公开(公告)号：US09708466B2

公开(公告)日：2017-07-18

申请号：US14384335

申请日：2013-02-20

申请人： DAI-ICHI KOGYO SEIYAKU CO., LTD.

发明人： Satoshi Murakami ,  Manabu Kikuta

IPC分类号： C08L25/14 ,  H05K1/00 ,  H05K3/00 ,  C08K5/3475 ,  C08L101/00 ,  C08K5/00 ,  C08K5/11 ,  C08K5/12 ,  C08K5/523 ,  H05K1/03

CPC分类号： C08K5/3475 ,  C08K5/005 ,  C08K5/11 ,  C08K5/12 ,  C08K5/523 ,  C08L101/00 ,  H05K1/03 ,  H05K1/0373 ,  H05K3/0011 ,  H05K3/0032 ,  H05K3/0076 ,  H05K3/184 ,  H05K2201/0129 ,  C08F212/08 ,  C08F220/06 ,  C08F2220/1858 ,  C08F2220/1825 ,  C08L25/14 ,  C08L33/064

摘要： A resin composition for laser processing which is able to enhance laser processability with maintaining a resist performance of a resin after ultraviolet laser processing, and which can be, for example, used as a resist in forming a circuit of a printed wiring board is provided.Disclosed is a resin composition for laser processing containing a resin and an ultraviolet absorber, wherein the resin is a thermoplastic resin having a carboxyl group and having a softening temperature of from 70 to 140° C., and a content of the ultraviolet absorber is from 1 to 30 parts by mass based on 100 parts by mass of the thermoplastic resin.

公开(公告)号：US09661754B2

公开(公告)日：2017-05-23

申请号：US14726602

申请日：2015-06-01

申请人： Rohm and Haas Electronic Materials LLC

发明人： Krishna Balantrapu ,  Brian D. Amos ,  Stephen McCammon

IPC分类号： G03F7/20 ,  H05K3/00 ,  G03F7/035 ,  G03F7/038 ,  G03F7/09 ,  G03F7/11 ,  H05K3/28 ,  H05K3/34

CPC分类号： H05K3/0079 ,  G03F7/035 ,  G03F7/038 ,  G03F7/09 ,  G03F7/11 ,  G03F7/2018 ,  H05K3/0076 ,  H05K3/0082 ,  H05K3/28 ,  H05K3/3452 ,  H05K2203/013 ,  H05K2203/0585

摘要： Substrates, such as printed circuit boards, are coated with an aqueous alkaline developable UV photosensitive material followed by applying an aqueous soluble UV transparent film to coat the UV photosensitive material. An aqueous alkaline soluble UV blocking composition is selectively applied to the surface of the UV blocking film to function as a mask. UV light is applied to portions of the UV photosensitive material not covered by the mask. The UV blocking composition, UV transparent film and selective sections of the UV photosensitive material are simultaneously removed with an aqueous alkaline developer solution to form an image on the substrate.

公开(公告)号：US09611402B2

公开(公告)日：2017-04-04

申请号：US14989270

申请日：2016-01-21

申请人： Rohm and Haas Electronic Materials LLC

发明人： Krishna Balantrapu ,  Robert K. Barr

IPC分类号： C09D11/34 ,  C09D11/10 ,  C09D133/10 ,  H05K3/06 ,  H05K3/00 ,  C09D11/101 ,  C09D11/12 ,  C09D11/38 ,  C09D133/08 ,  C09D135/02 ,  H05K3/18 ,  C09D11/107

CPC分类号： C09D11/34 ,  C09D11/101 ,  C09D11/107 ,  C09D11/12 ,  C09D11/38 ,  C09D133/08 ,  C09D133/10 ,  C09D135/02 ,  H05K3/002 ,  H05K3/0023 ,  H05K3/0076 ,  H05K3/0079 ,  H05K3/0082 ,  H05K3/061 ,  H05K3/18 ,  H05K3/181 ,  H05K2203/013 ,  H05K2203/0545 ,  H05K2203/0769 ,  H05K2203/0793 ,  H05K2203/122

摘要： Hot melt compositions include non-aromatic cyclic (alkyl)acrylates and low acid number waxes. Upon application of actinic radiation, the hot melt compositions cure to form resists. They may be stripped from substrates with high alkaline strippers. The hot melt compositions may be used in the manufacture of printed circuit boards and photovoltaic devices.

