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公开(公告)号：US06531083B1
公开(公告)日：2003-03-11
申请号：US08434336
申请日：1995-05-02
申请人： Mario A. Bolanos , Jeremias L. Libres , George A. Bednarz , Tay LiangChee , Julius Lim , Ireneus J. T. M. Pas
发明人： Mario A. Bolanos , Jeremias L. Libres , George A. Bednarz , Tay LiangChee , Julius Lim , Ireneus J. T. M. Pas
IPC分类号： B29C4502
CPC分类号： B29C45/14655 , B29C45/463 , H01L21/565 , H01L2224/48091 , H01L2924/00014
摘要： A method and apparatus for encapsulating an integrated circuit die and leadframe assembly. A prepackaged sproutless mold compound insert 71 is placed in a rectangular receptacle 91 in a bottom mold chase 81. The receptacle is coupled to a plurality of die cavities 85 by runners 87. Leadframe strip assemblies containing leadframes, integrated circuit dies, and bond wires coupling the leadframes and dies are placed over the bottom mold chase 81 such that the integrated circuit dies are each centered over a bottom mold die cavity 85. A top mold chase 90 is placed over the bottom mold chase 81 and the mold compound package 71. The top mold chase 90 has die cavities 95 corresponding to those in the bottom mold chase 81. The mold compound insert 71 is preferably packaged in a plastic film 75 which has heat sealed edges 77. The mold compound is forced through the package 75 and heat seals 77 during the molding process by the pressure applied by a rectangular plunger 101. The sproutless mold compound insert is packaged so that the mold compound will exit the packaging only where runners intersect the receptacle. The sproutless mold compound insert requires no alignment or cutting tools within the mold station. The plunger is applied using variable speed and pressure to control the rate the mold compound fills the cavities in the top and bottom mold chases, thereby avoiding voids in the completed packages and mining wire sweep of the bond wires of the integrated circuit assemblies.
摘要翻译： 一种用于封装集成电路管芯和引线框架组件的方法和装置。 将预先包装的无芽模具复合插入件71放置在底部模具追逐器81中的矩形插座91中。插座通过流道87连接到多个模具空腔85.引线框架组件包含引线框架，集成电路管芯和接合线 引线框架和模具放置在底部模具走沿81上方，使得集成电路模具均位于底部模具模腔85的上方。顶部模具追逐90放置在底部模具追逐器81和模具复合封装件71上。 顶模90具有对应于底模追逐81中的那些的模腔95.模具化合物插入件71优选地包装在具有热封边缘77的塑料膜75中。模具化合物被迫通过包装75并且热封 在模制过程中，通过由矩形柱塞101施加的压力来形成。77将无芽模具复合物插入物包装，使得模具化合物仅在运行时才离开包装 内部与插座相交。 无模具复合插入件不需要在模具台内对准或切割工具。 使用可变速度和压力施加柱塞以控制模具化合物填充顶部和底部模具中的空腔的速率，从而避免完成的包装中的空隙和集成电路组件的接合线的采矿线扫描。
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公开(公告)号：US5912024A
公开(公告)日：1999-06-15
申请号：US643661
申请日：1996-05-06
申请人： Mario A. Bolanos , Jeremias L. Libres , George A. Bednarz , Tay LiangChee , Julius Lim , Ireneus J. T. M. Pas
发明人： Mario A. Bolanos , Jeremias L. Libres , George A. Bednarz , Tay LiangChee , Julius Lim , Ireneus J. T. M. Pas
IPC分类号： B29C45/26 , B29C45/02 , B29C45/14 , B29C45/46 , B29C45/77 , B29K101/10 , B29L31/34 , H01L21/56
CPC分类号： B29C45/14655 , B29C45/463 , H01L21/565 , H01L2224/48091
摘要： A method and apparatus for encapsulating an integrated circuit die and leadframe assembly. A prepackaged sproutless mold compound insert 71 is placed in a rectangular receptacle 91 in a bottom mold chase 81. The receptacle is coupled to a plurality of die cavities 85 by runners 87. Leadframe strip assemblies containing leadframes, integrated circuit dies, and bond wires coupling the leadframes and dies are placed over the bottom mold chase 81 such that the integrated circuit dies are each centered over a bottom mold die cavity 85. A top mold chase 90 is placed over the bottom mold chase 81 and the mold compound package 71. The top mold chase 90 has die cavities 95 corresponding to those in the bottom mold chase 81. The mold compound insert 71 is preferably packaged in a plastic film 75 which has heat sealed edges 77. The mold compound is forced through the package 75 and heat seals 77 during the molding process by the pressure applied by a rectangular plunger 101. The sproutless mold compound insert is packaged so that the mold compound will exit the packaging only where runners intersect the receptacle. The sproutless mold compound insert requires no alignment or cutting tools within the mold station. The plunger is applied using variable speed and pressure to control the rate the mold compound fills the cavities in the top and bottom mold chases, thereby avoiding voids in the completed packages and minimizing wire sweep of the bond wires of the integrated circuit assemblies.
