公开(公告)号：US07154048B2

公开(公告)日：2006-12-26

申请号：US09979071

申请日：2001-04-04

申请人： Masayoshi Kikuchi ,  Masahiro Ohtahara ,  Kiyoshi Shimizu

发明人： Masayoshi Kikuchi ,  Masahiro Ohtahara ,  Kiyoshi Shimizu

IPC分类号： H01R12/04 ,  H05K1/11

CPC分类号： H01L23/49827 ,  H01L21/4846 ,  H01L23/49838 ,  H01L23/528 ,  H01L24/97 ,  H01L2924/14 ,  H05K3/0052 ,  H05K3/242 ,  H05K2203/0228 ,  H05K2203/1572 ,  Y10T29/4916 ,  H01L2924/00

摘要： A common electrode line for plating is used for forming conductive patterns of a plurality of circuit substrates on a main substrate. The main substrate has a cut line for dividing one and the other circuit substrates and a plurality of through holes formed on the one and the other circuit substrates along the cut line. The common electrode lines for plating includes first common electrode lines formed on one side of the main substrate, and second common electrode lines formed on the other side of the main substrate. Each first common electrode line extends from one through hole formed on the one circuit substrate to one through hole formed on the other circuit substrate. Each second common electrode line extends from the one through hole formed on the one circuit substrate to another through hole formed on the other circuit substrate.

摘要翻译： 用于电镀的公共电极线用于在主衬底上形成多个电路衬底的导电图案。 主基板具有用于划分一个和另外的电路基板的切割线和沿着切割线形成在一个和另外的电路基板上的多个通孔。 用于电镀的公共电极线包括形成在主衬底的一侧上的第一公共电极线和形成在主衬底的另一侧上的第二公共电极线。 每个第一公共电极线从形成在一个电路基板上的一个通孔延伸到形成在另一个电路基板上的一个通孔。 每个第二公共电极线从形成在一个电路基板上的一个通孔延伸到形成在另一个电路基板上的另一通孔。