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公开(公告)号：US20100003481A1
公开(公告)日：2010-01-07
申请号：US12448150
申请日：2007-12-20
CPC分类号： H01L51/0096 , G02F1/1333 , G02F1/133345 , G02F2202/28 , H01L29/78603 , Y02E10/549 , Y10T428/24959 , Y10T428/269
摘要： (1) A display substrate for embedding pixel-controlling elements comprising an adhesive layer and a thermoplastic film having a thickness of 50 to 500 μm which are laminated successively to a base plate successively in this order, wherein a storage modulus (E′) of the adhesive layer is 1.0×106 Pa or greater at 100 to 200° C., and (2) a display substrate for embedding pixel-controlling elements comprising an adhesive layer, a gas barrier layer and a thermoplastic film having a thickness of 50 to 500 pm which are laminated to a base plate successively in this order, wherein a storage modulus (E′) of the adhesive layer is 1.0×104 Pa or greater at 100 to 200° C., and a thickness of the gas barrier layer is 25 nm or greater. A pixel-controlling substrate in which pixel-controlling elements for controlling individual pixels for a display are embedded can be prepared with excellent quality using the display substrate.
摘要翻译： （1）一种嵌入像素控制元件的显示基板，其特征在于，具有粘合剂层和厚度为50〜500μm的热塑性膜，依次依次层叠到基板上，其中，储能模量（E'）为 粘合层在100〜200℃下为1.0×10 6 Pa以上，（2）用于嵌入像素控制元件的显示基板，包括粘合剂层，阻气层和厚度为50〜500的热塑性膜 pm，其依次层叠到基板上，其中在100至200℃下粘合剂层的储能模量（E'）为1.0×10 4 Pa以上，阻气层的厚度为25nm 或更大。 可以使用显示基板以优异的质量来制备其中嵌入用于控制用于显示器的各个像素的像素控制元件的像素控制基板。
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公开(公告)号：US08298873B2
公开(公告)日：2012-10-30
申请号：US12523805
申请日：2008-01-17
IPC分类号： H01L21/16
CPC分类号： H05K1/185 , H01L21/56 , H01L23/5389 , H01L2924/0002 , H05K3/0011 , H05K3/007 , H05K2201/0108 , H05K2203/016 , H05K2203/056 , H05K2203/1469 , H05K2203/1476 , H01L2924/00
摘要： The method for producing a circuit substrate of the present invention is characterized in that the circuit substrate is produced using as sheet a circuit substrate sheet including an uncured layer a part of which, the part being other than a part at which a circuit chip is disposed, is selectively curable before or after disposal of said circuit chip, wherein the uncured layer has a softness that enables embedding of the circuit chip in the circuit substrate sheet upon pressing the circuit chip that has been disposed on a surface of the uncured layer. According to the method for producing the circuit substrate of the present invention, the circuit chip can be embedded inwards with high accuracy, and the circuit substrate can be produced easily with high accuracy.
摘要翻译： 本发明的电路基板的制造方法的特征在于，使用片状电路基板来制造电路基板，所述电路基板包括未固化层，其一部分除了设置电路芯片的部分之外 可在处理所述电路芯片之前或之后选择性地固化，其中所述未固化层具有柔性，其能够在按压未固化层表面上的电路芯片之后将电路芯片嵌入电路基板中。 根据本发明的电路基板的制造方法，可以高精度地将电路芯片嵌入到内部，并且可以高精度地容易地制造电路基板。
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公开(公告)号：US20100044887A1
公开(公告)日：2010-02-25
申请号：US12523805
申请日：2008-01-17
CPC分类号： H05K1/185 , H01L21/56 , H01L23/5389 , H01L2924/0002 , H05K3/0011 , H05K3/007 , H05K2201/0108 , H05K2203/016 , H05K2203/056 , H05K2203/1469 , H05K2203/1476 , H01L2924/00
摘要： The method for producing a circuit substrate of the present invention is characterized in that the circuit substrate is produced using as sheet a circuit substrate sheet including an uncured layer a part of which, the part being other than a part at which a circuit chip is disposed, is selectively curable before or after disposal of said circuit chip, wherein the uncured layer has a softness that enables embedding of the circuit chip in the circuit substrate sheet upon pressing the circuit chip that has been disposed on a surface of the uncured layer. According to the method for producing the circuit substrate of the present invention, the circuit chip can be embedded inwards with high accuracy, and the circuit substrate can be produced easily with high accuracy.