摘要翻译： 一种用于封装集成电路管芯和引线框架组件的方法和装置。 将预先包装的无芽模具复合插入件71放置在底部模具追逐器81中的矩形插座91中。插座通过流道87连接到多个模具空腔85.引线框架组件包含引线框架，集成电路管芯和接合线 引线框架和模具放置在底部模具走沿81上方，使得集成电路模具均位于底部模具模腔85的上方。顶部模具追逐90放置在底部模具追逐器81和模具复合封装件71上。 顶模90具有对应于底模追逐81中的那些的模腔95.模具化合物插入件71优选地包装在具有热封边缘77的塑料膜75中。模具化合物被迫通过包装75并且热封 在模制过程中，通过由矩形柱塞101施加的压力来形成。77将无芽模具复合物插入物包装，使得模具化合物仅在运行时才离开包装 内部与插座相交。 无模具复合插入件不需要在模具台内对准或切割工具。 使用可变速度和压力施加柱塞以控制模具化合物填充顶部和底部模具中的空腔的速率，从而避免完成的包装中的空隙并且最小化集成电路组件的接合线的丝线扫掠。
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公开(公告)号：US5955115A
公开(公告)日：1999-09-21
申请号：US646738
申请日：1996-05-03
CPC分类号： B29C45/463 , B29C45/14655 , B29C45/586 , H01L21/565 , B29C2045/14663 , B29C2045/14852 , B29C45/02 , H01L2224/48247
摘要： A method and apparatus for encapsulating an integrated circuit die and leadframe assembly using liquid mold compound. A prepackaged liquid mold compound insert 11 is placed in a rectangular receptacle 43 in a bottom mold chase 31. The receptacle 43 is coupled to a plurality of die cavities 37 by runners 39. Leadframe strip assemblies containing leadframes, integrated circuit dies, and bond wires coupling the leadframes and dies are placed over the bottom mold chase 31 such that the integrated circuit dies are each centered over a bottom mold die cavity 35. A top mold chase 53 is placed over the bottom mold chase 31 and the mold compound package 11. The top mold chase 53 has die cavities 57 corresponding to those in the bottom mold chase 31. The prepackaged liquid mold compound is packaged in a plastic film which has heat sealed edges 15. The mold compound is forced through the heat seals 15 during the molding process by the pressure applied by a rectangular plunger 61. The plunger is applied using variable speed and pressure to control the rate the mold compound fills the cavities in the top and bottom mold chases, thereby avoiding voids in the completed packages and minimizing wire sweep of the bond wires of the integrated circuit assemblies.
