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公开(公告)号：US20100044802A1
公开(公告)日：2010-02-25
申请号：US12495070
申请日：2009-06-30
IPC分类号： H01L29/06 , H01L21/762
CPC分类号： H01L21/763 , H01L21/76224 , H01L29/7846
摘要： Provided are a semiconductor device making it possible to form an element region having a dimension close to a designed dimension, restrain a phenomenon similar to gate-induced drain leakage, and further restrain compressive stress to be applied to the element region by oxidation of a conductive film; and a method for manufacturing the semiconductor device. Trenches are made in a main surface of a semiconductor substrate. By oxidizing the wall surface of each of the trenches, a first oxide film is formed on the wall surface. An embedded conductive film is formed to be embedded into the trench. The embedded conductive film is oxidized in an atmosphere containing an active oxidizing species, thereby forming a second oxide film. A third oxide film is formed on the second oxide film by CVD or coating method.
摘要翻译： 提供一种半导体器件，其可以形成具有接近设计尺寸的尺寸的元件区域，抑制类似于栅极引起的漏极泄漏的现象，并且进一步抑制通过导电的氧化对元件区域施加的压缩应力 电影; 以及半导体装置的制造方法。 沟槽在半导体基板的主表面上制成。 通过氧化每个沟槽的壁表面，在壁表面上形成第一氧化膜。 嵌入的导电膜被形成为嵌入到沟槽中。 嵌入的导电膜在含有活性氧化物质的气氛中被氧化，从而形成第二氧化膜。 通过CVD或涂布法在第二氧化物膜上形成第三氧化物膜。
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公开(公告)号：US08592284B2
公开(公告)日：2013-11-26
申请号：US12495070
申请日：2009-06-30
IPC分类号： H01L21/76
CPC分类号： H01L21/763 , H01L21/76224 , H01L29/7846
摘要： Provided are a semiconductor device making it possible to form an element region having a dimension close to a designed dimension, restrain a phenomenon similar to gate-induced drain leakage, and further restrain compressive stress to be applied to the element region by oxidation of a conductive film; and a method for manufacturing the semiconductor device. Trenches are made in a main surface of a semiconductor substrate. By oxidizing the wall surface of each of the trenches, a first oxide film is formed on the wall surface. An embedded conductive film is formed to be embedded into the trench. The embedded conductive film is oxidized in an atmosphere containing an active oxidizing species, thereby forming a second oxide film. A third oxide film is formed on the second oxide film by CVD or coating method.
摘要翻译： 提供一种半导体器件，其可以形成具有接近设计尺寸的尺寸的元件区域，抑制类似于栅极引起的漏极泄漏的现象，并且进一步抑制通过导电的氧化对元件区域施加的压缩应力 电影; 以及半导体装置的制造方法。 沟槽在半导体基板的主表面上制成。 通过氧化每个沟槽的壁表面，在壁表面上形成第一氧化膜。 嵌入的导电膜被形成为嵌入到沟槽中。 嵌入的导电膜在含有活性氧化物质的气氛中被氧化，从而形成第二氧化物膜。 通过CVD或涂布法在第二氧化物膜上形成第三氧化物膜。
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公开(公告)号：US08043918B2
公开(公告)日：2011-10-25
申请号：US12840430
申请日：2010-07-21
IPC分类号： H01L21/336
CPC分类号： H01L21/823475 , H01L21/743 , H01L21/76229 , H01L21/763 , H01L21/823481 , H01L21/823871 , H01L21/823878 , H01L29/7833 , H01L2924/0002 , H01L2924/00
摘要： To manufacture in high productivity a semiconductor device capable of securely achieving element isolation by a trench-type element isolation and capable of effectively preventing potentials of adjacent elements from affecting other nodes, a method of manufacturing the semiconductor device includes: a step of forming a first layer on a substrate; a step of forming a trench by etching the first layer and the substrate; a step of thermally oxidizing an inner wall of the trench; a step of depositing a first conductive film having a film thickness equal to or larger than one half of the trench width of the trench on the substrate including the trench; a step of removing a first conductive film from the first layer by a CMP method and keeping the first conductive film left in only the trench; a step of anisotropically etching the first conductive film within the trench to adjust the height of the conductive film to become lower than the height of the surface of the substrate; a step of depositing an insulating film on the first conductive film by the CVD method to embed the upper part of the first conductive film within the trench; a step of flattening the insulating film by the CMP method; and a step of removing the first layer.