摘要翻译： 本发明的电路基板的制造方法的特征在于，使用片状电路基板来制造电路基板，所述电路基板包括未固化层，其一部分除了设置电路芯片的部分之外 可在处理所述电路芯片之前或之后选择性地固化，其中所述未固化层具有柔性，其能够在按压未固化层表面上的电路芯片之后将电路芯片嵌入电路基板中。 根据本发明的电路基板的制造方法，可以高精度地将电路芯片嵌入到内部，并且可以高精度地容易地制造电路基板。
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公开(公告)号：US20120319305A1
公开(公告)日：2012-12-20
申请号：US13471647
申请日：2012-05-15
CPC分类号： H05K1/185
摘要： A process for producing a sheet of a circuit substrate which includes (i) providing a sheet for a circuit substrate which contains a layer of a polymer material of an energy ray hardening type for embedding circuit chips and is used for displays, the layer before being hardened by irradiating an energy ray having a storage modulus of 103 Pa or greater and smaller than 107 Pa at a temperature of embedding the circuit chips, (ii) embedding the circuit chips into the layer, and (iii) hardening the layer by irradiating an energy ray onto the layer to obtain the sheet of a circuit substrate, whereby the circuit chips are embedded, fixed and maintained in the resultant hardened layer, wherein the layer after being hardened by irradiating an energy ray has a storage modulus of 107 Pa or greater at 25° C.
摘要翻译： 一种电路基板的制造方法，其特征在于，包括：（i）提供用于电路基板的片材，所述电路基板包含用于嵌入电路芯片的能量线硬化型聚合物材料层，并用于显示器， 通过在嵌入电路芯片的温度下照射具有103Pa以上且小于107Pa的储能模量的能量线来硬化，（ii）将电路芯片嵌入该层中，以及（iii）通过照射 能量射线到层上以获得电路基板，由此将电路芯片嵌入，固定并保持在所得到的硬化层中，其中通过照射能量射线硬化后的层具有107Pa或更大的储能模量 在25°C
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5.发明申请公开(公告)号：US20060082002A1
公开(公告)日：2006-04-20
申请号：US11230039
申请日：2005-09-19
IPC分类号： H01L23/28
CPC分类号： H05K1/185
摘要： A sheet for circuit substrates for displays which comprises a polymer material of an energy ray hardening type for embedding circuit chips, wherein a storage modulus of an unhardened layer comprising the polymer material of an energy ray hardening type is 103 Pa or greater and smaller than 107 Pa at a temperature of embedding the circuit chips or at 25° C., and a storage modulus of a hardened layer obtained by hardening the unhardened layer is 107 Pa or greater at 25° C.; and a sheet of circuit substrate for displays obtained by embedding circuit chips into the unhardened layer, followed by hardening the unhardened layer by irradiation with an energy ray. A sheet of a circuit substrate in which circuit chips for controlling pixels of displays and, in particular, flat panel displays are embedded into the sheet can be efficiently produced with excellent quality and productivity using the sheet for circuit substrates.
