摘要:
To provide a high-temperature steam electrolytic apparatus and method that steam can be used as a common gas between a hydrogen electrode and an oxygen electrode, and the steam can be electrolyzed efficiently while the electrodes of the electrochemical cell are suppressed from oxidative and reductive degradation. A steam electrolytic apparatus 10, comprising an electrochemical cell composed of an electrolyte containing a solid oxide mainly, a hydrogen electrode and an oxygen electrode; a steam supply portion 13 for supplying the electrochemical cell 11 with a gas containing steam as a main component; a hydrogen gas discharge portion 14 for discharging hydrogen generated by the hydrogen electrode by electrolysis of the steam; and an oxygen gas discharge portion 15 for discharging oxygen generated by the oxygen electrode by electrolysis of the steam, wherein the oxygen electrode contains a reduction-resistant material.
摘要:
A static random access memory cell comprising a first inverter, a second inverter, a first transistor, a second transistor, and a third transistor. The first inverter is cross-coupled with the second inverter. The first transistor is connected with a write word line, a write bit line, and a first output node of the first inverter. The second transistor is connected with a complementary write bit line, the write word line, and a second output node of the second inverter. The third transistor is connected with a read bit line, a read word line, and the first input node of the first inverter to form a read port transistor, and a read port is formed. The read port transistor has a feature of asymmetric threshold voltage, and the read bit line swing can be expanded by the decrease of clamping current or the boosted read bit line.
摘要:
A non-contact IC tag includes; a plurality of antennas corresponding to a plurality of frequency bands, and a peel-off sticker. The peel-off sticker is applied to at least one of the plurality of antennas and can be peeled off to disable the at least one antenna to which the peel-off sticker is applied.
摘要:
A semiconductor integrated circuit device has a plurality of design patterns composed of circuit elements or wires formed on a substrate. The respective finished sizes of the plurality of design patterns have a plurality of minimum size values which differ from one design pattern to another depending on the geometric feature of each of the design patterns.
摘要:
A mask ROM includes bit lines, word lines intersecting with the bit lines and bit cells provided along the word lines, each of the bit lines being formed of a cell transistor having a gate connected to an associated one of the word lines. In the mask ROM, further provided is a source node commonly connected to respective sources of ones of the cell transistors having a gate connected to one of adjacent two word lines. A current flows from a selected bit line to a non-selected bit line via a cell transistor selected in reading out data and the source node.
摘要:
A memory system includes a memory including a plurality of memory regions operating based on an identical principle; and an address conversion device for converting a logical address into a physical address based on a correspondence between an address space and the plurality of memory regions. The correspondence is defined based on an inherent condition regarding a performance of the memory.
摘要:
A signal transmitting/receiving apparatus according to the present invention includes: a transmitting device for transmitting data; a receiving device for receiving the data; a data line for transmitting the data; and a supply line for transmitting a bias voltage for determining a voltage of the data line, wherein the transmitting device and the receiving device are connected to each other through the data line and the supply line, the transmitting device including: a driver circuit for outputting the data to the data line; and a bias generating means for generating the bias voltage and outputting the bias voltage to the supply line, the receiving device including: a terminating resistor connected to the data line; and a receiver circuit for detecting the data from the data line, wherein the data line is connected to the supply line via the terminating resistor.
摘要:
A semiconductor integrated circuit device has a plurality of design patterns composed of circuit elements or wires formed on a substrate. The respective finished sizes of the plurality of design patterns have a plurality of minimum size values which differ from one design pattern to another depending on the geometric feature of each of the design patterns.
摘要:
In a semiconductor memory device, a precharge potential for non-selected bit lines among a plurality of bit lines, supplied by a HPR voltage source, is set at a value (for example, ½ Vcc=0.4 V) lower than the power supply voltage Vcc (low voltage in the range of 0.5 V to 1.2 V; for example, 0.8 V) determining the high-level side potential of data stored in a memory cell. A potential for non-selected word lines among a plurality of word lines, supplied by a NWL voltage source, is set at a predetermined negative potential (for example, −¼ Vcc=−0.2 V). The total of the precharge potential (0.4 V) of non-selected bit lines and the absolute value of the negative potential (−0.2 V) of non-selected word lines is set at a value less than the power supply voltage Vcc (0.8 V). By these settings, gate leakage current and GIDL current can be effectively limited to a small value while realizing effective limitation of OFF leakage current in a plurality of memory cells.
摘要:
First to third logic circuits and first to third static random access memories (SRAMs) are formed on one chip. Power to the first and third logic circuits and their SRAMs is shut off as required, while power to the second logic circuit and its SRAM is kept supplied. The third SRAM has the largest memory capacity. The average channel width of the first to third SRAM cell arrays is set at a half or less of that of the other circuit blocks, and the channel impurity concentration of the second and third SRAM cell arrays, which operate at low speed, is set higher than that of the first SRAM cell array, which operates at high speed, by additional ion implantation. By these settings, MOS transistors of low threshold voltage (Vt) are provided for the first SRAM cell array, while MOS transistors of high Vt are provided for the second and third SRAM cell arrays for leakage reduction.