公开(公告)号：US20150303082A1

公开(公告)日：2015-10-22

申请号：US14374244

申请日：2012-03-16

申请人： Markus WIMPLINGER ,  Alfred SIGL

发明人： Markus WIMPLINGER ,  Alfred SIGL

IPC分类号： H01L21/67 ,  H01L23/00 ,  H01L21/687

CPC分类号： H01L21/67144 ,  H01L21/68771 ,  H01L21/68778 ,  H01L24/75 ,  H01L24/89 ,  H01L24/97 ,  H01L2224/75251 ,  H01L2224/75252 ,  H01L2224/75316 ,  H01L2224/75317 ,  H01L2224/75318 ,  H01L2224/7532 ,  H01L2224/757 ,  H01L2224/75704 ,  H01L2224/75724 ,  H01L2224/75744 ,  H01L2224/75822 ,  H01L2224/75823 ,  H01L2224/75824 ,  H01L2224/7598 ,  H01L2224/9205 ,  H01L2224/94 ,  H01L2224/97 ,  H01L2924/351 ,  H01L2924/00

摘要： This invention relates to a pressure transmission apparatus for bonding a plurality of chips to a substrate. The pressure transmission apparatus includes a pressure body for applying a bonding force which acts in the bonding direction (B) to the chip. The pressure body has a first pressure side and an opposite second pressure side, both oriented to be transverse to the bonding direction (B). Fixing means are provided to attach to the periphery of the pressure transmission apparatus for fixing of the pressure transmission apparatus on a retaining body in the bonding direction (B). A sliding layer is provided for sliding motion of the pressure body transversely to the bonding direction (B).

摘要翻译： 本发明涉及将多个芯片接合到基板上的压力传递装置。 压力传递装置包括用于将与键合方向（B）作用的接合力施加到芯片的压力体。 压力体具有第一压力侧和相对的第二压力侧，两者均定向成横向于接合方向（B）。 提供固定装置以附接到压力传递装置的周边，用于将压力传递装置固定在粘合方向（B）上的保持体上。 提供滑动层，用于使压力体横向于接合方向（B）滑动。