公开(公告)号：US07542242B2

公开(公告)日：2009-06-02

申请号：US10959429

申请日：2004-10-07

申请人： Masashi Shiraishi ,  Hiroyoshi Nakajima ,  Ichiro Yagi

发明人： Masashi Shiraishi ,  Hiroyoshi Nakajima ,  Ichiro Yagi

IPC分类号： G11B5/48

CPC分类号： G11B5/486 ,  H05K3/0061 ,  H05K3/328 ,  H05K3/4069 ,  H05K3/44 ,  H05K2201/0215 ,  H05K2201/09554 ,  H05K2203/107

摘要： A suspension includes a flexure constituted by a metal plate member, for supporting a head slider provided with at least one head element, a load beam provided with a top end section and constituted by a metal plate member, for supporting the flexure at the top end section, and an individual FPC member attached to the flexure and the load beam and provided with trace conductors to be electrically connected to the at least one head element of the head slider. The FPC member includes a plurality of via holes provided with metal fillers filled therein, the metal fillers in the respective via holes are welded to the flexure and/or the load beam, and the FPC member is fixed to the flexure and/or the load beam at least by means of the welding.

摘要翻译： 悬架包括由金属板构件构成的挠曲件，用于支撑设置有至少一个头部元件的头部滑块，设置有顶端部分并由金属板构件构成的负载梁，用于在顶端支撑弯曲部 以及附接到挠曲件和负载梁的单独的FPC构件，并且设置有电连接到头滑块的至少一个头元件的迹线导体。 FPC部件包括设置有填充有金属填充物的多个通孔，各通路孔中的金属填充物焊接到挠曲部和/或负载梁上，FPC部件固定在挠曲部和/或负载部 至少通过焊接。

公开(公告)号：US20050078416A1

公开(公告)日：2005-04-14

申请号：US10959429

申请日：2004-10-07

申请人： Masashi Shiraishi ,  Hiroyoshi Nakajima ,  Ichiro Yagi

发明人： Masashi Shiraishi ,  Hiroyoshi Nakajima ,  Ichiro Yagi

IPC分类号： G11B5/60 ,  G11B5/48 ,  G11B21/16 ,  G11B21/21 ,  H05K3/32 ,  H05K3/40 ,  H05K3/44

CPC分类号： G11B5/486 ,  H05K3/0061 ,  H05K3/328 ,  H05K3/4069 ,  H05K3/44 ,  H05K2201/0215 ,  H05K2201/09554 ,  H05K2203/107

摘要： A suspension includes a flexure constituted by a metal plate member, for supporting a head slider provided with at least one head element, a load beam provided with a top end section and constituted by a metal plate member, for supporting the flexure at the top end section, and an individual FPC member attached to the flexure and the load beam and provided with trace conductors to be electrically connected to the at least one head element of the head slider. The FPC member includes a plurality of via holes provided with metal fillers filled therein, the metal fillers in the respective via holes are welded to the flexure and/or the load beam, and the FPC member is fixed to the flexure and/or the load beam at least by means of the welding.

摘要翻译： 悬架包括由金属板构件构成的挠曲件，用于支撑设置有至少一个头部元件的头部滑块，设置有顶端部分并由金属板构件构成的负载梁，用于在顶端支撑弯曲部 以及附接到挠曲件和负载梁的单独的FPC构件，并且设置有电连接到头滑块的至少一个头元件的迹线导体。 FPC部件包括设置有填充有金属填充物的多个通孔，各通路孔中的金属填充物焊接到挠曲部和/或负载梁上，FPC部件固定在挠曲部和/或负载部 至少通过焊接。

公开(公告)号：US06680824B2

公开(公告)日：2004-01-20

申请号：US09953184

申请日：2001-09-17

申请人： Takehiro Kamigama ,  Ichiro Yagi ,  Masashi Shiraishi

发明人： Takehiro Kamigama ,  Ichiro Yagi ,  Masashi Shiraishi

IPC分类号： G11B548

CPC分类号： G11B5/484

摘要： An HAA has at least one HGA, each including a head slider with at least one head element, a suspension for supporting the head slider, and a lead conductor member electrically connected with the at least one head element, and a main body including at least one actuator arm for supporting the at least one HGA. The main body of the HAA is made of a metal material, and a surface of the main body is coated by a DLC film.

摘要翻译： HAA具有至少一个HGA，每个HGA包括具有至少一个头元件的磁头滑动器，用于支撑磁头滑块的悬架，以及与所述至少一个磁头元件电连接的引线导体部件，以及至少包括 一个用于支撑至少一个HGA的致动器臂。 HAA的主体由金属材料制成，主体的表面被DLC膜包覆。

公开(公告)号：US20070246251A1

公开(公告)日：2007-10-25

申请号：US11785318

申请日：2007-04-17

申请人： Masashi Shiraishi ,  Ichiro Yagi

发明人： Masashi Shiraishi ,  Ichiro Yagi

IPC分类号： H05K1/02

CPC分类号： H05K3/361 ,  G11B5/4846 ,  H05K1/056 ,  H05K3/243 ,  H05K3/323 ,  H05K3/4007 ,  H05K3/4015 ,  H05K2201/0367 ,  H05K2201/10234

摘要： A plurality of bonding structures and their forming methods for bonding a FPC to a bonding pad, in particular a bonding pad of a wireless suspension in a head gimbal assembly, using anisotropic conductive adhesive; such structures eliminate the spring-back force in typical anisotropic bonding to ensure durable bonding. At the same time, these structures also allow for reworkability under which the bonded parts can be separated easily.