摘要翻译： 一种使用液体模具化合物封装集成电路管芯和引线框架组件的方法和装置。 预包装的液体模具化合物插入件11放置在底部模具走廊31中的矩形容器43中。容器43通过流道39连接到多个模具空腔37.包含引线框架，集成电路管芯和接合线的引线框架组件 将引线框架和模具连接放置在底部模具走廊31上，使得集成电路模具均位于底部模具模腔35的上方。顶部模具走廊53放置在底部模具追逐31和模具复合材料封装11的上方。 顶模53具有与底模31中的模腔相对应的模腔57.预先包装的液模模具化合物被封装在具有热密封边缘15的塑料薄膜中。模塑料在成型期间被迫通过热密封件15 通过矩形柱塞61施加的压力进行处理。使用可变速度和压力施加柱塞以控制模具化合物填充顶部和机器人的空腔的速率 从而避免完成的包装中的空隙并且最小化集成电路组件的接合线的电线扫掠。
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公开(公告)号：US5965078A
公开(公告)日：1999-10-12
申请号：US962694
申请日：1997-11-03
CPC分类号： B29C45/463
摘要： A method and apparatus for providing a prepackaged mold compound for use in encapsulating integrated circuit die and leadframe assemblies. A piece of mold compound 71 is placed in a receptacle 91 in a bottom mold chase 83. The receptacle 91 is coupled to a group of die cavities 85 by runners 87. Leadframe strip assemblies containing leadframes, integrated circuit dies, and bond wires coupling the leadframes and dies are placed over the bottom mold chase 83 such that the integrated circuit dies are each centered over a bottom mold die cavity 85. A top mold chase 93 is placed over the bottom mold chase and the prepackaged mold compound 71. The prepackaged mold compound 71 is a piece of mold compound 73 packaged in a plastic film which has sealed edges 77. The edges are peelable seals, which are released during the molding process. The mold compound 73 is then forced through the seals during the molding process by the pressure applied by a plunger 101. The plunger 101 can be applied using variable speed and pressure to control the rate the mold compound 73 fills the cavities in the top and bottom mold chases, thereby avoiding voids in the completed packages and minimizing wire sweep of the bond wires of the integrated circuit assemblies.
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公开(公告)号：US5891377A
公开(公告)日：1999-04-06
申请号：US632253
申请日：1996-04-15
IPC分类号： B29C45/14 , B29C45/46 , H01L21/56 , H01L23/495 , H01L23/50 , B29C33/08 , B29C45/02 , B29C70/70
CPC分类号： B29C45/463 , B29C45/14655 , H01L21/565 , H01L21/566 , H01L23/49541 , H01L23/49558 , B29C2045/14663 , H01L2224/48091 , H01L2224/48247 , H01L24/48 , H01L2924/00014 , H01L2924/00015 , H01L2924/01019 , H01L2924/01046 , H01L2924/12043 , H01L2924/14
摘要： A method and apparatus for encapsulating an integrated circuit die and leadframe assembly using dambarless leadframes. Dambarless leadframe 191 is formed having leads 193 that are widened in the region near the package edge such that the interlead spacing between adjacent leads is less than a predetermined minimum distance. Lower and upper mold release films 67 and 65 are stretched over a plurality of die cavities formed in bottom and top mold chases 179 and 173. The release films can be further stretched into the die cavities by a vacuum. Leadframe strip assemblies containing the dambarless leadframes, each holding integrated circuit dies 189 are placed such that the integrated circuit dies are each centered over a bottom mold die cavity 63 and over the bottom mold release films 65. When the top and bottom mold chases are superimposed, the mold release films 67 and 65 are clamped together, and an interface is formed at the edges of the top and bottom mold cavities and between the leads of the dambarless leadframe. The mold compound is forced into the cavities by pressure. The interface between the top and bottom release films prevents the mold compound from forming mold flash between the leads of the dambarless leadframe. The dambarless leadframe includes a specific support tape 197 for the internal leads and a specialized open gate design.
摘要翻译： 一种用于使用无阻挡引线框封装集成电路管芯和引线框架组件的方法和装置。 无引线框架191形成为具有在封装边缘附近的区域中加宽的引线193，使得相邻引线之间的交错间隔小于预定的最小距离。 下部和上部脱模膜67和65在形成在底部和顶部模具179和173中的多个模腔上拉伸。剥离膜可以通过真空进一步拉伸到模具腔中。 包含无铅引线框架的引线框架组件，每个保持集成电路模具189被放置成使得集成电路模具都位于底模具模腔63之上并且在底部模具脱模膜65上方。当顶部和底部模具叠加时 脱模膜67和65被夹紧在一起，并且界面形成在顶部和底部模腔的边缘处以及在无铅引线框架的引线之间。 模具化合物通过压力被迫进入空腔。 顶部和底部剥离膜之间的界面防止模具化合物在无阻挡引线框架的引线之间形成模具闪光。 无铅引线框架包括用于内部引线的专用支撑带197和专门的开放门设计。
