Non-volatile semiconductor storage device having memory cells disposed three-dimensionally, and method of manufacturing the same
    2.
    发明授权
    Non-volatile semiconductor storage device having memory cells disposed three-dimensionally, and method of manufacturing the same 有权
    具有三维配置存储单元的非易失性半导体存储装置及其制造方法

    公开(公告)号:US08178917B2

    公开(公告)日:2012-05-15

    申请号:US12408249

    申请日:2009-03-20

    IPC分类号: H01L29/792

    摘要: A non-volatile semiconductor storage device includes a first layer and a second layer. The first layer includes: a plurality of first conductive layers extending in parallel to a substrate and laminated in a direction perpendicular to the substrate; a first insulation layer formed on an upper layer of the plurality of first conductive layers; a first semiconductor layer formed to penetrate the plurality of first conductive layers; and a charge accumulation layer formed between the first conductive layers and the first semiconductor layer. Respective ends of the first conductive layers are formed in a stepwise manner in relation to each other in a first direction. The second layer includes: a plurality of second conductive layers extending in parallel to the substrate and laminated in a direction perpendicular to the substrate, the second conductive layers being formed in the same layer as the plurality of first conductive layers; and a second insulation layer formed on an upper layer of the plurality of second conductive layers. Respective ends of the second conductive layers are formed to align along a straight line extending in a direction substantially perpendicular to the substrate at a predetermined area.

    摘要翻译: 非易失性半导体存储装置包括第一层和第二层。 第一层包括:多个第一导电层,其平行于衬底延伸并且在垂直于衬底的方向上层压; 形成在所述多个第一导电层的上层上的第一绝缘层; 形成为穿透所述多个第一导电层的第一半导体层; 以及形成在第一导电层和第一半导体层之间的电荷累积层。 第一导电层的相应端部在第一方向上相对于彼此以逐步的方式形成。 第二层包括:多个第二导电层,其平行于衬底延伸并且在垂直于衬底的方向上层叠,第二导电层形成在与多个第一导电层相同的层中; 以及形成在所述多个第二导电层的上层上的第二绝缘层。 形成第二导电层的相应端,沿着在预定区域上基本上垂直于衬底的方向延伸的直线对齐。

    Non-volatile semiconductor storage device and method of manufacturing the same
    10.
    发明授权
    Non-volatile semiconductor storage device and method of manufacturing the same 有权
    非易失性半导体存储装置及其制造方法

    公开(公告)号:US08426976B2

    公开(公告)日:2013-04-23

    申请号:US12392636

    申请日:2009-02-25

    IPC分类号: H01L29/792 H01L21/28

    摘要: A non-volatile semiconductor storage device has a plurality of memory strings with a plurality of electrically rewritable memory cells connected in series. Each of the memory strings includes: a columnar semiconductor layer extending in a direction perpendicular to a substrate; a plurality of conductive layers formed at a sidewall of the columnar semiconductor layer via memory layers; and interlayer insulation layers formed above of below the conductive layers. A sidewall of the conductive layers facing the columnar semiconductor layer is formed to be inclined such that the distance thereof from a central axis of the columnar semiconductor layer becomes larger at lower position thereof than at upper position thereof. While, a sidewall of the interlayer insulation layers facing the columnar semiconductor layer is formed to be inclined such that the distance thereof from a central axis of the columnar semiconductor layer becomes smaller at lower position thereof than at upper position thereof.

    摘要翻译: 非易失性半导体存储装置具有多个具有串联连接的多个电可重写存储单元的存储器串。 每个存储器串包括:在垂直于衬底的方向上延伸的柱状半导体层; 多个导电层,经由存储层形成在所述柱状半导体层的侧壁处; 以及形成在导电层下方的层间绝缘层。 形成面向柱状半导体层的导电层的侧壁,使得其与柱状半导体层的中心轴的距离在其下部位置比在其上部位置变大。 同时,面对柱状半导体层的层间绝缘层的侧壁形成为倾斜,使得其在柱状半导体层的中心轴线处的距离在其下部位置处比在其上部位置变小。