公开(公告)号：US5185654A

公开(公告)日：1993-02-09

申请号：US799235

申请日：1991-11-27

申请人： Mark D. Mosher ,  Robert Fraser ,  Ronald D. Fuller

发明人： Mark D. Mosher ,  Robert Fraser ,  Ronald D. Fuller

IPC分类号： H01L23/60 ,  H01L23/66 ,  H01Q17/00 ,  H05K9/00

CPC分类号： H05K9/0079 ,  H01L23/60 ,  H01L23/66 ,  H01Q17/00 ,  H01L2924/0002 ,  H01L2924/1616 ,  H01L2924/3011 ,  Y10T29/49126

摘要： An electrostatic RF absorbant circuit carrier assembly (200) is described as having a plastic support structure (100) which consists of an integrally fashioned base (180) and surrounding sidewalls (170) which together form an internal cavity (185). A plurality of conductor paths (125,165) are disposed within the cavity (185). The assembly (200) is completed by a polymeric cover (110) having a surface integrally fashioned to comprise wall members (145) for making contact with conductive paths (165) within the cavity (185). In order to facilitate RF isolation and electrostatic dissipation, the cover (110) is layered with a surface material comprising:a thermosetting matrix system;a non-conductive RF absorbing filler comprising 25 to 87 percent by weight loading of the thermosetting matrix system; anda conductive filler comprising 1 to 4 percent by weight loading of the thermosetting matrix system and the RF absorbing filler.

摘要翻译： 静电RF吸收剂回路载体组件（200）被描述为具有塑料支撑结构（100），该塑料支撑结构由一体形成的基部（180）和围绕的侧壁（170）组成，这些侧壁一起形成内部空腔（185）。 多个导体路径（125,165）设置在空腔（185）内。 组件（200）由聚合物盖（110）完成，聚合物盖（110）具有整体形式的表面，包括用于与空腔（185）内的导电路径（165）接触的壁构件（145）。 为了促进RF隔离和静电耗散，盖（110）用表面材料层压，包括：热固性基体系; 一种非导电RF吸收填料，其包含25-87重量％的热固性基体系的负荷; 以及包含1至4重量％的热固性基体系和RF吸收填料的导电填料。

公开(公告)号：US5326414A

公开(公告)日：1994-07-05

申请号：US904319

申请日：1992-06-25

申请人： Mark D. Mosher ,  Robert Fraser ,  Ronald D. Fuller

发明人： Mark D. Mosher ,  Robert Fraser ,  Ronald D. Fuller

IPC分类号： H01L23/60 ,  H01L23/66 ,  H01Q17/00 ,  H05K9/00 ,  B32B31/00 ,  H01L21/60 ,  H05K3/36

CPC分类号： H05K9/0079 ,  H01L23/60 ,  H01L23/66 ,  H01Q17/00 ,  H01L2924/0002 ,  H01L2924/1616 ,  H01L2924/3011 ,  Y10T29/49126

摘要： An electrostatic RF absorbant circuit carrier assembly production method including the steps of forming a polymeric support structure having a base and surrounding walls which form an internal cavity from plastic, disposing a plurality of conductor paths within the cavity, forming a polymeric cover having wall members integrally fashioned into a surface thereof, for making contact with conductor paths within the cavity, depositing a layer of surface material on the cover and the cover wall members, said surface material comprising:a thermosetting binder,a non-conductive RF absorbing filler comprising 25 to 87 percent by weight loading of the binder, such that the surface material absorbs RF energy within a range of 1-60 GHz, anda conductive filler comprising 1 to 4 percent by weight loading of the binder and the RF absorbing filler, such that the surface material has a surface resistivity of 10.sup.5 -10.sup.12 ohms/square, and fixing the polymeric cover to the polymeric support structure to cover the cavity and provide said contact between the wall members and the conductive paths, thereby forming a circuit carrier assembly.

摘要翻译： 一种静电RF吸收剂回路载体组合物的制造方法，包括以下步骤：形成聚合物支持结构，所述聚合物支持结构具有基底和周围壁，所述基底和周围壁由塑料形成内部空腔，在腔体内设置多个导体路径，形成聚合物盖， 形成其表面，用于与空腔内的导体路径接触，在盖和盖壁构件上沉积表面材料层，所述表面材料包括：热固性粘合剂，非导电RF吸收填料，其包含25至 87重量％的粘合剂的负载量，使得表面材料吸收在1-60GHz的范围内的RF能量，以及包含1至4重量％的粘合剂和RF吸收填料的负载的导电填料，使得 表面材料具有105-1012欧姆/平方的表面电阻率，并且将聚合物覆盖物固定到聚合物支撑结构到c 并且在壁构件和导电路径之间提供所述接触，从而形成电路载体组件。

公开(公告)号：US4562026A

公开(公告)日：1985-12-31

申请号：US589809

申请日：1984-03-15

申请人： Mark D. Mosher

发明人： Mark D. Mosher

IPC分类号： B29C33/00 ,  B29C33/10 ,  B29C33/12 ,  B29C43/18 ,  B29C70/68

CPC分类号： B29C33/10 ,  B29C33/0033 ,  B29C33/0055 ,  B29C33/12 ,  B29C43/18 ,  B29C70/68 ,  B29K2101/10 ,  B29K2105/12 ,  Y10S425/812

摘要： A flash free, compression molded object which includes an insert and is formed using only one mold plate is disclosed. Molding compound is trapped in a mold cavity between the insert and mold plate. An extrusion vent allows excess molding compound and curing gases to escape from the mold cavity. Systems for forming a pin hole within the molded object and removing the molded object from the mold plate are also disclosed.

摘要翻译： 公开了一种无闪光的压缩成型物体，其包括插入件并且仅使用一个模板形成。 成型化合物被捕获在插入件和模具板之间的模腔中。 挤出口允许多余的模塑料和固化气体从模腔中逸出。 还公开了用于在模制物体内形成针孔并从模板移除模制物体的系统。

公开(公告)号：US5709960A

公开(公告)日：1998-01-20

申请号：US667563

申请日：1996-06-21

申请人： Lonne L. Mays ,  Mark D. Mosher ,  Alexandra Hubenko

发明人： Lonne L. Mays ,  Mark D. Mosher ,  Alexandra Hubenko

IPC分类号： H01L23/373 ,  B32B19/00

CPC分类号： H01L23/3733 ,  H01L2924/0002

摘要： An electronic component has a body (11) that is formed from a mold compound that includes a thermoplastic material (31), a first filler (32) comprised of an electrically insulative material wherein the first filler (32) is more thermally conductive than the thermoplastic material (31), and a second filler (33) comprised of an electrically conductive material wherein the second filler (33) is more thermally conductive than the thermoplastic material (31).

摘要翻译： 电子部件具有由包括热塑性材料（31）的模具化合物形成的主体（11），由电绝缘材料构成的第一填料（32），其中第一填料（32）的导热性高于 热塑性材料（31）和由导电材料组成的第二填料（33），其中第二填料（33）比热塑性材料（31）更加导热。