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公开(公告)号：US5949132A
公开(公告)日：1999-09-07
申请号：US434137
申请日：1995-05-02
IPC分类号： B29C45/14 , B29C45/46 , H01L21/56 , H01L23/495 , H01L23/50
CPC分类号： B29C45/463 , B29C45/14655 , H01L21/565 , H01L21/566 , H01L23/49541 , H01L23/49558 , B29C2045/14663 , H01L2224/48091 , H01L2224/48247 , H01L24/48 , H01L2924/00014 , H01L2924/00015 , H01L2924/01019 , H01L2924/01046 , H01L2924/12043 , H01L2924/14
摘要： A method and apparatus for encapsulating an integrated circuit die and leadframe assembly using dambarless leadframes. Dambarless leadframe 191 is formed having leads 193 that are widened in the region near the package edge such that the interlead spacing between adjacent leads is less than a predetermined minimum distance. Lower and upper mold release films 67 and 65 are stretched over a plurality of die cavities formed in bottom and top mold chases 179 and 173. The release films can be further stretched into the die cavities by a vacuum. Leadframe strip assemblies containing the dambarless leadframes, each holding integrated circuit dies 189, are placed such that the integrated circuit dies are each centered over a bottom mold die cavity 63 and over the bottom mold release films 65. When the top and bottom mold chases are superimposed, the mold release films 67 and 65 are clamped together, and an interface is formed at the edges of the top and bottom mold cavities and between the leads of the dambarless leadframe. The mold compound is forced into the cavities by pressure. The interface between the top and bottom release films prevents the mold compound from forming mold flash between the leads of the dambarless leadframe. The dambarless leadframe includes a specific support tape 197 for the internal leads and a specialized open gate design.
摘要翻译： 一种用于使用无阻挡引线框封装集成电路管芯和引线框架组件的方法和装置。 无引线框架191形成为具有在封装边缘附近的区域中加宽的引线193，使得相邻引线之间的交错间隔小于预定的最小距离。 下部和上部脱模膜67和65在形成在底部和顶部模具179和173中的多个模腔上拉伸。剥离膜可以通过真空进一步拉伸到模具腔中。 每个保持集成电路模具189的包含无铅引线框架的引线框架组件被放置成使得集成电路模具分别位于底部模具模腔63和底部模具脱模膜65之上。当顶部和底部模具追逐是 将脱模膜67和65夹紧在一起，并且在顶部和底部模具腔的边缘以及在无铅引线框架的引线之间形成界面。 模具化合物通过压力被迫进入空腔。 顶部和底部剥离膜之间的界面防止模具化合物在无阻挡引线框架的引线之间形成模具闪光。 无铅引线框架包括用于内部引线的专用支撑带197和专门的开放门设计。
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7.发明授权Method for manufacturing prepackaged molding compound for component encapsulation 失效用于制造用于组件封装的预包装模塑料的方法
公开(公告)号：US5888443A
公开(公告)日：1999-03-30
申请号：US641982
申请日：1996-05-02
CPC分类号： B29C45/463
摘要： A method and apparatus for providing a prepackaged mold compound for use in encapsulating integrated circuit die and leadframe assemblies. A piece of mold compound 71 is placed in a receptacle 91 in a bottom mold chase 83. The receptacle 91 is coupled to a group of die cavities 85 by runners 87. Leadframe strip assemblies containing leadframes, integrated circuit dies, and bond wires coupling the leadframes and dies are placed over the bottom mold chase 83 such that the integrated circuit dies are each centered over a bottom mold die cavity 85. A top mold chase 93 is placed over the bottom mold chase and the prepackaged mold compound 71. The prepackaged mold compound 71 is a piece of mold compound 73 packaged in a plastic film which has sealed edges 77. The edges are peelable seals, which are released during the molding process. The mold compound 73 is then forced through the seals during the molding process by the pressure applied by a plunger 101. The plunger 101 can be applied using variable speed and pressure to control the rate the mold compound 73 fills the cavities in the top and bottom mold chases, thereby avoiding voids in the completed packages and minimizing wire sweep of the bond wires of the integrated circuit assemblies.
