公开(公告)号：US5438751A

公开(公告)日：1995-08-08

申请号：US112337

申请日：1993-08-27

申请人： Masashi Miyazaki ,  Haruo Akahoshi ,  Shozo Nohara ,  Kenzi Kikuta ,  Toshiaki Ishimaru

发明人： Masashi Miyazaki ,  Haruo Akahoshi ,  Shozo Nohara ,  Kenzi Kikuta ,  Toshiaki Ishimaru

IPC分类号： G03F7/033 ,  G03F7/30 ,  G03F7/32 ,  H05K3/00 ,  H05K3/10 ,  H05K3/18 ,  H05K3/06

CPC分类号： G03F7/322 ,  G03F7/033 ,  G03F7/30 ,  H05K3/108 ,  H05K3/184 ,  H05K2203/0783 ,  H05K2203/0793 ,  H05K3/0076 ,  Y10T29/49126 ,  Y10T29/49156

摘要： In an additive process for producing printed wiring boards, by using a developer comprising a chlorine-free organic solvent and an alkaline aqueous solution and as a resist material a copolymer of methacrylic acid and methyl methacrylate or the like, the production steps are simplified even if a substrate having a large area is used, and abolishment of chlorine-containing organic solvent as a developer becomes possible.

摘要翻译： 在制造印刷电路板的添加方法中，通过使用包含无氯有机溶剂和碱性水溶液的显影剂和作为抗蚀剂材料的甲基丙烯酸和甲基丙烯酸甲酯等的共聚物，即使制备步骤也简化 使用面积大的基板，可以取消含氯有机溶剂作为显影剂。

公开(公告)号：US5919603A

公开(公告)日：1999-07-06

申请号：US967196

申请日：1997-10-29

申请人： Masashi Miyazaki ,  Haruo Akahoshi ,  Shozo Nohara ,  Kenzi Kikuta ,  Toshiaki Ishimaru

发明人： Masashi Miyazaki ,  Haruo Akahoshi ,  Shozo Nohara ,  Kenzi Kikuta ,  Toshiaki Ishimaru

IPC分类号： G03F7/033 ,  G03F7/30 ,  G03F7/32 ,  H05K3/00 ,  H05K3/10 ,  H05K3/18 ,  G03C1/725 ,  C08J3/28

CPC分类号： G03F7/322 ,  G03F7/033 ,  G03F7/30 ,  H05K3/108 ,  H05K3/184 ,  H05K2203/0783 ,  H05K2203/0793 ,  H05K3/0076 ,  Y10T29/49126 ,  Y10T29/49156

摘要： In an additive process for producing printed wiring boards, by using a developer comprising a chlorine-free organic solvent and an alkaline aqueous solution and as a resist material a copolymer of methacrylic acid and methyl methacrylate or the like, the production steps are simplified even if a substrate having a large area is used, and abolishment of chlorine-containing organic solvent as a developer becomes possible.