公开(公告)号：US4383363A

公开(公告)日：1983-05-17

申请号：US163634

申请日：1980-06-27

申请人： Masao Hayakawa ,  Takamichi Maeda ,  Mituwo Oda

发明人： Masao Hayakawa ,  Takamichi Maeda ,  Mituwo Oda

IPC分类号： H05K1/00 ,  H05K3/00 ,  H05K3/18 ,  H05K3/24 ,  H05K3/40 ,  H05K3/02

CPC分类号： H05K3/4069 ,  H05K1/0393 ,  H05K2201/0347 ,  H05K2201/0355 ,  H05K2203/0195 ,  H05K2203/0338 ,  H05K2203/0554 ,  H05K2203/1461 ,  H05K3/0047 ,  H05K3/181 ,  H05K3/246 ,  Y10T29/49156

摘要： A conductive paste is disposed in a through hole to provide communication between wiring patterns formed on both of the major surfaces of an insulator substrate. Conductive layers integral with the wiring patterns are formed on the both major surfaces of the insulator substrate so that the conductive layers extend across the through hole. The conductive layers make contact with the conductive paste disposed in the through hole and function to enclose the both ends of the conductive paste.

摘要翻译： 在通孔中设置导电膏以提供形成在绝缘体基板的两个主表面上的布线图案之间的连通。 在绝缘体基板的两个主表面上形成与布线图形一体的导电层，使得导电层延伸穿过通孔。 导电层与布置在通孔中的导电膏接触，并且用于封装导电膏的两端。