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公开(公告)号：US08766313B2
公开(公告)日：2014-07-01
申请号：US13581135
申请日：2011-02-23
IPC分类号： H01L33/00
CPC分类号： H01L33/62 , H01L33/64 , H01L2224/48091 , H01L2224/48227 , H01L2924/00014
摘要： A mounting board including a pair of patterned electrodes, a lower surface and an upper surface opposed thereto on which a substrate of an electronic component is to be mounted, a pass-through hole penetrating through the upper surface and the lower surface, and a peripheral side surface that defines the pass-through hole. The pass-through hole includes a plurality of penetrating grooves that are cut into the mounting board and penetrate through the upper and lower surfaces. The plurality of penetrating grooves electrically split the pair of patterned electrodes. The pair of patterned electrodes is partly positioned inside the peripheral side surface, and a connection portion connecting the at least one pair of patterned electrodes and at least one pair of patterned electrodes provided on the upper surface of the substrate of the electronic component is to be disposed inside the peripheral side surface that defines the pass-through hole.
摘要翻译： 一种安装板，包括一对图案化电极，下表面和与其相对的上表面，其上安装有电子部件的基板，贯穿上表面和下表面的通孔， 侧表面限定了通孔。 贯通孔包括多个穿透槽，该贯通槽被切入安装板并穿过上表面和下表面。 多个穿透槽电分离该对图案化电极。 该一对构图电极部分地位于周边侧表面内，并且连接至少一对图形化电极的连接部分和设置在电子部件的基板的上表面上的至少一对图案化电极为 设置在限定通孔的周边侧表面内。
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公开(公告)号：US20120313135A1
公开(公告)日：2012-12-13
申请号：US13581135
申请日：2011-02-23
CPC分类号： H01L33/62 , H01L33/64 , H01L2224/48091 , H01L2224/48227 , H01L2924/00014
摘要： A mounting board including a pair of patterned electrodes, a lower surface and an upper surface opposed thereto on which a substrate of an electronic component is to be mounted, a pass-through hole penetrating through the upper surface and the lower surface, and a peripheral side surface that defines the pass-through hole. The pass-through hole includes a plurality of penetrating grooves that are cut into the mounting board and penetrate through the upper and lower surfaces. The plurality of penetrating grooves electrically split the pair of patterned electrodes. The pair of patterned electrodes is partly positioned inside the peripheral side surface, and a connection portion connecting the at least one pair of patterned electrodes and at least one pair of patterned electrodes provided on the upper surface of the substrate of the electronic component is to be disposed inside the peripheral side surface that defines the pass-through hole.
摘要翻译： 一种安装板，包括一对图案化电极，下表面和与其相对的上表面，其上安装有电子部件的基板，贯穿上表面和下表面的通孔， 侧表面限定了通孔。 贯通孔包括多个穿透槽，该贯通槽被切入安装板并穿过上表面和下表面。 多个穿透槽电分离该对图案化电极。 该一对构图电极部分地位于周边侧表面内，并且连接至少一对图形化电极的连接部分和设置在电子部件的基板的上表面上的至少一对图案化电极为 设置在限定通孔的周边侧表面内。
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公开(公告)号：US20080220631A1
公开(公告)日：2008-09-11
申请号：US11915349
申请日：2006-05-25
申请人： Masaaki Isoda , Kazuhiro Takamura , Tokushi Yamauchi , Katsuyuki Kiyozumi , Nobumichi Nishihama
发明人： Masaaki Isoda , Kazuhiro Takamura , Tokushi Yamauchi , Katsuyuki Kiyozumi , Nobumichi Nishihama
IPC分类号： H01R12/00
CPC分类号： F21V29/56 , F21K9/00 , F21S2/005 , F21V19/0025 , F21V23/06 , F21Y2115/10 , H01R13/22 , H01R13/514 , H05K1/0204 , H05K1/142 , H05K1/183 , H05K2201/09163 , H05K2201/09845 , H05K2201/10106 , H05K2201/10416 , H05K2201/209 , Y10S439/928
摘要： The present invention relates to a socket for electronic component which contains an electronic component. The socket for electronic component comprises a platy base, containers formed to be concaved on a front face of the base and to contain LED packages therein, connectors provided on side faces and connected to other members, supports each of which supports and fixes the LED package contained in the container and electrically connected to the LED package, heat conductors each of which is provided continuously from a bottom face side of the container to a rear face of the base and contacts the LED package contained in the container so as to conduct heat generated by the LED package, and terminals electrically connected to the other members coupled with the connectors and the supports. The heat generated by the LED package is conducted to the rear face of the base through the heat conductors, and effectively radiated to an installation member on which the socket for electronic component is mounted.
