/0853 , G01J5/12 , H01L2224/48091 , H01L2924/1461 , H01L2924/00014 , H01L2924/00
摘要： A thermal infrared sensor is provided in a housing with optics and a chip with thermoelements on a membrane. The membrane spans a frame-shaped support body that is a good heat conductor, and the support body has vertical or approximately vertical walls. The thermopile sensor structure consists of a few long thermoelements per sensor cell. The thermoelements being arranged on connecting webs that connect together hot contacts on an absorber layer to cold contacts of the thermoelements. The membrane is suspended by one or more connecting webs and has, on both sides of the long thermoelements, narrow slits that separate the connecting webs from both the central region and also the support body. At least the central region is covered by the absorber layer.
摘要翻译： 热敏红外传感器设置在具有光学元件的壳体中，并且在膜上具有热电元件的芯片。 膜跨过一个良好导热体的框架形支撑体，支撑体具有垂直或大致垂直的壁。 热电堆传感器结构由每个传感器单元的几个长的热电偶组成。 热电偶被布置在将吸收层上的热触点连接到热电偶的冷触点的连接腹板上。 膜通过一个或多个连接腹板悬挂，并且在长热电元件的两侧上具有将连接腹板与中心区域以及支撑体分开的狭窄狭缝。 至少中心区域被吸收层覆盖。
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公开(公告)号：US07842922B2
公开(公告)日：2010-11-30
申请号：US11913443
申请日：2006-05-16
CPC分类号： G01J5/06 , G01J5/12 , H01L2224/48091 , H01L2224/48472 , H01L2924/1461 , H01L2924/3025 , H04N5/2253 , H04N5/33 , H01L2924/00014 , H01L2924/00
摘要： A thermopile infrared sensor array, comprises a sensor chip with a number of thermopile sensor elements, made from a semiconductor substrate and corresponding electronic components. The sensor chip is mounted on a support circuit board and enclosed by a cap in which a lens is arranged. The aim is the production of a monolithic infrared sensor array with a high thermal resolution capacity with a small chip size and which may be economically produced. The aim is achieved by arranging a thin membrane made from non-conducting material on the semiconductor substrate of the sensor chip on which the thermopile sensor elements are located in an array. Under each thermopile sensor element, the back side of the membrane is uncovered in a honeycomb pattern by etching and the electronic components are arranged in the boundary region of the sensor chip. An individual pre-amplifier with a subsequent low-pass filter may be provided for each column and each row of sensor elements.
摘要翻译： 热电堆红外传感器阵列包括具有多个热电堆传感器元件的传感器芯片，由半导体衬底和相应的电子部件制成。 传感器芯片安装在支撑电路板上，并由其中布置透镜的盖子包围。 其目的是生产具有小的芯片尺寸并且经济地制造的具有高热分辨能力的单片式红外传感器阵列。 其目的是通过在传感器芯片的半导体衬底上布置由非导电材料制成的薄膜，其中热电堆传感器元件位于阵列中。 在每个热电堆传感器元件下，通过蚀刻将膜的背面未被覆盖成蜂窝图案，并且电子部件布置在传感器芯片的边界区域中。 可以为每列和每行传感器元件提供具有随后的低通滤波器的单个前置放大器。
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公开(公告)号：US20080216883A1
公开(公告)日：2008-09-11
申请号：US11913443
申请日：2006-05-16
CPC分类号： G01J5/06 , G01J5/12 , H01L2224/48091 , H01L2224/48472 , H01L2924/1461 , H01L2924/3025 , H04N5/2253 , H04N5/33 , H01L2924/00014 , H01L2924/00
摘要： A thermopile infrared sensor array, comprises a sensor chip with a number of thermopile sensor elements, made from a semiconductor substrate and corresponding electronic components. The sensor chip is mounted on a support circuit board and enclosed by a cap in which a lens is arranged. The aim is the production of a monolithic infrared sensor array with a high thermal resolution capacity with a small chip size and which may be economically produced. The aim is achieved by arranging a thin membrane made from non-conducting material on the semiconductor substrate of the sensor chip on which the thermopile sensor elements are located in an array. Under each thermopile sensor element, the back side of the membrane is uncovered in a honeycomb pattern by etching and the electronic components are arranged in the boundary region of the sensor chip. An individual pre-amplifier with a subsequent low-pass filter may be provided for each column and each row of sensor elements.
摘要翻译： 热电堆红外传感器阵列包括具有多个热电堆传感器元件的传感器芯片，由半导体衬底和相应的电子部件制成。 传感器芯片安装在支撑电路板上，并由其中布置透镜的盖子包围。 其目的是生产具有小的芯片尺寸并且经济地制造的具有高热分辨能力的单片式红外传感器阵列。 其目的是通过在传感器芯片的半导体衬底上布置由非导电材料制成的薄膜，其中热电堆传感器元件位于阵列中。 在每个热电堆传感器元件下，通过蚀刻将膜的背面未被覆盖成蜂窝图案，并且电子部件布置在传感器芯片的边界区域中。 可以为每列和每行传感器元件提供具有随后的低通滤波器的单个前置放大器。
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