公开(公告)号：US20160381794A1

公开(公告)日：2016-12-29

申请号：US15196857

申请日：2016-06-29

申请人： SAMSUNG ELECTRO-MECHANICS CO., LTD.

发明人： Seok-Hwan AHN ,  Mi-Sun HWANG ,  Young-Gwan KO ,  Jong-Seok BAE ,  Myung-Sam KANG

IPC分类号： H05K1/02 ,  H05K3/46 ,  H05K1/09 ,  H05K3/40 ,  H05K3/12 ,  H05K3/00 ,  H05K1/11

CPC分类号： H05K1/0298 ,  H05K1/0271 ,  H05K1/09 ,  H05K1/115 ,  H05K1/165 ,  H05K3/007 ,  H05K3/0076 ,  H05K3/12 ,  H05K3/4007 ,  H05K3/4617 ,  H05K3/4623 ,  H05K2201/09136 ,  H05K2201/09509 ,  H05K2201/09563 ,  H05K2201/09672 ,  H05K2203/043

摘要： A multilayered substrate includes unit substrates laminated in a direction of thickness thereof, and the unit substrates include a photosensitive insulating layer, a conductive pattern disposed in the photosensitive insulating layer, and a bump penetrating into the photosensitive insulating layer and providing an interlayer connection to the conductive pattern.

摘要翻译： 多层基板包括在其厚度方向上层叠的单位基板，并且单位基板包括光敏绝缘层，设置在感光绝缘层中的导电图案，以及突出到光敏绝缘层中的凸块，并提供到 导电图案。

公开(公告)号：US20160353577A1

公开(公告)日：2016-12-01

申请号：US14853364

申请日：2015-09-14

申请人： Rohm and Haas Electronic Materials LLC

发明人： Krishna Balantrapu ,  Brian D. Amos ,  Stephen McCammon

IPC分类号： H05K3/00 ,  G03F7/32 ,  G03F7/42 ,  G03F7/09 ,  G03F7/20

CPC分类号： H05K3/0079 ,  G03F7/035 ,  G03F7/038 ,  G03F7/09 ,  G03F7/091 ,  G03F7/11 ,  G03F7/20 ,  G03F7/2018 ,  G03F7/322 ,  G03F7/425 ,  H05K3/0076 ,  H05K3/0082 ,  H05K3/28 ,  H05K3/3452 ,  H05K2203/013 ,  H05K2203/0551 ,  H05K2203/0585

摘要： Substrates, such as printed circuit boards, are coated with an aqueous alkaline developable UV photosensitive material followed by applying an aqueous soluble UV transparent film to coat the UV photosensitive material. An aqueous alkaline strippable UV blocking composition is selectively applied to the surface of the UV transparent film to function as a mask. UV light is applied to portions of the UV photosensitive material not covered by the mask. The UV blocking composition, UV transparent film and selective sections of the UV photosensitive material are simultaneously removed with an aqueous alkaline developer solution to form an image on the substrate.

摘要翻译： 诸如印刷电路板的衬底涂覆有水性碱性可显影UV光敏材料，然后施加水溶性UV透明膜以涂覆UV感光材料。 将含水碱性可剥离的UV阻挡组合物选择性地施加到UV透明膜的表面上，起到掩模的作用。 UV光被施加到未被掩模覆盖的UV感光材料的部分。 用碱性显影剂水溶液同时除去UV阻挡组合物，UV透明膜和UV光敏材料的选择性部分，以在基底上形成图像。

公开(公告)号：US09332647B2

公开(公告)日：2016-05-03

申请号：US14436475

申请日：2013-10-09

申请人： MIMAKI ENGINEERING CO., LTD.

