Integrated semiconductor optic sensor device
    1.
    发明授权
    Integrated semiconductor optic sensor device 有权
    集成半导体光电传感器装置

    公开(公告)号:US06538267B2

    公开(公告)日:2003-03-25

    申请号:US09972169

    申请日:2001-10-03

    IPC分类号: H01L31072

    CPC分类号: H01L27/14692 H01L27/14647

    摘要: The invention relates to a process for manufacturing a light sensor device in a standard CMOS process, including, implanting active areas on a semiconductor substrate to obtain a first integrated region of a corresponding photosensor; and forming a stack of layers having different thickness and refractive index layers over the photosensor to provide interferential filters for the same photosensor. At least one of the above mentioned layers is formed by a transparent metallic oxide having a high refraction index and a corresponding high dielectric constant. In this manner, due to the transparency of the high refraction index material, the design of interferential resonators is rendered more flexible making possible the use of a stack of layers including more than one high refraction index layer.

    摘要翻译: 本发明涉及一种在标准CMOS工艺中制造光传感器装置的方法,包括:在半导体衬底上注入有源区域,以获得相应的光电传感器的第一整合区域; 并且在光传感器上形成具有不同厚度和折射率层的层叠,以为同一光电传感器提供干涉滤光片。 上述层中的至少一层由具有高折射率和相应的高介电常数的透明金属氧化物形成。 以这种方式,由于高折射率材料的透明度,干涉谐振器的设计变得更加灵活,使得可能使用包括多于一个高折射率层的层叠。

    Integrated semiconductor optic sensor device and corresponding manufacturing process

    公开(公告)号:US06352876B1

    公开(公告)日:2002-03-05

    申请号:US09626836

    申请日:2000-07-27

    IPC分类号: H01L2100

    CPC分类号: H01L27/14692 H01L27/14647

    摘要: The invention relates to a process for manufacturing a light sensor device in a standard CMOS process, including, implanting active areas on a semiconductor substrate to obtain a first integrated region of a corresponding photosensor; and forming a stack of layers having different thickness and refractive index layers over the photosensor to provide interferential filters for the same photosensor. At least one of the above mentioned layers is formed by a transparent metallic oxide having a high refraction index and a corresponding high dielectric constant. In this manner, due to the transparency of the high refraction index material, the design of interferential resonators is rendered more flexible making possible the use of a stack of layers including more than one high refraction index layer.

    Integrated semiconductor light sensor device and corresponding manufacturing process
    3.
    发明授权
    Integrated semiconductor light sensor device and corresponding manufacturing process 有权
    集成半导体光传感器装置及相应的制造工艺

    公开(公告)号:US06830951B2

    公开(公告)日:2004-12-14

    申请号:US10252952

    申请日:2002-09-23

    IPC分类号: H01L2100

    CPC分类号: H01L27/14685 H01L27/14621

    摘要: The invention relates to a process for manufacturing a light sensor device in a standard CMOS process, including at least the following phases: implanting active areas on a semiconductor substrate to obtain at least a first, a second and a third integrated region of corresponding photosensors; forming a stack of layers of different thickness and refractive index layers over the photosensors to provide an interferential filter for said photosensors. The stack is obtained by a deposition of a first oxide stack including a first, a second and a third oxide layer over at least one photosensor; moreover, this third oxide layer is obtained by a deposition step of an protecting undoped premetal dielectric layer.

    摘要翻译: 本发明涉及一种用于制造标准CMOS工艺中的光传感器装置的方法,该方法至少包括以下阶段:在半导体衬底上注入有源区域以获得至少相应光电传感器的第一,第二和第三集成区域; 在光电传感器上形成不同厚度和折射率层的层叠,以为所述光电传感器提供干涉滤光片。 堆叠通过在至少一个光电传感器上沉积包括第一氧化物层,第二氧化物层和第三氧化物层的第一氧化物堆叠获得; 此外,该第三氧化物层通过保护性未掺杂的金属前介电层的沉积步骤获得。