摘要翻译： 多个接合结构及其形成方法，用于使用各向异性导电粘合剂将FPC粘合到接合焊盘，特别是头部万向节组件中的无线悬架的接合焊盘; 这种结构消除了典型各向异性粘结中的回弹力，以确保持久的粘合。 同时，这些结构还允许可再粘性，其中粘合部分可以容易地分离。

公开(公告)号：US07205484B2

公开(公告)日：2007-04-17

申请号：US10730263

申请日：2003-12-09

申请人： Masashi Shiraishi ,  Ichiro Yagi

发明人： Masashi Shiraishi ,  Ichiro Yagi

IPC分类号： H05K1/16

CPC分类号： H05K3/361 ,  G11B5/4846 ,  H05K1/056 ,  H05K3/243 ,  H05K3/323 ,  H05K3/4007 ,  H05K3/4015 ,  H05K2201/0367 ,  H05K2201/10234

摘要： A plurality of bonding structures and their forming methods for bonding a FPC to a bonding pad, in particular a bonding pad of a wireless suspension in a head gimbal assembly, using anisotropic conductive adhesive; such structures eliminate the spring-back force in typical anistropic bonding to ensure durable bonding. At the same time, these structures also allow for reworkability under which the bonded parts can be separated easily.

摘要翻译： 多个接合结构及其形成方法，用于使用各向异性导电粘合剂将FPC粘合到接合焊盘，特别是头部万向节组件中的无线悬架的接合焊盘; 这种结构消除了典型各向异性粘结中的回弹力，以确保持久的粘合。 同时，这些结构还允许可再粘性，其中粘合部分可以容易地分离。

公开(公告)号：US06703566B1

公开(公告)日：2004-03-09

申请号：US09696276

申请日：2000-10-25

申请人： Masashi Shiraishi ,  Ichiro Yagi

发明人： Masashi Shiraishi ,  Ichiro Yagi

IPC分类号： H05K116

CPC分类号： H05K3/361 ,  G11B5/4846 ,  H05K1/056 ,  H05K3/243 ,  H05K3/323 ,  H05K3/4007 ,  H05K3/4015 ,  H05K2201/0367 ,  H05K2201/10234

摘要： A plurality of bonding structures and their forming methods for bonding a FPC to a bonding pad, in particular a bonding pad of a wireless suspension in a head gimbal assembly, using anisotropic conductive adhesive; such structures eliminate the spring-back force in typical anisotropic bonding to ensure durable bonding. At the same time, these structures also allow for reworkability under which the bonded parts can be separated easily.

摘要翻译： 多个接合结构及其形成方法，用于使用各向异性导电粘合剂将FPC粘合到接合焊盘，特别是头部万向节组件中的无线悬架的接合焊盘; 这种结构消除了典型各向异性粘结中的回弹力，以确保持久的粘合。 同时，这些结构还允许可再粘性，其中粘合部分可以容易地分离。

公开(公告)号：US06590745B1

公开(公告)日：2003-07-08

申请号：US09484794

申请日：2000-01-18

申请人： Ichiro Yagi

发明人： Ichiro Yagi

IPC分类号： G11B1562

CPC分类号： G11B5/3106 ,  G11B5/255 ,  G11B5/6005 ,  Y10T29/49041

摘要： A magnetic head with an air bearing surface to which an appropriate roughness, a method of manufacturing the same, and a magnetic disk apparatus are provided. A head core part is formed on a base body made of altic formed by dispersing grain titanium carbide into alumina, and then an air bearing surface is formed. Next, plasma oxidation is performed so that a number of protrusions with height of about 5 nm are selectively formed only on the base-body region of the air bearing surface. The protrusions are composed of titanium oxide formed by the exposed portion among titanium carbide grains on the air bearing surface being selectively oxidized. Growth of the protrusions is promoted by applying photoresist on the ABS and removing it before performing plasma oxidation. The magnetic head has no risk of adsorbing a recording medium so that it has excellent CSS.