摘要翻译： 为了以高生产率制造能够通过沟槽型元件隔离可靠地实现元件隔离并且能够有效地防止相邻元件的电位影响其他节点的半导体器件，制造半导体器件的方法包括：形成第一 层; 通过蚀刻第一层和衬底形成沟槽的步骤; 热氧化沟槽内壁的步骤; 在包括沟槽的衬底上沉积膜厚度等于或大于沟槽的沟槽宽度的一半的第一导电膜的步骤; 通过CMP方法从第一层除去第一导电膜并保持第一导电膜仅留在沟槽中的步骤; 在沟槽内各向异性蚀刻第一导电膜的步骤，以调节导电膜的高度，使其低于衬底表面的高度; 通过CVD法在第一导电膜上沉积绝缘膜以将第一导电膜的上部嵌入沟槽内的步骤; 通过CMP方法使绝缘膜平坦化的步骤; 以及去除第一层的步骤。
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公开(公告)号：US07791163B2
公开(公告)日：2010-09-07
申请号：US11577878
申请日：2005-10-18
IPC分类号： H01L29/768
CPC分类号： H01L21/823475 , H01L21/743 , H01L21/76229 , H01L21/763 , H01L21/823481 , H01L21/823871 , H01L21/823878 , H01L29/7833 , H01L2924/0002 , H01L2924/00
摘要： In the process of manufacturing a semiconductor device, a first layer is formed on a substrate, and the first layer and the substrate are etched to form a trench. The inner wall of the trench is thermally oxidized. On the substrate, including inside the trench, is deposited a first conductive film having a thickness equal to or larger than one half of the width of the trench. The first conductive film on the first layer is removed by chemical mechanical polishing such that the first conductive film remains in only the trench. The height of the first conductive film in the trench is adjusted to be lower than a surface of the substrate by anisotropically etching the first conductive film. An insulating film is deposited on the substrate by chemical vapor deposition to cover an upper surface of the first conductive film in the trench. The insulating film is flattened by chemical mechanical polishing, and the first layer is removed.
摘要翻译： 在制造半导体器件的过程中，在衬底上形成第一层，并且蚀刻第一层和衬底以形成沟槽。 沟槽的内壁被热氧化。 在包括沟槽内部的衬底上沉积厚度等于或大于沟槽宽度的一半的第一导电膜。 通过化学机械抛光去除第一层上的第一导电膜，使得第一导电膜仅保留在沟槽中。 通过各向异性蚀刻第一导电膜，将沟槽中的第一导电膜的高度调节为低于衬底的表面。 通过化学气相沉积在衬底上沉积绝缘膜以覆盖沟槽中的第一导电膜的上表面。 绝缘膜通过化学机械抛光而变平，第一层被去除。
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公开(公告)号：US20070241373A1
公开(公告)日：2007-10-18
申请号：US11577878
申请日：2005-10-18
IPC分类号： H01L29/768 , H01L21/76 , H01L29/00
CPC分类号： H01L21/823475 , H01L21/743 , H01L21/76229 , H01L21/763 , H01L21/823481 , H01L21/823871 , H01L21/823878 , H01L29/7833 , H01L2924/0002 , H01L2924/00
摘要： In the process of manufacturing a semiconductor device, a first layer is formed on a substrate, and the first layer and the substrate are etched to form a trench. The inner wall of the trench is thermally oxidized. On the substrate, including inside the trench, is deposited a first conductive film having a thickness equal to or larger than one half of the width of the trench. The first conductive film on the first layer is removed by chemical mechanical polishing such that the first conductive film remains in only the trench. The height of the first conductive film in the trench is adjusted to be lower than a surface of the substrate by anisotropically etching the first conductive film. An insulating film is deposited on the substrate by chemical vapor deposition to cover an upper surface of the first conductive film in the trench. The insulating film is flattened by chemical mechanical polishing, and the first layer is removed.
