公开(公告)号：US20240353697A1

公开(公告)日：2024-10-24

申请号：US18626916

申请日：2024-04-04

申请人： FUJITSU OPTICAL COMPONENTS LIMITED

发明人： Kensuke OGAWA

IPC分类号： G02F1/025 ,  G02F1/015 ,  H04B10/43

CPC分类号： G02F1/025 ,  G02F1/0155 ,  H04B10/43

摘要： An optical modulator element includes a rib optical waveguide, a first thin film, a first high-concentration doped region, and a first metal electrode. The rib optical waveguide includes a rib portion having a PN junction, a P-type slab region connected to a P-type region of the rib portion, and an N-type slab region connected to an N-type region of the rib portion. The first thin film is formed on the P-type slab region and has electron affinity different from electron affinity of a material for the P-type slab region. The first high-concentration doped region is a region in the P-type slab region, the region being at a position separate from the rib portion. The first metal electrode is electrically connected to the first high-concentration doped region positioned outward in the P-type slab region having the first thin film formed over the P-type slab region.

公开(公告)号：US12107629B2

公开(公告)日：2024-10-01

申请号：US18087004

申请日：2022-12-22

申请人： Ciena Corporation

发明人： Eric S. Maniloff ,  Sebastien Gareau ,  Benard J. Rhody

IPC分类号： H04B10/43 ,  H04B10/524

CPC分类号： H04B10/43 ,  H04B10/524

摘要： An optical module includes a transmitter assembly; a receiver assembly; and circuitry connected to the transmitter assembly and the receiver assembly, wherein the circuity is configured to, responsive to a test of delay in one or more of the transmitter assembly and the receiver assembly, store a delay value for one or more of the transmitter assembly and the receiver assembly, and, responsive to a query of the delay, provide the stored delay value for each of the transmitter assembly and the receiver assembly. The circuitry can be further configured to perform the test of delay via inserting an event that is used for timing detection at a corresponding receiver assembly.

公开(公告)号：US20240305378A1

公开(公告)日：2024-09-12

申请号：US18118496

申请日：2023-03-07

申请人： Jan Filip

发明人： Jan Filip

IPC分类号： H04B10/43 ,  H04B10/61 ,  H04J14/02 ,  H04J14/06

CPC分类号： H04B10/43 ,  H04B10/614 ,  H04J14/0279 ,  H04J14/06

摘要： A data communication cable assembly, comprising: a first connector configured to connect to a first device, including a first coherent optical transmitter configured to: receive a first electrical data signal from the first device; and coherently modulate a first optical carrier with the first electrical data signal to generate a first optical data signal; a cable including a first end mechanically coupled to the first connector, wherein the cable comprises at least one optical fiber; and a second connector mechanically coupled to a second end of the cable, and configured to connect to a second device, including a first coherent optical receiver configured to: receive the first optical data signal from the first coherent optical transmitter via the at least one optical fiber; and coherently demodulate the first optical data signal using the first or a second optical carrier to regenerate the first electrical data signal for the second device.

公开(公告)号：US11916579B2

公开(公告)日：2024-02-27

申请号：US16945167

申请日：2020-07-31

申请人： Infinera Corporation

发明人： Franklin Wall, Jr.

IPC分类号： H04B1/036 ,  H04B10/116 ,  H05K7/20 ,  H04B1/3827 ,  H04B10/43

CPC分类号： H04B1/036 ,  H04B1/3827 ,  H04B10/116 ,  H04B10/43 ,  H05K7/20409

摘要： An optical transceiver with a built-in heat transfer structure is described. The heat transfer structure can connect one or more circuit regions of the optical transceiver to a heat sink while bypassing circuit regions that may impede the transfer of heat from the one or more circuit regions. The heat transfer structure may directly contact the one or more circuit regions, and the heat sink and may include an opening to avoid contact with the circuit regions to be bypassed.