摘要翻译： 本发明涉及一种包含电子部件的电子部件用插座。 用于电子部件的插座包括板状基座，形成为凹陷在基座的前表面上并容纳LED封装的容器，设置在侧面上并连接到其它构件的连接器，每个支撑件支撑并固定LED封装 容纳在容器中并电连接到LED封装的导热体，每个热导体从容器的底面侧连续地设置到基座的后表面，并与容纳在容器中的LED封装体接触，以便产生热量 通过LED封装，以及电连接到与连接器和支撑件耦合的其它构件的端子。 由LED封装产生的热量通过导热体传导到基座的后表面，并有效地辐射到安装有用于电子部件的插座的安装部件上。
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公开(公告)号：US07553162B2
公开(公告)日：2009-06-30
申请号：US11915349
申请日：2006-05-25
申请人： Masaaki Isoda , Kazuhiro Takamura , Tokushi Yamauchi , Katsuyuki Kiyozumi , Nobumichi Nishihama
发明人： Masaaki Isoda , Kazuhiro Takamura , Tokushi Yamauchi , Katsuyuki Kiyozumi , Nobumichi Nishihama
IPC分类号： F21V21/00
CPC分类号： F21V29/56 , F21K9/00 , F21S2/005 , F21V19/0025 , F21V23/06 , F21Y2115/10 , H01R13/22 , H01R13/514 , H05K1/0204 , H05K1/142 , H05K1/183 , H05K2201/09163 , H05K2201/09845 , H05K2201/10106 , H05K2201/10416 , H05K2201/209 , Y10S439/928
摘要： The present invention relates to a socket for electronic component which contains an electronic component. The socket for electronic component comprises a platy base, containers formed to be concaved on a front face of the base and to contain LED packages therein, connectors provided on side faces and connected to other members, supports each of which supports and fixes the LED package contained in the container and electrically connected to the LED package, heat conductors each of which is provided continuously from a bottom face side of the container to a rear face of the base and contacts the LED package contained in the container so as to conduct heat generated by the LED package, and terminals electrically connected to the other members coupled with the connectors and the supports. The heat generated by the LED package is conducted to the rear face of the base through the heat conductors, and effectively radiated to an installation member on which the socket for electronic component is mounted.
摘要翻译： 本发明涉及一种包含电子部件的电子部件用插座。 用于电子部件的插座包括板状基座，形成为凹陷在基座的前表面上并容纳LED封装的容器，设置在侧面上并连接到其它构件的连接器，每个支撑件支撑并固定LED封装 容纳在容器中并电连接到LED封装的导热体，每个热导体从容器的底面侧连续地设置到基座的后表面，并与容纳在容器中的LED封装体接触，以便产生热量 通过LED封装，以及电连接到与连接器和支撑件耦合的其它构件的端子。 由LED封装产生的热量通过导热体传导到基座的后表面，并有效地辐射到安装有用于电子部件的插座的安装部件上。
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公开(公告)号：US5502423A
公开(公告)日：1996-03-26
申请号：US231148
申请日：1994-04-22
申请人： Akio Okude , Tokushi Yamauchi , Kei Mitsuyasu , Yoshifumi Kuroki , Naoki Ohnishi , Katsuyuki Kiyozumi
发明人： Akio Okude , Tokushi Yamauchi , Kei Mitsuyasu , Yoshifumi Kuroki , Naoki Ohnishi , Katsuyuki Kiyozumi
IPC分类号： H05B41/295 , H05B41/392 , H05B37/02
CPC分类号： H05B41/3927 , H05B41/295
摘要： A discharge lamp lighting device has first switching means for converting AC power into DC power and second switching means for converting the DC power into a high frequency power, the first switching means being driven subsequently to a driving of the second switching means, and the device is arranged for intermittently applying a pulse voltage to a discharge lamp during its dimming lighting, whereby any secondary voltage can be effectively lowered and any flash apt to occur during the dimming lighting can be restrained.
摘要翻译： 放电灯点亮装置具有用于将交流电力转换为直流电力的第一开关装置和用于将直流电力转换成高频电力的第二开关装置，第一开关装置随后驱动第二开关装置，该装置 被布置成在其调光点亮期间间歇地向放电灯施加脉冲电压，从而可以有效地降低任何二次电压，并且可以抑制在调光照明期间容易发生的任何闪光。
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