摘要翻译： 一种用于提供用于封装集成电路管芯和引线框架组件的预包装模具化合物的方法和装置。 一块模具化合物71放置在底部模具追逐83中的容器91中。容器91通过流道87连接到一组模腔85.引线框架组件包含引线框架，集成电路管芯和连接线 引线框架和模具放置在底模追逐83之上，使得集成电路模具均位于底模模腔85的上方。顶模追逐93放置在底模追逐和预包装模具复合材料71上。预包装模具 复合物71是封装在具有密封边缘77的塑料膜中的一块模塑料73.边缘是在模制过程中释放的可剥离密封件。 然后，通过由柱塞101施加的压力，模制化合物73在模制过程中被迫通过密封件。可以使用可变速度和压力来施加柱塞101，以控制模具化合物73填充顶部和底部中的空腔的速率 模具追逐，从而避免完成的包装中的空隙并且最小化集成电路组件的接合线的线扫。
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公开(公告)号：US5885506A
公开(公告)日：1999-03-23
申请号：US642245
申请日：1996-05-02
CPC分类号： B29C45/463 , B29C45/14655 , B29C70/72
摘要： A method and apparatus for encapsulating an integrated circuit die and leadframe assembly. A prepackaged mold compound insert 71 is placed in a rectangular receptacle 91 in a bottom mold chase 81. The receptacle is coupled to a plurality of die cavities 85 by runners 87. Leadframe strip assemblies containing leadframes, integrated circuit dies, and bond wires coupling the leadframes and dies are placed over the bottom mold chase 81 such that the integrated circuit dies are each centered over a bottom mold die cavity 85. A top mold chase 90 is placed over the bottom mold chase 81 and the mold compound package 71. The top mold chase 90 has die cavities 95 corresponding to those in the bottom mold chase 81. The mold compound insert 71 is packaged in a plastic film 75 which has heat sealed edges 77. The mold compound is forced through the package 75 and heat seals 77 during the molding process by the pressure applied by a rectangular plunger 101. The plunger is applied using variable speed and pressure to control the rate the mold compound fills the cavities in the top and bottom mold chases, thereby avoiding voids in the completed packages and minimizing wire sweep of the bond wires of the integrated circuit assemblies.
摘要翻译： 一种用于封装集成电路管芯和引线框架组件的方法和装置。 将预先包装的模具复合插入件71放置在底部模具追逐器81中的矩形插座91中。插座通过流道87连接到多个模具空腔85.引线框架组件包含引线框架，集成电路模具和联接线 引线框架和模具放置在底部模具81上方，使得集成电路模具均位于底部模具模腔85的上方。顶部模具追逐90放置在底部模具追逐器81和模具复合封装件71上。顶部 模具追逐装置90具有对应于底部模具追逐件81中的模具腔体95.模具化合物插入件71被封装在具有热密封边缘77的塑料膜75中。模具化合物被迫通过包装75和热封77 通过由矩形柱塞101施加的压力的模制过程。使用可变速度和压力来施加柱塞以控制模具化合物填充顶部和机器人的空腔的速率 从而避免完成的包装中的空隙并且最小化集成电路组件的接合线的电线扫掠。
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公开(公告)号：US5644168A
公开(公告)日：1997-07-01
申请号：US433101
申请日：1995-05-03
CPC分类号： H01L23/295 , H01L2924/0002
摘要： A semiconductor package which comprises a lead frame, a semiconductor chip secured to the lead frame and a mold composition encasing the lead frame and the semiconductor chip has a filler of ceramic particles. Each of the ceramic particles, preferably silica or alumina, has macroscopic pores of sufficient size to receive a resin binder therein, the pores extending from the surface of the particle to the particle interior. A permanently hardenable composition adherable to the ceramic particles preferably an epoxy cresol novolac, extends around the ceramic particles and into the pores. The ceramic particles are formed by providing ceramic particles having a macroscopically smooth surface and subjecting the surfaces of the particles to a composition capable of removing portions of the particles, preferably hydrofluoric acid, while agitating the particles to form the pores.
摘要翻译： 包括引线框架，固定到引线框架的半导体芯片和封装引线框架和半导体芯片的模具组合物的半导体封装具有陶瓷颗粒填料。 每个陶瓷颗粒，优选二氧化硅或氧化铝，具有足够尺寸的宏观孔，以在其中容纳树脂粘合剂，孔从颗粒表面延伸到颗粒内部。 可与陶瓷颗粒粘合的永久可硬化组合物优选环氧甲酚酚醛清漆，围绕陶瓷颗粒延伸到孔中。 陶瓷颗粒通过提供具有宏观光滑表面的陶瓷颗粒形成，并且使颗粒表面能够在搅拌颗粒以形成孔的同时除去颗粒的一部分，优选氢氟酸的组合物。
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