公开(公告)号：US11876554B2

公开(公告)日：2024-01-16

申请号：US17865164

申请日：2022-07-14

申请人： Mitsubishi Electric Corporation

发明人： Masashi Binkai ,  Tsuyoshi Yoshida

IPC分类号： H04B10/00 ,  H04B10/077 ,  H04B10/073 ,  H04B10/43 ,  H04B10/50 ,  H04J14/02 ,  H04J14/00

CPC分类号： H04B10/077 ,  H04B10/0731 ,  H04B10/43 ,  H04B10/50 ,  H04J14/02

摘要： An optical transceiver includes processing circuitry to calculate, when test signals are sent to a transmission line from a transmitter and a receiver receives the test signals having passed through a wavelength filter, a bandwidth of the received test signals, the transmitter generating, as the test signals, a collection of narrowband signals, the narrowband signals having a narrower bandwidth than a bandwidth of the wavelength filter and having different frequencies, and the wavelength filter included in an optical splitter inserted in the transmission line, and the collection of narrowband signals including a narrowband signal having a higher frequency than a highest frequency in the bandwidth of the wavelength filter and a narrowband signal having a lower frequency than a lowest frequency in the bandwidth of the wavelength filter, and to determine a modulation rate and a modulation level of the transmission signal depending on the calculated bandwidth.

公开(公告)号：US11756789B2

公开(公告)日：2023-09-12

申请号：US17561010

申请日：2021-12-23

申请人： TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD.

发明人： Yung-Yao Lee ,  Wen-Chih Wang

IPC分类号： H01L21/027 ,  G03F1/38 ,  G03F7/095 ,  G03F1/70 ,  H01L21/033 ,  H04B10/43 ,  H01L31/12 ,  G02B6/42 ,  H01L21/768 ,  G03F7/20 ,  G01N21/956 ,  G03F7/00

CPC分类号： H01L21/0273 ,  G02B6/4204 ,  G03F1/38 ,  G03F1/70 ,  G03F7/095 ,  G03F7/70033 ,  G03F7/70716 ,  H01L21/0274 ,  H01L21/0332 ,  H01L21/76816 ,  H01L31/125 ,  H04B10/43 ,  G01N2021/95676

摘要： The present disclosure provides an apparatus for manufacturing a semiconductor structure. The apparatus includes a stage, an optical transceiver over the stage, configured to obtain a first profile of a first surface of a substrate, an acoustic transceiver over the stage, configured to obtain a second profile of a top surface of a photo-sensitive layer over the substrate, wherein the stage is adapted to be displaced based on the first profile and the second profile.

公开(公告)号：US20230253760A1

公开(公告)日：2023-08-10

申请号：US18134573

申请日：2023-04-14

申请人： ZHEJIANG LAB

发明人： Qiang ZHANG ,  Hui YU

IPC分类号： H01S5/125 ,  H01S5/14 ,  H04B10/43 ,  H01S5/22

CPC分类号： H01S5/125 ,  H01S5/141 ,  H04B10/43 ,  H01S5/2216

摘要： A 6.4 Tbps silicon-based photonics engine transceiver chip module for high-speed optical communication manufactured based on processing techniques of semiconductors such as silicon-on-insulator (SOI) and indium phosphide (InP). The photonics engine transceiver chip module uses a silicon photonic chip as a substrate, and optical chips of an InP laser and an optical amplifier are heterogeneously integrated with the silicon photonic chip through bonding or flip-chip soldering. As a pump light source, the laser generates a soliton-based optical frequency comb by using an ultra-low loss silicon nitride (SiN) resonator cavity, and can be used as a multi-wavelength laser. This reduces use of a single-wavelength laser chip, reduces a power consumption and heat conduction of a laser in an optical chip of a photonic engine, and improves an integration level of an optical device. The optical frequency comb generates an optical carrier with wide bandwidth coverage and a large quantity of wavelengths.

公开(公告)号：US20190158184A1

公开(公告)日：2019-05-23

申请号：US16254070

申请日：2019-01-22

申请人： Multidyne Electronics, Inc.

