公开(公告)号：US07553162B2

公开(公告)日：2009-06-30

申请号：US11915349

申请日：2006-05-25

申请人： Masaaki Isoda ,  Kazuhiro Takamura ,  Tokushi Yamauchi ,  Katsuyuki Kiyozumi ,  Nobumichi Nishihama

发明人： Masaaki Isoda ,  Kazuhiro Takamura ,  Tokushi Yamauchi ,  Katsuyuki Kiyozumi ,  Nobumichi Nishihama

IPC分类号： F21V21/00

CPC分类号： F21V29/56 ,  F21K9/00 ,  F21S2/005 ,  F21V19/0025 ,  F21V23/06 ,  F21Y2115/10 ,  H01R13/22 ,  H01R13/514 ,  H05K1/0204 ,  H05K1/142 ,  H05K1/183 ,  H05K2201/09163 ,  H05K2201/09845 ,  H05K2201/10106 ,  H05K2201/10416 ,  H05K2201/209 ,  Y10S439/928

摘要： The present invention relates to a socket for electronic component which contains an electronic component. The socket for electronic component comprises a platy base, containers formed to be concaved on a front face of the base and to contain LED packages therein, connectors provided on side faces and connected to other members, supports each of which supports and fixes the LED package contained in the container and electrically connected to the LED package, heat conductors each of which is provided continuously from a bottom face side of the container to a rear face of the base and contacts the LED package contained in the container so as to conduct heat generated by the LED package, and terminals electrically connected to the other members coupled with the connectors and the supports. The heat generated by the LED package is conducted to the rear face of the base through the heat conductors, and effectively radiated to an installation member on which the socket for electronic component is mounted.

摘要翻译： 本发明涉及一种包含电子部件的电子部件用插座。 用于电子部件的插座包括板状基座，形成为凹陷在基座的前表面上并容纳LED封装的容器，设置在侧面上并连接到其它构件的连接器，每个支撑件支撑并固定LED封装 容纳在容器中并电连接到LED封装的导热体，每个热导体从容器的底面侧连续地设置到基座的后表面，并与容纳在容器中的LED封装体接触，以便产生热量 通过LED封装，以及电连接到与连接器和支撑件耦合的其它构件的端子。 由LED封装产生的热量通过导热体传导到基座的后表面，并有效地辐射到安装有用于电子部件的插座的安装部件上。

公开(公告)号：US20080220631A1

公开(公告)日：2008-09-11

申请号：US11915349

申请日：2006-05-25

申请人： Masaaki Isoda ,  Kazuhiro Takamura ,  Tokushi Yamauchi ,  Katsuyuki Kiyozumi ,  Nobumichi Nishihama

发明人： Masaaki Isoda ,  Kazuhiro Takamura ,  Tokushi Yamauchi ,  Katsuyuki Kiyozumi ,  Nobumichi Nishihama

IPC分类号： H01R12/00

CPC分类号： F21V29/56 ,  F21K9/00 ,  F21S2/005 ,  F21V19/0025 ,  F21V23/06 ,  F21Y2115/10 ,  H01R13/22 ,  H01R13/514 ,  H05K1/0204 ,  H05K1/142 ,  H05K1/183 ,  H05K2201/09163 ,  H05K2201/09845 ,  H05K2201/10106 ,  H05K2201/10416 ,  H05K2201/209 ,  Y10S439/928

摘要： The present invention relates to a socket for electronic component which contains an electronic component. The socket for electronic component comprises a platy base, containers formed to be concaved on a front face of the base and to contain LED packages therein, connectors provided on side faces and connected to other members, supports each of which supports and fixes the LED package contained in the container and electrically connected to the LED package, heat conductors each of which is provided continuously from a bottom face side of the container to a rear face of the base and contacts the LED package contained in the container so as to conduct heat generated by the LED package, and terminals electrically connected to the other members coupled with the connectors and the supports. The heat generated by the LED package is conducted to the rear face of the base through the heat conductors, and effectively radiated to an installation member on which the socket for electronic component is mounted.

摘要翻译： 本发明涉及一种包含电子部件的电子部件用插座。 用于电子部件的插座包括板状基座，形成为凹陷在基座的前表面上并容纳LED封装的容器，设置在侧面上并连接到其它构件的连接器，每个支撑件支撑并固定LED封装 容纳在容器中并电连接到LED封装的导热体，每个热导体从容器的底面侧连续地设置到基座的后表面，并与容纳在容器中的LED封装体接触，以便产生热量 通过LED封装，以及电连接到与连接器和支撑件耦合的其它构件的端子。 由LED封装产生的热量通过导热体传导到基座的后表面，并有效地辐射到安装有用于电子部件的插座的安装部件上。