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公开(公告)号：US20070099425A1
公开(公告)日：2007-05-03
申请号：US11554100
申请日：2006-10-30
IPC分类号： H01L21/302
CPC分类号： C23C18/22 , C09K13/08 , C23C18/2086 , C23C18/24 , C23C18/30
摘要： An etching composition for non-conductive substrates such as polyester, polyether, polyimide, polyurethane, epoxy resin, polysulfone, polyethersulfone, polyetherimide, and polyamide, comprising a halogenide and/or nitrate of a metal selected from the group consisting of Na, Mg, Al, Si, Sc, Ti, V, Cr, Mn, Fe, Co, Ni, Cu, Ca, Zn, and combinations thereof such as FeCl3, FeCl2, TiCl3, CaCl2, CuCl2, CrCl3, ZnCl2, MgCl2, MnCl2, and Cr(NO3)3; and a related method for etching.
摘要翻译： 一种用于非导电性基材例如聚酯，聚醚，聚酰亚胺，聚氨酯，环氧树脂，聚砜，聚醚砜，聚醚酰亚胺和聚酰胺的蚀刻组合物，其包含选自Na，Mg的卤化物和/或硝酸盐， Al，Si，Sc，Ti，V，Cr，Mn，Fe，Co，Ni，Cu，Ca，Zn及其组合，如FeCl 3，FeCl 2， ，TiCl 3，CaCl 2，CuCl 2，CrCl 3，ZnCl 2， ，MgCl 2，MnCl 2和Cr（NO 3 3）3; 和相关的蚀刻方法。
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公开(公告)号：US09222189B2
公开(公告)日：2015-12-29
申请号：US13129300
申请日：2009-11-13
IPC分类号： C25D9/04 , C09D5/08 , C09D5/44 , C25D5/48 , C25D11/02 , C25D11/26 , C25D11/34 , C25D11/36 , C25D11/38
CPC分类号： C25D9/04 , C09D5/08 , C09D5/4411 , C09D5/4484 , C25D5/48 , C25D11/02 , C25D11/26 , C25D11/34 , C25D11/36 , C25D11/38
摘要： A process for treating the surface of a metal substrate comprising a constituent metal selected from the group consisting of Cr, Cu, Mn, Mo, Ag, Au, Pt, Pd, Rh, Pb, Sn, Ni, Zn, in some cases Fe, and alloys of these metals. An anodic potential is applied to the metal surface in an electrolytic circuit comprising the metal surface, a cathode, and an electrolytic solution that is in contact with the metal surface and in electrically conductive communication with the cathode. The electrolytic solution may contain an electrolyte comprising anions of phosphate, phosphonate, phosphite, phosphinate, nitrate, borate, silicate, molybdate, tungstate, carboxylate, oxalate and combinations thereof. The anion may comprise a polymer having a pendent moiety selected from the group consisting of phosphate, phosphonate, phosphite, phosphinate, sulfate, sulfonate, carboxylate and combinations thereof. The potential applied to the circuit is such that the substrate is anodically oxidized and reacts with the anion to form a composition that imparts an enhanced property to the metal surface. Preferably, the pH of the electrolytic solution is less than about 6.0, the potential applied is between about 0.5 and about 20 volts, and the current density is between about 0.01 and 2 amps/dm2 of the geometric surface area of metal in contact with the electrolytic solution and is controlled such that nascent cations of said constituent metal produced by anodic oxidation of said constituent metal react with said anions at the metal surface without significant formation of any oxide or hydroxide of said constituent metal.