摘要翻译： 一种显示器用电路基板用片，其特征在于，包括用于嵌入电路芯片的能量射线硬化型聚合物材料，其中包含能量射线硬化型聚合物材料的未硬化层的储能模量为10 3 > Pa或更大且小于10Pa，在嵌入电路芯片的温度或25℃下，通过硬化未硬化层获得的硬化层的储能模量为10 7Pa以上。 以及通过将电路芯片嵌入未硬化层而获得的用于显示器的电路基板片材，然后通过用能量射线照射来硬化未硬化层。 可以使用电路基板的片材，以优异的质量和生产率，有效地制造用于控制显示器的像素，特别是平板显示器的电路芯片的电路基板。
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公开(公告)号：US20100144120A1
公开(公告)日：2010-06-10
申请号：US12596047
申请日：2008-04-15
申请人： Takeshi Segawa , Naofumi Izumi
发明人： Takeshi Segawa , Naofumi Izumi
IPC分类号： H01L21/302
CPC分类号： H01L21/6835 , H01L21/67092 , H01L21/67132 , H01L21/6836 , H01L21/78 , H01L24/27 , H01L24/29 , H01L24/83 , H01L2221/68318 , H01L2221/68327 , H01L2224/274 , H01L2224/2919 , H01L2224/83191 , H01L2224/8385 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01012 , H01L2924/01013 , H01L2924/01025 , H01L2924/01033 , H01L2924/01047 , H01L2924/01057 , H01L2924/01074 , H01L2924/01075 , H01L2924/01078 , H01L2924/01082 , H01L2924/01088 , H01L2924/0665 , H01L2924/07802 , H01L2924/09701 , H01L2924/14 , H01L2924/3025 , H01L2924/00 , H01L2924/3512
摘要： A method for producing a chip (13) in which a die bonding adhesive layer (24) and a wafer (1) are laminated on a close-contact layer (31) of a fixing jig (3), the chip is formed by completely cutting the wafer and the die bonding adhesive layer and then the chip is picked up together with the die bonding adhesive layer from the fixing jig by deforming the close-contact layer of the fixing jig. In the method the fixing jig is provided with the close-contact layer and a jig base (30) that is provided with a plurality of protrusions (36) on one side and a sidewall (35) at the outer circumference section of the one side. The close-contact layer is laminated on the surface of the jig base provided with the protrusions and is bonded on the upper surface of the sidewall. On the surface of the jig base provided with the protrusions, a partitioned space is formed by the close-contact layer, the protrusions, and the sidewall. The jig base is provided with at least one through hole (38) penetrating the outside and the partitioned space, and the close-contact layer can be deformed by sucking air from the partitioned space via the through hole of the fixing jig.
摘要翻译： 一种芯片（13）的制造方法，其中，在固定夹具（3）的紧密接触层（31）上层叠有芯片接合粘合剂层（24）和晶片（1），芯片完全形成 切割晶片和芯片接合粘合剂层，然后通过使固定夹具的紧密接触层变形，将芯片与来自固定夹具的芯片粘合粘合剂层一起拾取。 在该方法中，固定夹具设置有紧密接触层和在一侧设置有多个突起（36）的夹具基座（30）和在一侧的外周部分处的侧壁（35） 。 紧密接触层被层压在设置有突起的夹具基体的表面上，并且粘合在侧壁的上表面上。 在设置有突起的夹具基体的表面上，通过紧密接触层，突起和侧壁形成分隔空间。 该夹具基部设置有至少一个穿透外部和分隔空间的通孔（38），并且通过经由固定夹具的通孔从分隔空间吸入空气而使紧密接触层变形。
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公开(公告)号：US08691666B2
公开(公告)日：2014-04-08
申请号：US12596047
申请日：2008-04-15
申请人： Takeshi Segawa , Naofumi Izumi
发明人： Takeshi Segawa , Naofumi Izumi
IPC分类号： H01L21/78 , H01L21/46 , H01L21/301
CPC分类号： H01L21/6835 , H01L21/67092 , H01L21/67132 , H01L21/6836 , H01L21/78 , H01L24/27 , H01L24/29 , H01L24/83 , H01L2221/68318 , H01L2221/68327 , H01L2224/274 , H01L2224/2919 , H01L2224/83191 , H01L2224/8385 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01012 , H01L2924/01013 , H01L2924/01025 , H01L2924/01033 , H01L2924/01047 , H01L2924/01057 , H01L2924/01074 , H01L2924/01075 , H01L2924/01078 , H01L2924/01082 , H01L2924/01088 , H01L2924/0665 , H01L2924/07802 , H01L2924/09701 , H01L2924/14 , H01L2924/3025 , H01L2924/00 , H01L2924/3512