发明人： Norikazu Nakamura

IPC分类号： B44C1/22 ,  H05K3/06 ,  H05K3/00 ,  G03F7/00

CPC分类号： H05K3/064 ,  G03F7/0002 ,  H05K3/0076 ,  H05K2203/013 ,  H05K2203/0551 ,  H05K2203/0562

摘要： A solution is characteristic in being an etching method that processes a surface of a target object by corroding the surface by a corrosive, and the etching method includes: a resist forming step of forming a resist on the surface using resist liquid by ink jet printing the resist liquid on the surface; a surface corroding step of corroding a portion of the surface where the resist is not formed by bringing the corrosive into contact with a surface side of the target object where the resist has been formed in the resist forming step; and a resist detaching step of detaching the resist from the surface after the surface corroding step, wherein the resist forming step is a step of forming the resist by the resist liquid containing monofunctional monomers or monofunctional oligomers, and polyfunctional monomers or polyfunctional oligomers.

摘要翻译： 一种解决方案是通过腐蚀来处理目标物体的表面的蚀刻方法的特征，并且蚀刻方法包括：抗蚀剂形成步骤，通过喷墨印刷在抗蚀剂液体的表面上形成抗蚀剂 防止表面上的液体; 通过在抗蚀剂形成步骤中使腐蚀剂与已经形成抗蚀剂的目标物体的表面侧接触来腐蚀未形成抗蚀剂的表面的一部分的表面腐蚀步骤; 以及在所述表面腐蚀工序之后从所述表面剥离所述抗蚀剂的抗蚀剂剥离工序，其中所述抗蚀剂形成步骤是通过含有单官能单体或单官能低聚物的抗蚀剂液体和多官能单体或多官能低聚物形成所述抗蚀剂的步骤。

公开(公告)号：US09282644B2

公开(公告)日：2016-03-08

申请号：US14470059

申请日：2014-08-27

申请人： TAIYO HOLDINGS CO., LTD.

发明人： Chiho Ueta ,  Seiryo Kamata

IPC分类号： H05K3/00 ,  H05K3/28 ,  H05K1/02 ,  H05K1/03 ,  G03F7/105 ,  G03F7/032 ,  G03F7/00

CPC分类号： H05K3/0076 ,  G03F7/0007 ,  G03F7/032 ,  G03F7/105 ,  H05K1/0296 ,  H05K1/0373 ,  H05K3/0055 ,  H05K3/287 ,  H05K2203/161 ,  Y10T428/31938

摘要： Disclosed is a photosensitive resin composition which has excellent concealing properties for appearance defects of a circuit and the like, while having excellent coloring power and resolution that enable the formation of a high-resolution solder resist layer. Specifically disclosed is a photosensitive resin composition which contains a perylene coloring agent, a coloring agent that is in a complementary color relation with the perylene coloring agent, a carboxyl group-containing resin, a compound that contains two or more ethylenically unsaturated groups in each molecule, and a photopolymerization initiator.

摘要翻译： 公开了一种具有优异的电路外观缺陷隐蔽性的感光性树脂组合物，同时具有优异的着色力和分辨率，能够形成高分辨率阻焊层。 具体公开了一种感光性树脂组合物，其含有苝着色剂，与苝着色剂具有互补色关系的着色剂，含羧基的树脂，在各分子中含有两个以上烯键式不饱和基团的化合物 ，和光聚合引发剂。

