公开(公告)号：US08622578B2

公开(公告)日：2014-01-07

申请号：US11909825

申请日：2006-03-22

申请人： Marc Andre De Samber ,  Marten Sikkens ,  Hendrik Eggink

发明人： Marc Andre De Samber ,  Marten Sikkens ,  Hendrik Eggink

IPC分类号： F21S4/00

CPC分类号： H05B33/26 ,  F21K9/00 ,  F21Y2105/10 ,  F21Y2115/10 ,  H01L25/0753 ,  H01L33/647 ,  H01L2224/48091 ,  H01L2924/30107 ,  H05K1/0203 ,  H05K1/189 ,  H01L2924/00

摘要： A light emitting device, comprising a flexible substrate (2) with a single, structured conductive layer (5), and a plurality of LEDs (3) arranged on said substrate (2), said structured conductive layer (5) forming electrodes for driving said LEDs (3). The structured conductive layer comprises a plurality of heat dissipating pads (8), each having an area significantly larger than the area of each LED (3), and each LED (3a) is thermally connected to at least one of said pads (8a), and electrically connected in series between two pads (8a, 8b). Through this design, each LED is thermally connected to a relatively large heat dissipating area, and the thermal energy built up in the LED will be distributed over this area, and then dissipated upwards and downwards from this area. As the addressing can be handled by a single conducting layer, the flexibility of the substrate is improved compared to multilayer substrates. By connecting each LED in series between two pads, a very large portion of the conducting layer can be used for the pads, and very little area needs to be occupied by conducting tracks, which otherwise may be a problem with single layer designs.

摘要翻译： 一种发光器件，包括具有单个结构化导电层（5）的柔性衬底（2）和布置在所述衬底（2）上的多个LED（3），所述结构化导电层（5）形成用于驱动的​​电极 所述LED（3）。 结构化导电层包括多个散热焊盘（8），每个散热焊盘具有明显大于每个LED（3）的面积的面积，并且每个LED（3a）被热连接到所述焊盘（8a）中的至少一个， 并且在两个焊盘（8a，8b）之间串联电连接。 通过这种设计，每个LED被热连接到相对较大的散热区域，并且LED中积聚的热能将分布在该区域上，然后从该区域向上和向下散开。 由于可以通过单个导电层处理寻址，与多层基板相比，衬底的柔性得到改善。 通过将每个LED串联连接在两个焊盘之间，导电层的非常大的部分可以用于焊盘，并且非常小的面积需要由导电轨道占据，否则可能是单层设计的问题。

公开(公告)号：US20050134827A1

公开(公告)日：2005-06-23

申请号：US10740832

申请日：2003-12-22

申请人： Wilhelmus Box ,  Hendrik Eggink

发明人： Wilhelmus Box ,  Hendrik Eggink

IPC分类号： G03F7/20 ,  H01L21/027 ,  H01L21/683 ,  G03B27/58

CPC分类号： G03F7/707 ,  G03F7/70783 ,  G03F7/70875 ,  G03F7/709

摘要： A lithographic apparatus includes an illumination system for projecting a beam of radiation onto a substrate. The lithographic apparatus further has a chuck assembly for supporting at least one of the substrate or a patterning device, the patterning device serving to impart the beam with a pattern in its cross-section. A heat transfer system is operable between a first surface and a second surface. The heat transfer system is capable of transferring heat between the first surface and the second surface. The first surface is at least partially formed by at least a part of the chuck assembly. The second surface is at least partially formed by at least a part of a component spaced a distance from the chuck. The second surface is mechanically isolated from and thermally coupled to the first surface.

摘要翻译： 光刻设备包括用于将辐射束投射到衬底上的照明系统。 光刻设备还具有用于支撑基板或图案形成装置中的至少一个的卡盘组件，图案形成装置用于在其横截面中赋予光束图案。 传热系统可在第一表面和第二表面之间操作。 传热系统能够在第一表面和第二表面之间传递热量。 第一表面至少部分地由卡盘组件的至少一部分形成。 第二表面至少部分地由与卡盘间隔一定距离的部件的至少一部分形成。 第二表面与第一表面机械隔离并热耦合。