摘要翻译： 具有适当粗糙度的空气轴承表面的磁头，其制造方法和磁盘装置。 头芯部分形成在通过将晶粒碳化钛分散在氧化铝中形成的由铝制成的基体上，然后形成空气轴承表面。 接下来，进行等离子体氧化，使得仅在空气轴承表面的基体区域上选择性地形成高度约5nm的多个突起。 突起由选择性氧化的空气轴承表面上的碳化钛颗粒中的暴露部分形成的氧化钛组成。 通过在ABS上施加光致抗蚀剂并在进行等离子体氧化之前将其去除来促进突起的生长。 磁头没有吸附记录介质的风险，因此具有优异的CSS。

公开(公告)号：US20080280029A1

公开(公告)日：2008-11-13

申请号：US11889643

申请日：2007-08-15

申请人： Ichiro Yagi ,  DeFeng Lu ,  XiaoGang Yang ,  DeYu He

发明人： Ichiro Yagi ,  DeFeng Lu ,  XiaoGang Yang ,  DeYu He

IPC分类号： B05D7/00

CPC分类号： C23C22/60 ,  B23K35/0222 ,  H01L24/11 ,  H01L24/13 ,  H01L2224/11822 ,  H01L2224/13111 ,  H01L2224/13611 ,  H05K3/34 ,  H05K2203/0793 ,  H01L2924/053

摘要： A surface treatment method for solder joint employs alkali buffer solution dipping the solder joint and the alkali buffer solution reacts with the solder joint thus yielding a passive layer. As the resultant passive layer forms on the surface of the solder joint, thereby prevents further corrosion and dissolution during aqueous cleaning or water dipping thereafter. In addition, the passive layer ensures a good appearance with maximum protection of the solder joint and also provides a sound reliability and a high testability of a finished electronic product equipped with the solder joint.

摘要翻译： 焊接接头的表面处理方法采用浸渍焊点的碱缓冲溶液，碱缓冲溶液与焊点反应，从而产生钝化层。 由于所得到的钝化层形成在焊接接头的表面上，从而防止在水性清洗期间的进一步的腐蚀和溶解或其后的水浸渍。 此外，钝化层确保了良好的外观，同时最大程度地保护了焊点，并且还提供了配有焊点的成品电子产品的良好可靠性和高可测试性。

公开(公告)号：US06771470B1

公开(公告)日：2004-08-03

申请号：US09694010

申请日：2000-10-23

申请人： Ichiro Yagi

发明人： Ichiro Yagi

IPC分类号： G11B2108

CPC分类号： G11B5/4846 ,  H05K3/323 ,  H05K3/361

摘要： A connecting portion of the external side FPC board connected to a control circuit provided outside of a magnetic head assembly and connecting terminals of arm side FPC boards respectively connected to magnetic heads are overlapped with an anisotropic conductive tape having anisotropic conductivity in the direction of thickness in between. The anisotropic conductive tape is applied pressure between the connecting portion and the connecting terminals with heating to a temperature of, for example, 150° C. and is set. As a result, the connecting portion and the connecting terminals are connected. The anisotropic conductive tape has anisotropic conductivity only in the direction of thickness so that conduction of wirings adjacent each other is prevented although a plurality of wirings is formed on the connecting portion and the connecting terminals.

摘要翻译： 连接到设置在磁头组件外侧的控制电路和分别连接到磁头的臂侧FPC板的连接端子的外侧FPC板的连接部分与厚度方向上具有各向异性导电性的各向异性导电带重叠 之间。 各向异性导电带在连接部分和连接端子之间施加压力，加热到例如150℃的温度并设定。 结果，连接部分和连接端子被连接。 各向异性导电带仅在厚度方向上具有各向异性导电性，因此尽管在连接部分和连接端子上形成多个布线，但是防止了彼此相邻的布线的导通。

公开(公告)号：US07736445B2

公开(公告)日：2010-06-15

申请号：US11889643

申请日：2007-08-15

申请人： Ichiro Yagi ,  DeFeng Lu ,  XiaoGang Yang ,  DeYu He

发明人： Ichiro Yagi ,  DeFeng Lu ,  XiaoGang Yang ,  DeYu He

IPC分类号： C23C8/40 ,  C23C22/60

CPC分类号： C23C22/60 ,  B23K35/0222 ,  H01L24/11 ,  H01L24/13 ,  H01L2224/11822 ,  H01L2224/13111 ,  H01L2224/13611 ,  H05K3/34 ,  H05K2203/0793 ,  H01L2924/053

摘要： A surface treatment method for solder joint employs alkali buffer solution dipping the solder joint and the alkali buffer solution reacts with the solder joint thus yielding a passive layer. As the resultant passive layer forms on the surface of the solder joint, thereby prevents further corrosion and dissolution during aqueous cleaning or water dipping thereafter. In addition, the passive layer ensures a good appearance with maximum protection of the solder joint and also provides a sound reliability and a high testability of a finished electronic product equipped with the solder joint.

摘要翻译： 焊接接头的表面处理方法采用浸渍焊点的碱缓冲溶液，碱缓冲溶液与焊点反应，从而产生钝化层。 由于所得到的钝化层形成在焊接接头的表面上，从而防止在水性清洗期间的进一步的腐蚀和溶解或其后的水浸渍。 此外，钝化层确保了良好的外观，同时最大程度地保护了焊点，并且还提供了配有焊点的成品电子产品的良好可靠性和高可测试性。