公开(公告)号：US20160066430A1

公开(公告)日：2016-03-03

申请号：US14931143

申请日：2015-11-03

申请人： Rohm and Haas Electronic Materials LLC

发明人： Krishna BALANTRAPU ,  Robert K. BARR

IPC分类号： H05K3/00 ,  H05K3/18 ,  C09D135/02 ,  C09D133/08 ,  C09D133/10

CPC分类号： C09D11/34 ,  C09D11/101 ,  C09D11/107 ,  C09D11/12 ,  C09D11/38 ,  C09D133/08 ,  C09D133/10 ,  C09D135/02 ,  H05K3/002 ,  H05K3/0023 ,  H05K3/0076 ,  H05K3/0079 ,  H05K3/0082 ,  H05K3/061 ,  H05K3/18 ,  H05K3/181 ,  H05K2203/013 ,  H05K2203/0545 ,  H05K2203/0769 ,  H05K2203/0793 ,  H05K2203/122

摘要： Hot melt compositions include non-aromatic cyclic (alkyl)acrylates and low acid number waxes. Upon application of actinic radiation, the hot melt compositions cure to form resists. They may be stripped from substrates with high alkaline strippers. The hot melt compositions may be used in the manufacture of printed circuit boards and photovoltaic devices.

公开(公告)号：US20150183942A1

公开(公告)日：2015-07-02

申请号：US14405929

申请日：2013-09-11

申请人： CANON KABUSHIKI KAISHA

发明人： Toshiki Ito ,  Chieko Mihara ,  Youji Kawasaki

IPC分类号： C08J5/18 ,  H05K3/06 ,  B29C35/08

CPC分类号： C08J5/18 ,  B29C35/0805 ,  B29C2035/0827 ,  B29K2033/04 ,  B29K2105/0005 ,  B29K2909/00 ,  C08F2/48 ,  C08J2333/08 ,  G03F7/0002 ,  G03F7/0046 ,  G03F7/0048 ,  G03F7/027 ,  G03F7/031 ,  H01L21/02118 ,  H01L21/3086 ,  H01L21/311 ,  H05K3/0023 ,  H05K3/0076 ,  H05K3/0079 ,  H05K3/06 ,  H05K3/107 ,  H05K2203/0113 ,  H05K2203/086 ,  H05K2203/087

摘要： Provided are a photocurable composition having high filling property and capable of reducing a mold release force upon production of a film through the utilization of a photo-imprint method, and a method of manufacturing a film using the photocurable composition. The photocurable composition is a photocurable composition, including at least the following component (A) to component (C): (A) a polymerizable compound; (B) a photopolymerization initiator; and (C) a surfactant represented by the following general formula (1): Rf1-Rc-X  (1)

摘要翻译： 本发明提供一种具有高填充性且能够通过利用光印方法降低膜生成时的脱模力的光固化性组合物，以及使用该光固化性组合物的膜的制造方法。 光固化性组合物为至少包含以下成分（A）〜成分（C）的光固化性组合物：（A）聚合性化合物; （B）光聚合引发剂; 和（C）由以下通式（1）表示的表面活性剂：Rf1-Rc-X（1）

公开(公告)号：US08999185B2

公开(公告)日：2015-04-07

申请号：US12375506

申请日：2007-08-06

申请人： Nigel Anthony Caiger

发明人： Nigel Anthony Caiger

IPC分类号： B44C1/22 ,  C09K13/00 ,  H05K3/00 ,  C09D11/34 ,  H01L31/18 ,  H05K3/06 ,  H05K3/10

CPC分类号： H05K3/0076 ,  C09D11/34 ,  H01L31/18 ,  H05K3/061 ,  H05K3/108 ,  H05K2203/013 ,  H05K2203/0793 ,  Y10T428/24802

摘要： The present invention provides a process of etching or plating comprising the steps of: i) ink jet printing an alkali removeable water insoluble hot melt ink jet ink onto a substrate to form a resist image; ii) etching or plating the substrate in an aqueous acid medium; and iv) removing the resist image with an aqueous alkali.

摘要翻译： 本发明提供一种蚀刻或电镀方法，包括以下步骤：i）将碱可去除的水不溶性热熔喷墨油墨喷墨印刷到基底上以形成抗蚀剂图像; ii）在含水酸性介质中蚀刻或镀覆基底; 和iv）用碱水溶液除去抗蚀剂图像。