摘要翻译： 在制造半导体器件的过程中，在衬底上形成第一层，并且蚀刻第一层和衬底以形成沟槽。 沟槽的内壁被热氧化。 在包括沟槽内部的衬底上沉积厚度等于或大于沟槽宽度的一半的第一导电膜。 通过化学机械抛光去除第一层上的第一导电膜，使得第一导电膜仅保留在沟槽中。 通过各向异性蚀刻第一导电膜，将沟槽中的第一导电膜的高度调节为低于衬底的表面。 通过化学气相沉积在衬底上沉积绝缘膜以覆盖沟槽中的第一导电膜的上表面。 绝缘膜通过化学机械抛光而变平，第一层被去除。
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6.发明授权Semiconductor device with element isolation using impurity-doped insulator and oxynitride film 失效使用杂质掺杂绝缘体和氧氮化物膜的元件隔离的半导体器件公开(公告)号：US06744113B2
公开(公告)日：2004-06-01
申请号：US10377829
申请日：2003-03-04
IPC分类号： H01L2900
CPC分类号： H01L21/76224 , H01L21/823481
摘要： In a trench (2), an oxynitride film (31ON1) and a silicon oxide film (31O1) are positioned between a doped silicon oxide film (31D) and a substrate (1), and a silicon oxide film (31O2) is positioned closer to the entrance of the trench (2) than the doped silicon oxide film (31D). The oxynitride film (31ON1) is formed by a nitridation process utilizing the silicon oxide film (31O1). The vicinity of the entrance of the trench (2) is occupied by the silicon oxide films (31O1, 31O2) and the oxynitride film (31ON1).
摘要翻译： 在沟槽（2）中，氧氮化物膜（31ON1）和氧化硅膜（3101）位于掺杂氧化硅膜（31D）和衬底（1）之间，氧化硅膜（310）位于更靠近 到沟槽（2）的入口比掺杂的氧化硅膜（31D）。 氧氮化物膜（31ON1）通过利用氧化硅膜（3101）的氮化工艺形成。 沟槽（2）的入口附近被氧化硅膜（3101,3102）和氮氧化物膜（31ON1）所占据。
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公开(公告)号：US20060027883A1
公开(公告)日：2006-02-09
申请号：US11241921
申请日：2005-10-04
IPC分类号： H01L29/94
CPC分类号： H01L29/66553 , H01L21/26586 , H01L21/28088 , H01L21/28114 , H01L29/42376 , H01L29/4966 , H01L29/517 , H01L29/66545 , H01L29/6659
摘要： An object is to obtain a semiconductor device in which channel length is reduced without increasing the gate resistance to realize higher operation speed and its manufacturing method. An MOSFET has a trench-type element isolation structure (2) formed in the main surface of a semiconductor substrate (1), a pair of extensions (3) and source/drain regions (4) selectively formed in the main surface of the semiconductor substrate (1) to face each other through a channel region (50), a silicon oxide film (5) formed on the trench-type element isolation structure (2) and on the source/drain regions (4) through a silicon oxide film (12), sidewalls (6) formed on sides of the silicon oxide film (5), a gate insulating film (7) formed on the main surface of the semiconductor substrate (1) in the part in which the channel region (50) is formed, and a gate electrode (8) formed to fill a recessed portion in an inversely tapered form formed by the sides of the sidewalls (6) and the upper surface of the gate insulating film (7).
摘要翻译： 本发明的目的是获得其中通道长度减小而不增加栅极电阻以实现更高的操作速度的半导体器件及其制造方法。 MOSFET具有形成在半导体衬底（1）的主表面中的沟槽型元件隔离结构（2），在半导体的主表面中选择性地形成的一对延伸部（3）和源极/漏极区域（4） 衬底（1）通过沟道区域（50）彼此面对，通过硅氧化膜形成在沟槽型元件隔离结构（2）上和源极/漏极区域（4）上的氧化硅膜（5） （12），形成在氧化硅膜（5）的侧面上的侧壁（6），形成在半导体衬底（1）的主表面上的沟道区域（50）的部分中的栅极绝缘膜（7） 以及形成为以由侧壁（6）的侧面和栅极绝缘膜（7）的上表面形成的倒锥形状填充凹部的栅电极（8）。
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8.发明授权公开(公告)号：US06274457B1
公开(公告)日：2001-08-14
申请号：US09481386
申请日：2000-01-12
申请人： Maiko Sakai , Takashi Kuroi , Katsuyuki Horita
发明人： Maiko Sakai , Takashi Kuroi , Katsuyuki Horita
IPC分类号： H01L2176
CPC分类号： H01L21/76232