摘要翻译： 一种用于处理包括选自Cr，Cu，Mn，Mo，Ag，Au，Pt，Pd，Rh，Pb，Sn，Ni，Zn中的组成金属的金属基材的表面的方法，在某些情况下为Fe ，以及这些金属的合金。 在包括金属表面，阴极和与金属表面接触并与阴极导电连通的电解液的电解电路中，将金属表面施加阳极电位。 电解液可以含有包含磷酸盐，膦酸盐，亚磷酸盐，次膦酸盐，硝酸盐，硼酸盐，硅酸盐，钼酸盐，钨酸盐，羧酸盐，草酸盐及其组合的阴离子的电解质。 阴离子可以包含具有选自磷酸盐，膦酸盐，亚磷酸盐，次膦酸盐，硫酸盐，磺酸盐，羧酸盐及其组合的侧悬链部分的聚合物。 施加到电路的电位使得基板被阳极氧化并与阴离子反应形成赋予金属表面增强性能的组合物。 优选地，电解溶液的pH值小于约6.0，所施加的电位在约0.5至约20伏特之间，并且电流密度介于金属的几何表面积的约0.01和2安培/ dm 2之间 并且被控制，使得通过所述构成金属的阳极氧化产生的所述构成金属的初生阳离子与金属表面上的所述阴离子反应，而不显着形成所述组成金属的任何氧化物或氢氧化物。
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公开(公告)号：US20080302668A1
公开(公告)日：2008-12-11
申请号：US12168680
申请日：2008-07-07
申请人： Andreas Konigshofen , Danica Elbick , Christoph Werner , Wolfgang Clauberg , Peter Pies , Andreas Mobius
发明人： Andreas Konigshofen , Danica Elbick , Christoph Werner , Wolfgang Clauberg , Peter Pies , Andreas Mobius
IPC分类号： C25D3/54
摘要： An electrolytic composition for the deposition of a matt metal layer onto a substrate and deposition process where the composition comprises a source of metal from the group consisting of Cr, Mn, Fe, Co, Ni, Cu, Zn, Ru, Rh, Pd, Ag, In, Sn, Sb, Re, Pt, Au, Bi, and combinations thereof; a substituted or unsubstituted polyalkylene oxide or its derivative as an emulsion and/or dispersion former; and a compound comprising fluorated or perfluorated hydrophobic chains or which is a polyalkylene oxide substituted quaternary ammonium compound as wetting agent; wherein the electrolytic composition forms a microemulsion and/or dispersion.
摘要翻译： 一种用于将无光泽金属层沉积到基底上的电解组合物和沉积工艺，其中所述组合物包含来自Cr，Mn，Fe，Co，Ni，Cu，Zn，Ru，Rh，Pd， Ag，In，Sn，Sb，Re，Pt，Au，Bi及其组合; 取代或未取代的聚环氧烷或其衍生物作为乳液和/或分散体; 和包含氟化或全氟化的疏水链的化合物或其是作为润湿剂的聚环氧烷取代的季铵化合物; 其中所述电解质组合物形成微乳液和/或分散体。
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公开(公告)号：US10988854B2
公开(公告)日：2021-04-27
申请号：US16709101
申请日：2019-12-10
申请人： Andreas Konigshofen , Maik Winkler
发明人： Andreas Konigshofen , Maik Winkler
摘要： The invention relates to a method for the adjustment of the lightness L* of electrolytically deposited chromium-finishes on workpieces obtained by an electroplating bath comprising at least chromium(III)-ions and sulfur containing organic compounds, wherein the concentration of the sulfur containing organic compounds in the bath are adjusted by passing at least part of the bath composition through an activated carbon filter. Furthermore, the invention is directed to dark chrome coatings comprising a defined concentration gradient of deposited sulfur containing organic compounds.
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公开(公告)号：US20060280872A1
公开(公告)日：2006-12-14
申请号：US11423474
申请日：2006-06-12
IPC分类号： B05D3/00
CPC分类号： C25D5/54 , C23C18/1653 , C23C18/2073 , C23C18/24 , C23C18/285 , C23C18/30 , C23C18/31 , H05K3/188
摘要： In the plating of non-conductive substrates, a metal-salt solution for treatment of such a substrate having been treated with a metal colloid for activation, and associated method for coating non-conductive substrates, characterized by reduced incrustation the associated equipment; the metal-salt solution comprising a metal that can be reduced by the metal of the metal colloid, a complexing agent, and a metal salt having a metal of the group consisting of lithium, sodium, calcium, rubidium, and cesium in the form of a salt selected from the group consisting of fluorides, chlorides, iodides, bromides, nitrates, sulphates, and mixtures thereof.
摘要翻译： 在非导电性基板的镀覆中，用金属胶体处理这种基板进行活化处理的金属盐溶液以及用于涂覆非导电性基板的相关方法，其特征在于减少了相关设备的结垢; 所述金属盐溶液包含可被所述金属胶体的金属还原的金属，络合剂和具有由锂，钠，钙，铷和铯组成的组的金属的金属盐，其形式为 选自氟化物，氯化物，碘化物，溴化物，硝酸盐，硫酸盐及其混合物的盐。
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6.发明申请公开(公告)号：US20080116076A1
公开(公告)日：2008-05-22
申请号：US11672670
申请日：2007-02-08
摘要： The present invention relates to a method for the metallization of an electrically non-conductive substrate using a thiosulfate conductor which employs a thiosulfate-containing conductor solution further comprising an alkali metal ion selected from the group consisting of lithium, potassium, rubidium, caesium, and combinations thereof.
摘要翻译： 本发明涉及一种使用硫代硫酸盐导体对不导电基材进行金属化的方法，所述硫代硫酸盐导体使用含硫代硫酸盐的导体溶液，该溶液还包含选自锂，钾，铷，铯的碱金属离子，和 其组合。
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