公开(公告)号：US07732242B2

公开(公告)日：2010-06-08

申请号：US11680171

申请日：2007-02-28

申请人： Markus Brunnbauer ,  Jesus Mennen Belonio ,  Edward Fuergut ,  Thorsten Meyer

发明人： Markus Brunnbauer ,  Jesus Mennen Belonio ,  Edward Fuergut ,  Thorsten Meyer

IPC分类号： H01L21/00

CPC分类号： H01L21/561 ,  H01L21/566 ,  H01L21/568 ,  H01L23/3185 ,  H01L24/96 ,  H01L2224/92 ,  H01L2924/01027 ,  H01L2924/01033 ,  H01L2924/01068 ,  H01L2924/01082 ,  H01L2924/14 ,  H01L2924/3511 ,  H01L2224/96 ,  H01L2224/82 ,  H01L2924/00

摘要： One aspect is a composite board including semiconductor chips in semiconductor device positions and a plastic housing composition partly embedding the semiconductor chips. A mould is provided for surrounding the semiconductor chips with plastic housing composition, the mould having a lower part and an upper part and a moldings cavity and the molding cavity having an upper contact area, which forms an interface with the top side of the plastic housing composition to be applied. The upper contact area is covered with a parting layer having essentially the same surface constitution and the same thermal conductivity as an adhesive film forming an interface with the underside of the plastic housing composition, with the result that a warpage of the composite board of less than 1% is obtained.

摘要翻译： 一个方面是包括半导体器件位置中的半导体芯片和部分地嵌入半导体芯片的塑料外壳组合物的复合板。 提供了一种用塑料外壳组合物围绕半导体芯片的模具，该模具具有下部和上部以及模制空腔，并且模制腔具有上部接触区域，该上部接触区域与塑料壳体的顶侧形成界面 要施用的组合物 上部接触区域覆盖有与塑料外壳组合物的下侧形成界面的与粘合膜基本相同的表面结构和相同导热性的分层，结果是复合板的翘曲小于 1％。

公开(公告)号：US07667333B2

公开(公告)日：2010-02-23

申请号：US11341884

申请日：2006-01-27

申请人： Laurence Edward Singleton ,  Alexander Wollanke ,  Jesus Mennen Belonio

发明人： Laurence Edward Singleton ,  Alexander Wollanke ,  Jesus Mennen Belonio

IPC分类号： H01L23/02

CPC分类号： H01L25/0657 ,  H01L2224/05001 ,  H01L2224/05024 ,  H01L2224/05026 ,  H01L2224/05548 ,  H01L2224/056 ,  H01L2224/16 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48465 ,  H01L2225/0651 ,  H01L2225/06517 ,  H01L2225/06527 ,  H01L2225/06555 ,  H01L2225/06575 ,  H01L2225/06586 ,  H01L2924/00014 ,  H01L2924/01078 ,  H01L2924/10253 ,  H01L2924/15311 ,  H01L2924/00 ,  H01L2224/05099

摘要： A stack of semiconductor chips includes a substrate or an interposer board comprising conductor structures for electrical connection of the stack and a first chip. The first chip includes an active side with peripherally arranged bonding pads and is mounted face-up on the substrate or the interposer board. The stack beyond includes at least a further chip with peripherally arranged bonding pads on its active side. The back side and at least two chip edges of the further chip are embedded by a mold cap providing a protuberance on the back side of the chip. The protuberance forms a planar surface extending substantially parallel and with a distance to the back side of the chip. The further chip is attached face-up to the active side of the first chip by an adhesive applied between the protuberance and the first chip so that the protuberance is inserted between both chips to provide a gap there. The protuberance has at least one linear dimension that is smaller than a linear dimension of the subjacent chip.

摘要翻译： 一堆半导体芯片包括衬底或内插器板，其包括用于电堆和第一芯片的电连接的导体结构。 第一芯片包括具有周边布置的焊盘的主动侧，并且面向上安装在基板或插入板上。 超过的堆叠包括至少另外的芯片，其活动侧上具有外围布置的焊盘。 另一芯片的背面和至少两个芯片边缘被模具盖嵌入，该模具帽在芯片的背面提供突起。 突起形成基本上平行延伸并且与芯片的背侧距离延伸的平坦表面。 通过施加在突起和第一芯片之间的粘合剂将另外的芯片面朝上连接到第一芯片的有源侧，使得突起插入两芯片之间以在其间提供间隙。 突起具有至少一个线性尺寸小于下面的芯片的线性尺寸。

公开(公告)号：US20070279877A1

公开(公告)日：2007-12-06

申请号：US11443494

申请日：2006-05-30

申请人： Stephan Dobritz ,  Jesus Mennen Belonio ,  Ingolf Rau ,  Axel Sachse

发明人： Stephan Dobritz ,  Jesus Mennen Belonio ,  Ingolf Rau ,  Axel Sachse

IPC分类号： H05K7/00

CPC分类号： H05K5/065 ,  H01L2224/16227 ,  H01L2924/15333 ,  H01L2924/1815 ,  H01L2924/19106 ,  H05K1/117 ,  H05K1/181 ,  H05K3/284 ,  H05K2201/10159 ,  H05K2203/1316 ,  H05K2203/1572

摘要： A circuit board arrangement having a circuit board with a contact strip formed on a side edge and with at least one electronic component, electrically connected to the circuit board, on each of the component sides, the outer contour of the circuit board arrangement being formed by an encapsulating case molded in one piece onto the circuit board and essentially enclosing the circuit board, and the contact strip protruding from the encapsulating case.

摘要翻译： 一种电路板装置，具有电路板，该电路板具有在侧边缘上形成的接触带，并且在每个部件侧上与电路板电连接至少一个电子部件，电路板布置的外部轮廓由 封装壳体一体地模制到电路板上并且基本上包围电路板，以及从封装壳体突出的接触条。