Abstract:
A method for preventing undesired communication with a target computer across a distributed network. At least one rule regarding electronic communication is stored. Electronic communications are monitored at a server. The server applies at least one rule to the electronic communication. The server controls the electronic communications with the target computer and the source of the electronic communications as a function of the rule.
Abstract:
The present invention comprises a modular telemedicine system with a universal adapter that connects diagnostic, identification and audiovisual communication function modules, at least one of which is present at the patient's location, to a variable process module that performs data transmission, processing and output. The connection of the system, which can be used anywhere, to a physician's receiving center facilitates the mobile telemedical treatment of patients. Preferably, the system comprises a plurality of function modules for the recording of data. Simplified, basic operation of all function modules is made possible through a hard-wired connection between the function module and the universal adapter, and data can be transmitted to corresponding process modules wirelessly or hard-wired. Each function module can be used separately or in combination with the universal adapter and the process module. The function module and universal adapter have a central processor for data processing and non-mechanical storage elements for data storage as well as control and signaling elements on the outside of the module for operation.
Abstract:
A fill pack for heat and mass transfer in counter-flow, in particular for the cooling of water in cooling towers by air, is provided. The fill pack includes a plurality of vertically or obliquely positioned corrugated or folded sheets or plates which are superposed and joined to each other in such a manner that the corrugations or folds of adjoining sheets cross each other only in the upper part of the fill pack, while the corrugations or folds of adjoining sheets are generally parallel to each other in the lower part of the fill pack.
Abstract:
The invention relates to an arrangement comprising a shunt resistor with at least an electrically conductive first connecting leg and an electrically conductive second connecting leg. A resistance area of the shunt resistor is electrically connected to the first connecting leg and to the second connecting leg. The arrangement further comprises a circuit carrier with a first metallization and a second metallization. The first connecting leg is directly joined to the first metallization and the second connecting leg is directly joined to the second metallization. The resistance area of the shunt resistor is in thermal contact with the thermally conductive substrate by use of a thermal filler arranged between the resistance area and the substrate, and/or by directly contacting the resistance area with the substrate.The invention further relates to a method for producing an arrangement with a shunt resistor and a circuit carrier.