公开(公告)号：US20220413215A1

公开(公告)日：2022-12-29

申请号：US17901182

申请日：2022-09-01

Applicant: Marvell Asia Pte Ltd.

Inventor： Jie LIN ,  Masaki Kato ,  Bruno Tourette ,  Brian Taylor

IPC: G02B6/12 ,  H04B10/43 ,  H04B10/61

Abstract: A circuit for detecting an optical data signal includes a photonics substrate and first and second photodiodes formed in the photonics substrate. The first photodiode is configured to receive, via an input port formed in the photonics substrate, a first portion of the optical data signal and convert light power of the first portion of the optical data signal to generate a first current based on the optical data signal. The second photodiode is configured to output a second current without receiving any portion of the optical data signal. The second current corresponds to a dark current induced in the second photodiode. The circuit is configured to subtract the second current from the first current to generate an output signal corresponding to a power of the optical data signal without dark current induced in the first photodiode.

公开(公告)号：US11740406B2

公开(公告)日：2023-08-29

申请号：US17901182

申请日：2022-09-01

Applicant: Marvell Asia Pte Ltd.

Inventor： Jie Lin ,  Masaki Kato ,  Bruno Tourette ,  Brian Taylor

IPC: G02B6/12 ,  H04B10/43 ,  H04B10/61

CPC classification number: G02B6/12019 ,  H04B10/43 ,  H04B10/6165

Abstract: A circuit for detecting an optical data signal includes a photonics substrate and first and second photodiodes formed in the photonics substrate. The first photodiode is configured to receive, via an input port formed in the photonics substrate, a first portion of the optical data signal and convert light power of the first portion of the optical data signal to generate a first current based on the optical data signal. The second photodiode is configured to output a second current without receiving any portion of the optical data signal. The second current corresponds to a dark current induced in the second photodiode. The circuit is configured to subtract the second current from the first current to generate an output signal corresponding to a power of the optical data signal without dark current induced in the first photodiode.

公开(公告)号：US11287586B2

公开(公告)日：2022-03-29

申请号：US17095269

申请日：2020-11-11

Applicant: Marvell Asia Pte Ltd.

Inventor： Chris Togami ,  Radhakrishnan L. Nagarajan ,  Gary Sasser ,  Brian Taylor

IPC: G02B6/42 ,  F28F1/14 ,  H05K7/20

Abstract: An apparatus for dissipating heat from a photonic transceiver module. The apparatus includes a top-plate member disposed in a length direction of a package for the photonic transceiver module. The apparatus further includes multiple fins formed on the top-plate member along the length direction from a backend position to a frontend position except at least one fin with a shorter length, forming an elongated void from the backend position to one backend of the at least one fin. Additionally, the apparatus includes a cover member disposed over the multiple fins with a horizontal sheet, two vertical side sheets, and a flange bent vertically from a middle portion of backend of the horizontal sheet. Furthermore, the apparatus includes a spring loaded in the elongated void between the flange and the one backend of the at least one fin to minimize an air gap at the backend of the horizontal sheet.

公开(公告)号：USD933617S1

公开(公告)日：2021-10-19

申请号：US29705640

申请日：2019-09-13

Applicant: MARVELL ASIA PTE, LTD.

Designer： Chris Togami ,  Radhakrishnan L. Nagarajan ,  Gary Sasser ,  Brian Taylor

公开(公告)号：USD1049064S1

公开(公告)日：2024-10-29

申请号：US29811314

申请日：2021-10-13

Applicant: MARVELL ASIA PTE, LTD.

Designer： Chris Togami ,  Radhakrishnan L. Nagarajan ,  Gary Sasser ,  Brian Taylor

Abstract: FIG. 1 shows a perspective view of a heat sink cover according to the new design.
FIG. 2 is a top plane view of the heat sink cover of FIG. 1.
FIG. 3 is a bottom plane view of the heat sink cover of FIG. 1.
FIG. 4 is a left side elevational view of the heat sink cover of FIG. 1.
FIG. 5 is a right side elevational view of the heat sink cover of FIG. 1.
FIG. 6 is a front side elevational view of the heat sink cover of FIG. 1; and,
FIG. 7 is a back side elevational view of the heat sink cover of FIG. 1.

公开(公告)号：US11809003B2

公开(公告)日：2023-11-07

申请号：US17706492

申请日：2022-03-28

Applicant: Marvell Asia Pte Ltd.

Inventor： Chris Togami ,  Radhakrishnan L. Nagarajan ,  Gary Sasser ,  Brian Taylor

IPC: G02B6/42 ,  H05K7/20 ,  F28F1/14

CPC classification number: G02B6/4269 ,  F28F1/14 ,  H05K7/2049 ,  F28F2215/08 ,  F28F2275/14

Abstract: An apparatus for dissipating heat from a photonic transceiver module. The apparatus includes a top-plate member disposed in a length direction of a package for the photonic transceiver module. The apparatus further includes multiple fins formed on the top-plate member along the length direction from a backend position to a frontend position except at least one fin with a shorter length, forming an elongated void from the backend position to one backend of the at least one fin. Additionally, the apparatus includes a cover member disposed over the multiple fins with a horizontal sheet, two vertical side sheets, and a flange bent vertically from a middle portion of backend of the horizontal sheet. Furthermore, the apparatus includes a spring loaded in the elongated void between the flange and the one backend of the at least one fin to minimize an air gap at the backend of the horizontal sheet.

公开(公告)号：US11575245B2

公开(公告)日：2023-02-07

申请号：US16805526

申请日：2020-02-28

Applicant: Marvell Asia Pte. Ltd.

Inventor： Xiaoguang He ,  Radhakrishnan L. Nagarajan ,  Brian Taylor

IPC: G02F1/01 ,  H01S5/10 ,  H01S5/323 ,  H01S5/028 ,  H01S5/0234

Abstract: A thin-film device for a wavelength-tunable semiconductor laser. The device includes a cavity between a high-reflectivity facet and an anti-reflection facet designed to emit a laser light of a wavelength in a tunable range determined by two Vernier-ring resonators with a joint-free-spectral-range between a first wavelength and a second wavelength. The device further includes a film including multiple pairs of a first layer and a second layer sequentially stacking to an outer side of the high-reflectivity facet. Each layer in each pair has one unit of respective optical thickness except one first or second layer in one pair having a larger optical thickness. The film is configured to produce inner reflectivity of the laser light from the high-reflectivity facet at least >90% for wavelengths in the tunable range starting from the first wavelength but at least

公开(公告)号：US11460634B2

公开(公告)日：2022-10-04

申请号：US17012629

申请日：2020-09-04

Applicant: Marvell Asia Pte, Ltd.

Inventor： Jie Lin ,  Masaki Kato ,  Bruno Tourette ,  Brian Taylor

IPC: G02B6/12 ,  H04B10/43 ,  H04B10/61

Abstract: A method for making a pair of photodiodes to detect low-power optical signal includes providing a waveguide including one or more branches in a silicon photonics substrate to deliver an input optical signal to the silicon photonics integrated circuit; forming a pair of nearly redundant photodiodes in silicon photonics platform in the silicon photonics substrate. coupling a first one of the pair of nearly redundant photodiodes optically to each of the one or more branches for receiving the input optical signal combined from all of the one or more branches; coupling a second one of the pair of nearly redundant photodiodes electrically in series to the first one of the pair of nearly redundant photodiodes; and drawing a current from the first one of the pair of nearly redundant photodiodes under a reversed bias voltage applied to the pair of nearly redundant photodiodes.