发明人： Francis P. Jachetta ,  Jesse Lloyd Maxwell Kent ,  Eugene Evan Baker

IPC分类号： H04B10/43 ,  G02B6/42 ,  H04B10/80

CPC分类号： H04B10/43 ,  G02B6/4246 ,  G02B6/4261 ,  G02B6/4284 ,  G02B6/4292 ,  H04B10/801

摘要： An apparatus includes a first transmitter/receiver module having a housing defining a longitudinal axis and with opposed first and second longitudinal sides extending along the longitudinal axis. The housing includes a first interlocking structure disposed along the first longitudinal side and having a first power interface, a second interlocking structure disposed along the second longitudinal side and having a second power interface, and first and second signal connectors positioned at respective first and second ends of the housing. The first transmitter/receiver module is configured to assume a mated condition in stacked coupled relation with one or more additional transmitter/receiver modules through cooperative engagement of at least one of the first and second interlocking structures of the first transmitter/receiver module with corresponding complementary interlocking structure arranged on a longitudinal side of a housing of one of the additional transmitter/receiver modules.

公开(公告)号：US20190123829A1

公开(公告)日：2019-04-25

申请号：US16229694

申请日：2018-12-21

申请人： Luxtera, Inc.

发明人： Greg Young ,  Peter DeDobbelaere

IPC分类号： H04B10/40 ,  G02B6/42 ,  H04J14/02 ,  G02B6/12 ,  G02B6/30 ,  H04L29/06 ,  H04J14/04 ,  H04B10/80 ,  H04B10/2581

CPC分类号： H04B10/40 ,  G02B6/12 ,  G02B6/30 ,  G02B6/4204 ,  G02B6/4213 ,  G02B6/4215 ,  G02B6/4246 ,  G02B6/425 ,  H04B10/2581 ,  H04B10/43 ,  H04B10/802 ,  H04J14/02 ,  H04J14/0202 ,  H04J14/04 ,  H04L69/18

摘要： Methods and systems for selectable parallel optical fiber and WDM operation may include an optoelectronic transceiver integrated in a silicon photonics die. The optoelectronic transceiver may, in a first communication mode, communicate continuous wave (CW) optical signals from an optical source module to a first subset of optical couplers on the die for processing signals in optical modulators in accordance with a first communications protocol, and in a second communication mode, communicate the CW optical signals to a second subset of optical couplers for processing signals in the optical modulators in accordance with a second communications protocol. Processed signals may be transmitted out of the die utilizing a third subset of the optical couplers. First or second protocol optical signals may be received from the fiber interface coupled to a fourth subset or a fifth subset, respectively, of the optical couplers.

公开(公告)号：US20180196139A1

公开(公告)日：2018-07-12

申请号：US15863392

申请日：2018-01-05

申请人： 8 RIVERS CAPITAL, LLC

发明人： William J. Brown ,  Hannah Clark ,  Michael W. Adams ,  Glenn William Brown, JR. ,  Miles R. Palmer

IPC分类号： G01S17/87 ,  H04B10/112 ,  G01S17/10 ,  H04B10/43 ,  H04B10/50

CPC分类号： G01S17/87 ,  G01S7/006 ,  G01S7/4804 ,  G01S17/10 ,  G01S17/89 ,  H01Q5/22 ,  H01S3/005 ,  H04B10/1127 ,  H04B10/1129 ,  H04B10/116 ,  H04B10/43 ,  H04B10/503 ,  H04W84/18

摘要： A system and method are provided that sit at the intersection of high bandwidth mobile communications and light detection and ranging (LIDAR). The system and method expand on a diverged-beam free space optical system (DBFSO) and solves the LIDAR cost problem by describing a combined LIDAR/DBFSO system. One integrated hardware system provides the capability of both LIDAR and DBFSO, and in many configurations, both capabilities can operate at the same time, while reducing cost and complexity associated with two separate systems. The system can be stationary or mobile, and apply to both scanning and fixed configurations.