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1.发明授权公开(公告)号：US08486566B2
公开(公告)日：2013-07-16
申请号：US12263840
申请日：2008-11-03
IPC分类号： H01M4/13
CPC分类号： H01M4/621 , H01M4/1315 , H01M4/13915 , H01M4/364 , H01M4/525 , H01M4/5815 , H01M4/582 , H01M4/5825 , H01M4/622 , H01M4/623 , H01M10/0525 , H01M2004/028
摘要： A positive electrode for a lithium-ion secondary battery includes a positive-electrode mixture layer, which includes a positive-electrode active material containing lithium composite oxide, a conductive material, and a binder, and a current collector. The positive-electrode mixture layer contains a compound including sulfur and/or phosphorous, a first polymer serving as a main binder, and a second polymer different from the first polymer.
摘要翻译： 锂离子二次电池用正极包括正极复合层，其包含含有锂复合氧化物的正极活性物质，导电材料和粘合剂，以及集电体。 正极混合物层含有包含硫和/或磷的化合物，作为主要粘合剂的第一聚合物和不同于第一聚合物的第二聚合物。
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2.发明申请POSITIVE ELECTRODE FOR LITHIUM-ION SECONDARY BATTERY, MANUFACTURING METHOD THEREOF, AND LITHIUM-ION SECONDARY BATTERY 有权用于锂离子二次电池的正极，其制造方法和锂离子二次电池公开(公告)号：US20090123839A1
公开(公告)日：2009-05-14
申请号：US12263840
申请日：2008-11-03
CPC分类号： H01M4/621 , H01M4/1315 , H01M4/13915 , H01M4/364 , H01M4/525 , H01M4/5815 , H01M4/582 , H01M4/5825 , H01M4/622 , H01M4/623 , H01M10/0525 , H01M2004/028
摘要： A positive electrode for a lithium-ion secondary battery includes a positive-electrode mixture layer, which includes a positive-electrode active material containing lithium composite oxide, a conductive material, and a binder, and a current collector. The positive-electrode mixture layer contains a compound including sulfur and/or phosphorous, a first polymer serving as a main binder, and a second polymer different from the first polymer.
摘要翻译： 锂离子二次电池用正极包括正极复合层，其包含含有锂复合氧化物的正极活性物质，导电材料和粘合剂，以及集电体。 正极混合物层含有包含硫和/或磷的化合物，作为主要粘合剂的第一聚合物和不同于第一聚合物的第二聚合物。
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公开(公告)号：US07137563B2
公开(公告)日：2006-11-21
申请号：US10811933
申请日：2004-03-30
申请人： Goro Shibamoto , Osamu Ishii , Kazumi Izumitani , Koji Hayasaka
发明人： Goro Shibamoto , Osamu Ishii , Kazumi Izumitani , Koji Hayasaka
IPC分类号： G06K19/00
CPC分类号： G06K19/07749 , G06K19/07743 , G06K19/07769
摘要： A method for making a combination IC card comprising the steps of forming antenna leads and patterned connection leads, forming a hole for mounting an external electrode chip on a sheath on at least one side of the antenna substrate, mounting an IC chip on the antenna substrate having the antenna leads and the patterned connection leads, mounting the external electrode chip on the antenna substrate having the antenna leads and the patterned connection leads, and attaching the sheath having the hole on the antenna substrate.
摘要翻译： 一种制造组合IC卡的方法，包括形成天线引线和图案化连接引线的步骤，在天线基板的至少一侧上形成用于将外部电极芯片安装在护套上的孔，将IC芯片安装在天线基板上 具有天线引线和图案化的连接引线，将外部电极芯片安装在具有天线引线和图案化连接引线的天线基板上，并在天线基板上安装具有孔的护套。
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公开(公告)号：US06459588B1
公开(公告)日：2002-10-01
申请号：US09508064
申请日：2000-03-07
IPC分类号： H05K114
CPC分类号： H05K1/14 , G06K19/07749 , G06K19/0775 , H01L2224/16 , H01L2924/01078 , H01L2924/07811 , H05K1/162 , H05K3/4664 , H05K3/4685 , H01L2924/00
摘要： A noncontact IC card is provided with a card substrate 11, an IC chip 12 disposed on the card substrate 11, and a antenna circuit 13 formed on the card substrate 11 and having a pair of antenna terminals 13a and 13b, where one antenna terminal 13a is connected to the IC chip 12. An isolation layer 14 is formed over at least one portion of the antenna circuit 13, and a connection layer 15 is formed extending over the isolation layer 14. One end portion 15a of the connection layer 15 is connected to the IC chip 12 and another end portion 15b thereof is connected to the other antenna terminal 13b of the antenna circuit 13. Protective layers 16a and 16b are provided on top of the card substrate 11 to protect the IC chip 12 and the antenna circuit 13.
摘要翻译： 非接触IC卡设置有卡基板11，设置在卡基板11上的IC芯片12和形成在卡基板11上并具有一对天线端子13a和13b的天线电路13，其中一个天线端子13a 连接到IC芯片12.隔离层14形成在天线电路13的至少一部分上，并且形成在隔离层14上延伸的连接层15.连接层15的一个端部15a被连接 到IC芯片12，另一个端部15b连接到天线电路13的另一个天线端子13b。保护层16a和16b设置在卡基板11的顶部，以保护IC芯片12和天线电路13 。
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