Method of manufacturing semiconductor storage device
    8.
    发明授权
    Method of manufacturing semiconductor storage device 有权
    制造半导体存储装置的方法

    公开(公告)号:US07651930B2

    公开(公告)日:2010-01-26

    申请号:US12146802

    申请日:2008-06-26

    IPC分类号: H01L21/20

    摘要: A method of manufacturing a semiconductor storage device includes providing an opening portion in a plurality of positions in an insulating film formed on a silicon substrate, and thereafter forming an amorphous silicon film on the insulating film, in which the opening portions are formed, and in the opening portions. Then, trenches are formed to divide the amorphous silicon film, in the vicinity of a midpoint between adjacent opening portions, into a portion on one opening portion side and a portion on the other opening portion side. Next, the amorphous silicon film, in which the trenches are formed, is annealed and subjected to solid-phase crystallization to form a single crystal with the opening portions used as seeds, and thereby a silicon single-crystal layer is formed. Then, a memory cell array is formed on the silicon single-crystal layer.

    摘要翻译: 一种制造半导体存储装置的方法包括在形成在硅衬底上的绝缘膜中的多个位置提供开口部分,然后在其中形成开口部分的绝缘膜上形成非晶硅膜,并且在 开口部。 然后,形成沟槽,将相邻的开口部之间的中点附近的非晶硅膜分割成一个开口部侧的一部分和另一个开口部侧的一部分。 接着,对其中形成沟槽的非晶硅膜进行退火并进行固相结晶以形成具有用作晶种的开口部分的单晶,从而形成硅单晶层。 然后,在硅单晶层上形成存储单元阵列。

    METHOD OF MANUFACTURING SEMICONDUCTOR STORAGE DEVICE
    9.
    发明申请
    METHOD OF MANUFACTURING SEMICONDUCTOR STORAGE DEVICE 有权
    制造半导体存储器件的方法

    公开(公告)号:US20100112791A1

    公开(公告)日:2010-05-06

    申请号:US12646563

    申请日:2009-12-23

    IPC分类号: H01L21/20

    摘要: A method of manufacturing a semiconductor storage device includes providing an opening portion in a plurality of positions in an insulating film formed on a silicon substrate, and thereafter forming an amorphous silicon film on the insulating film, in which the opening portions are formed, and in the opening portions. Then, trenches are formed to divide the amorphous silicon film, in the vicinity of a midpoint between adjacent opening portions, into a portion on one opening portion side and a portion on the other opening portion side. Next, the amorphous silicon film, in which the trenches are formed, is annealed and subjected to solid-phase crystallization to form a single crystal with the opening portions used as seeds, and thereby a silicon single-crystal layer is formed. Then, a memory cell array is formed on the silicon single-crystal layer.

    摘要翻译: 一种制造半导体存储装置的方法包括在形成在硅衬底上的绝缘膜中的多个位置提供开口部分,然后在其中形成开口部分的绝缘膜上形成非晶硅膜,并且在 开口部。 然后,形成沟槽,将相邻的开口部之间的中点附近的非晶硅膜分割成一个开口部侧的一部分和另一个开口部侧的一部分。 接着,对其中形成沟槽的非晶硅膜进行退火并进行固相结晶以形成具有用作晶种的开口部分的单晶,从而形成硅单晶层。 然后,在硅单晶层上形成存储单元阵列。

    Method of manufacturing semiconductor storage device
    10.
    发明授权
    Method of manufacturing semiconductor storage device 有权
    制造半导体存储装置的方法

    公开(公告)号:US07863166B2

    公开(公告)日:2011-01-04

    申请号:US12646563

    申请日:2009-12-23

    IPC分类号: H01L21/20

    摘要: A method of manufacturing a semiconductor storage device includes providing an opening portion in a plurality of positions in an insulating film formed on a silicon substrate, and thereafter forming an amorphous silicon film on the insulating film, in which the opening portions are formed, and in the opening portions. Then, trenches are formed to divide the amorphous silicon film, in the vicinity of a midpoint between adjacent opening portions, into a portion on one opening portion side and a portion on the other opening portion side. Next, the amorphous silicon film, in which the trenches are formed, is annealed and subjected to solid-phase crystallization to form a single crystal with the opening portions used as seeds, and thereby a silicon single-crystal layer is formed. Then, a memory cell array is formed on the silicon single-crystal layer.

    摘要翻译: 一种制造半导体存储装置的方法包括在形成在硅衬底上的绝缘膜中的多个位置提供开口部分,然后在其中形成开口部分的绝缘膜上形成非晶硅膜,并且在 开口部。 然后,形成沟槽,将相邻的开口部之间的中点附近的非晶硅膜分割成一个开口部侧的一部分和另一个开口部侧的一部分。 接着,对其中形成沟槽的非晶硅膜进行退火并进行固相结晶以形成具有用作晶种的开口部分的单晶,从而形成硅单晶层。 然后,在硅单晶层上形成存储单元阵列。