摘要： A method for producing a chip (13) in which a die bonding adhesive layer (24) and a wafer (1) are laminated on a close-contact layer (31) of a fixing jig (3), the chip is formed by completely cutting the wafer and the die bonding adhesive layer and then the chip is picked up together with the die bonding adhesive layer from the fixing jig by deforming the close-contact layer of the fixing jig. In the method the fixing jig is provided with the close-contact layer and a jig base (30) that is provided with a plurality of protrusions (36) on one side and a sidewall (35) at the outer circumference section of the one side. The close-contact layer is laminated on the surface of the jig base provided with the protrusions and is bonded on the upper surface of the sidewall. On the surface of the jig base provided with the protrusions, a partitioned space is formed by the close-contact layer, the protrusions, and the sidewall. The jig base is provided with at least one through hole (38) penetrating the outside and the partitioned space, and the close-contact layer can be deformed by sucking air from the partitioned space via the through hole of the fixing jig.
摘要翻译： 一种芯片（13）的制造方法，其中在固定夹具（3）的紧密接触层（31）上层叠有芯片接合粘合剂层（24）和晶片（1），芯片完全形成 切割晶片和芯片接合粘合剂层，然后通过使固定夹具的紧密接触层变形，将芯片与来自固定夹具的芯片粘合粘合剂层一起拾取。 在该方法中，固定夹具设置有紧密接触层和在一侧设置有多个突起（36）的夹具基座（30）和在一侧的外周部分处的侧壁（35） 。 紧密接触层被层压在设置有突起的夹具基体的表面上，并且粘合在侧壁的上表面上。 在设置有突起的夹具基体的表面上，通过紧密接触层，突起和侧壁形成分隔空间。 该夹具基部设置有至少一个穿透外部和分隔空间的通孔（38），并且通过经由固定夹具的通孔从分隔空间吸入空气而使紧密接触层变形。
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公开(公告)号：US08113914B2
公开(公告)日：2012-02-14
申请号：US12134978
申请日：2008-06-06
申请人： Hitoshi Ohashi , Naofumi Izumi
发明人： Hitoshi Ohashi , Naofumi Izumi
IPC分类号： B24B1/00
CPC分类号： B24B7/228
摘要： An object of the present invention is to provide a treating method for brittle member capable of stably holding the brittle member when applying predetermined treatments such as transportation and grinding back surface of a brittle member such as a semi-conductor wafer and separating the brittle member without breakage after finishing required treatment to thereby attaining high thickness accuracy of the brittle member.A treating method for brittle member comprising: a step of removably fixing a brittle member on a flexible glass base plate, a step of treating said brittle member, a step of fixing said brittle member side by holding means, and a step of separating said flexible glass base plate from said brittle member by bending said flexible glass base plate.
摘要翻译： 本发明的目的在于提供一种脆性构件的处理方法，其能够在施加诸如半导体晶片等脆性构件的输送和研磨后表面的预定处理时稳定地保持脆性构件，并且分离脆性构件而没有 完成所需处理后的断裂，从而获得脆性构件的高厚度精度。 1.一种脆性构件的处理方法，包括：将脆性构件可移除地固定在柔性玻璃基板上的步骤，处理所述脆性构件的步骤，通过固定装置固定所述脆性构件侧的步骤，以及将所述柔性 通过弯曲所述柔性玻璃基板从所述脆性构件的玻璃基板。
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