CAPACITOR
    1.
    发明申请
    CAPACITOR 有权
    电容器

    公开(公告)号:US20130109234A1

    公开(公告)日:2013-05-02

    申请号:US13287908

    申请日:2011-11-02

    IPC分类号: H01R13/7197 H01G4/06

    CPC分类号: H01R13/7197

    摘要: An electrical contact includes a body having a mating segment. At least a portion of the mating segment defines a first conductive element having a three-dimensional (3D) surface. A dielectric layer is formed directly on the 3D surface of the first conductive element in engagement with the 3D surface. A second conductive element is formed on the dielectric layer such that the dielectric layer extends between the first and second conductive elements. The first and second conductive elements and the dielectric layer form a capacitor.

    摘要翻译: 电触点包括具有配合部分的主体。 配合段的至少一部分限定具有三维(3D)表面的第一导电元件。 电介质层直接形成在与3D表面接合的第一导电元件的3D表面上。 第二导电元件形成在电介质层上,使得电介质层在第一和第二导电元件之间延伸。 第一和第二导电元件和电介质层形成电容器。

    CONTACT ASSEMBLY FOR AN ELECTRICAL CONNECTOR AND METHOD OF MANUFACTURING THE CONTACT ASSEMBLY
    3.
    发明申请
    CONTACT ASSEMBLY FOR AN ELECTRICAL CONNECTOR AND METHOD OF MANUFACTURING THE CONTACT ASSEMBLY 有权
    用于电连接器的接触组件和制造接触组件的方法

    公开(公告)号:US20120149257A1

    公开(公告)日:2012-06-14

    申请号:US13399528

    申请日:2012-02-17

    IPC分类号: H01R13/02 H01R43/16

    摘要: A contact assembly includes a conductive substrate, a composite layer, and a conductive layer. The conductive substrate is configured to form a conductive path of the electrical connector. The composite layer is engaged to the conductive substrate and includes a dielectric material with a conductive filler material dispersed within the dielectric material at a concentration that is lower than a percolation threshold concentration of the composite layer. The conductive layer is engaged to the composite layer. The conductive substrate, the composite layer, and the conductive layer form a capacitive element through which a signal propagation path between the conductive substrate and a mating contact that mates with the conductive layer passes.

    摘要翻译: 接触组件包括导电基底,复合层和导电层。 导电衬底被配置为形成电连接器的导电路径。 复合层与导电基片接合并且包括介电材料,导电填充材料以低于复合层渗滤阈值浓度的浓度分散在电介质材料内。 导电层与复合层接合。 导电衬底,复合层和导电层形成电容元件,通过该电容元件,导电衬底与与导电层相配合的配合触点之间的信号传播路径通过。