Methods for deposition of materials including mechanical abrasion
    4.
    发明授权
    Methods for deposition of materials including mechanical abrasion 有权
    材料沉积方法,包括机械磨损

    公开(公告)号:US09459222B2

    公开(公告)日:2016-10-04

    申请号:US13800169

    申请日:2013-03-13

    CPC classification number: G01N27/12 Y10T29/49002

    Abstract: Methods described herein may be useful in the fabrication and/or screening of devices (e.g., sensors, circuits, etc.) including conductive materials. In some embodiments, a conductive material is formed on a substrate using mechanical abrasion. The methods described herein may be useful in fabricating sensors, circuits, tags for remotely-monitored sensors or human/object labeling and tracking, among other devices. In some cases, devices for determining analytes are also provided.

    Abstract translation: 本文所述的方法可用于制造和/或筛选包括导电材料的装置(例如,传感器,电路等)。 在一些实施例中,使用机械磨损在基板上形成导电材料。 本文描述的方法可用于制造用于远程监视的传感器的传感器,电路,标签,或者人/物体标记和跟踪以及其它设备。 在某些情况下,还提供了用于确定分析物的装置。

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