摘要： A semiconductor device comprising a semiconductor substrate, a trench formed in the substrate and having an inner wall including a sidewall and a bottom surface, a silicon oxide film deposited on the inner wall, and a buried oxide film deposited on the silicon oxide film to bury the trench, wherein the sidewall has portions of a sidewall sloped at a first profile angle A1, a second profile angle A2 and a third profile angle A3 from a surface of the substrate toward the bottom surface of the trench, and the profile angles have a relationship of A1
摘要翻译： 一种半导体器件，包括半导体衬底，形成在衬底中并具有包括侧壁和底表面的内壁的沟槽，沉积在内壁上的氧化硅膜和沉积在氧化硅膜上的掩埋氧化膜以埋入 沟槽，其中侧壁具有从基板的表面到沟槽的底表面以第一轮廓角A1倾斜的侧壁的第二轮廓角A2和第三轮廓角A3，并且轮廓角具有 A1
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9.发明授权Method of manufacturing semiconductor device including steps of forming both insulating film and epitaxial semiconductor on substrate 失效制造半导体器件的方法包括在衬底上形成绝缘膜和外延半导体的步骤公开(公告)号：US06737315B2
公开(公告)日：2004-05-18
申请号：US10212249
申请日：2002-08-06
IPC分类号： H01L218242
CPC分类号： H01L21/762 , H01L21/823481 , H01L23/544 , H01L2223/54453 , H01L2924/0002 , H01L2924/00
摘要： A substrate surface (10S) is thermally oxidized to form an oxide film. The oxide film is patterned so that the substrate surface (10S) in an active region is exposed. An oxide film (20) is thereby provided. An exposed substrate surface (10S) is thermally oxidized, to form a thermal oxide film. This thermal oxide film is thereafter removed at least in an element forming region. A silicon film (41) is epitaxially grown on the exposed substrate surface (10S). Thereafter the silicon film (41) is polished by CMP to an extent that an upper surface of the silicon film after polishing is not more than an upper surface of the oxide film (20) in height. Next, the surface of the silicon film is thermally oxidized to form a thermal oxide film. After ion implantation of various types, this thermal oxide film is removed.
摘要翻译： 将基板表面（10S）热氧化以形成氧化膜。 图案化氧化膜，使得有源区域中的衬底表面（10S）暴露。 由此提供氧化膜（20）。 暴露的衬底表面（10S）被热氧化，以形成热氧化膜。 此后，至少在元件形成区域中除去该热氧化膜。 在暴露的基板表面（10S）上外延生长硅膜（41）。 此后，通过CMP对硅膜（41）进行抛光，使抛光后的硅膜的上表面的高度不超过氧化膜（20）的上表面。 接着，将硅膜的表面热氧化，形成热氧化膜。 在各种类型的离子注入之后，去除该热氧化膜。
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公开(公告)号：US06707099B2
公开(公告)日：2004-03-16
申请号：US10218444
申请日：2002-08-15
IPC分类号： H01L29792
CPC分类号： H01L29/66651 , H01L21/28123 , H01L29/1033
摘要： A semiconductor device less susceptible to inverse narrow channel effect and its manufacturing method are provided. A silicon nitride film (13) is adopted as element isolation regions; the silicon nitride film (13) has a smaller etch rate than a sacrificial silicon oxide film (7) which serves as a sacrificial layer during ion implantation (8). This prevents formation of recesses in the silicon nitride film (13) during the removal of the sacrificial silicon oxide film (7), which weakens the strength of the electric fields at the gate edges. Weakening the strength of the electric fields at the gate edges suppresses the inverse narrow channel effect, so that the MOS transistor offers a characteristic closer to a characteristic in which the threshold voltage keeps a constant value independently of the channel width. Thus an MOS transistor having a good characteristic can be manufactured.
摘要翻译： 提供了一种不易反向窄通道效应的半导体器件及其制造方法。 采用氮化硅膜（13）作为元件隔离区域; 氮化硅膜（13）具有比在离子注入期间用作牺牲层的牺牲氧化硅膜（7）更小的蚀刻速率（8）。 这样可以防止在去除牺牲氧化硅膜（7）期间在氮化硅膜（13）中形成凹陷，这削弱了栅极边缘处的电场强度。 削弱栅极边缘处的电场强度抑制了反向窄通道效应，使得MOS晶体管具有更接近阈值电压独立于沟道宽度保持恒定值的特性。 因此，可以制造具有良好特性的MOS晶体管。
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