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公开(公告)号：US09831220B2
公开(公告)日：2017-11-28
申请号：US13424699
申请日：2012-03-20
IPC分类号： H01L25/075 , H01L33/50 , H01L33/62 , H01L33/20
CPC分类号： H01L25/0753 , H01L33/20 , H01L33/505 , H01L33/62 , H01L2924/0002 , H01L2924/00
摘要： An electronic device may include a packaging substrate having a packaging face, and the packaging substrate may include positive and negative electrically conductive pads on the packaging face. A plurality of light emitting diodes may be electrically and mechanically coupled to the packaging face of the packaging substrate, with the plurality of light emitting diodes being electrically coupled between the positive and negative electrically conductive pads on the packaging face. A continuous optical coating may be provided on the plurality of light emitting diodes and on the packaging face of the packaging substrate so that the plurality of light emitting diodes are between the optical coating and the packaging substrate.
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2.发明申请Light Emitting Diode (LED) Arrays Including Direct Die Attach And Related Assemblies 有权发光二极管（LED）阵列包括直接贴片和相关组件公开(公告)号：US20130193453A1
公开(公告)日：2013-08-01
申请号：US13424699
申请日：2012-03-20
IPC分类号： H01L33/44
CPC分类号： H01L25/0753 , H01L33/20 , H01L33/505 , H01L33/62 , H01L2924/0002 , H01L2924/00
摘要： An electronic device may include a packaging substrate having a packaging face, and the packaging substrate may include positive and negative electrically conductive pads on the packaging face. A plurality of light emitting diodes may be electrically and mechanically coupled to the packaging face of the packaging substrate, with the plurality of light emitting diodes being electrically coupled between the positive and negative electrically conductive pads on the packaging face. A continuous optical coating may be provided on the plurality of light emitting diodes and on the packaging face of the packaging substrate so that the plurality of light emitting diodes are between the optical coating and the packaging substrate.
摘要翻译： 电子设备可以包括具有封装面的封装基板，并且封装基板可以包括在封装面上的正和负的导电焊盘。 多个发光二极管可以电气和机械耦合到封装基板的封装面，多个发光二极管电耦合在封装面上的正和负导电焊盘之间。 可以在多个发光二极管和封装基板的封装面上设置连续的光学涂层，使得多个发光二极管位于光学涂层和封装基板之间。
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3.发明授权Light emitting diode (LED) arrays including direct die attach and related assemblies 有权发光二极管（LED）阵列，包括直接芯片连接和相关组件公开(公告)号：US09053958B2
公开(公告)日：2015-06-09
申请号：US13463267
申请日：2012-05-03
IPC分类号： H01L33/62 , H01L25/075 , H01L33/20 , H01L33/50 , H01L33/54
CPC分类号： H01L25/0753 , H01L33/20 , H01L33/505 , H01L33/54 , H01L2924/0002 , H01L2924/00
摘要： An electronic device may include a packaging substrate having a packaging face and first and second pluralities of light emitting diodes electrically and mechanically coupled to the packaging face of the packaging substrate. The packaging substrate may include first and second electrically conductive pads on the packaging face. The light emitting diodes of the first plurality of light emitting diodes may be electrically coupled in parallel between the first electrically conductive pad and an interconnection structure on the packaging face. The light emitting diodes of the second plurality of light emitting diodes may be electrically coupled in parallel between the interconnection structure and the second electrically conductive pad.
摘要翻译： 电子设备可以包括具有封装面的封装基板，以及电气和机械耦合到封装基板的封装面的第一和第二多个发光二极管。 包装衬底可以包括在包装面上的第一和第二导电垫。 第一多个发光二极管的发光二极管可以并联在第一导电焊盘和封装面上的互连结构之间电耦合。 第二多个发光二极管的发光二极管可以在互连结构和第二导电焊盘之间并联电耦合。
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4.发明申请Light Emitting Diode (LED) Arrays Including Direct Die Attach And Related Assemblies 有权发光二极管（LED）阵列包括直接贴片和相关组件公开(公告)号：US20120305949A1
公开(公告)日：2012-12-06
申请号：US13463267
申请日：2012-05-03
IPC分类号： H01L33/08
CPC分类号： H01L25/0753 , H01L33/20 , H01L33/505 , H01L33/54 , H01L2924/0002 , H01L2924/00
摘要： An electronic device may include a packaging substrate having a packaging face and first and second pluralities of light emitting diodes electrically and mechanically coupled to the packaging face of the packaging substrate. The packaging substrate may include first and second electrically conductive pads on the packaging face. The light emitting diodes of the first plurality of light emitting diodes may be electrically coupled in parallel between the first electrically conductive pad and an interconnection structure on the packaging face. The light emitting diodes of the second plurality of light emitting diodes may be electrically coupled in parallel between the interconnection structure and the second electrically conductive pad.
摘要翻译： 电子设备可以包括具有封装面的封装基板，以及电气和机械耦合到封装基板的封装面的第一和第二多个发光二极管。 包装衬底可以包括在包装面上的第一和第二导电垫。 第一多个发光二极管的发光二极管可以并联在第一导电焊盘和封装面上的互连结构之间电耦合。 第二多个发光二极管的发光二极管可以在互连结构和第二导电焊盘之间并联电耦合。
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公开(公告)号：US09052416B2
公开(公告)日：2015-06-09
申请号：US13087510
申请日：2011-04-15
CPC分类号： G02B6/0003 , F21K9/232 , F21K9/60 , F21K9/61 , F21K9/64 , F21V29/70 , F21Y2115/10 , G02B5/02 , G02B6/001 , G02B6/0035 , G02B6/005 , G02B6/0073 , G02B6/0096
摘要： A semiconductor light emitting apparatus includes an elongated hollow wavelength conversion tube that comprises an elongated wavelength conversion tube wall having wavelength conversion material such as phosphor dispersed therein uniformly or non-uniformly. The tube need not be cylindrical. A semiconductor light emitting device is oriented to emit light inside the elongated hollow wavelength conversion tube to impinge upon the elongated wavelength conversion tube wall and the wavelength conversion material dispersed therein.
摘要翻译： 半导体发光装置包括细长的中空波长转换管，其包括具有均匀或不均匀分散的诸如磷光体的波长转换材料的细长波长转换管壁。 管不需要是圆柱形的。 半导体发光器件被定向以在细长的中空波长转换管内发光，以照射到分散在其中的细长波长转换管壁和波长转换材料。
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公开(公告)号：US20130271972A1
公开(公告)日：2013-10-17
申请号：US13446759
申请日：2012-04-13
CPC分类号： F21K9/13 , F21K9/23 , F21K9/232 , F21K9/64 , F21V3/00 , F21V3/08 , F21V9/30 , F21V29/85 , F21Y2107/00 , F21Y2113/13 , F21Y2115/10 , Y10T29/49117
摘要： A gas cooled LED lamp and submount is disclosed. The centralized nature of the LEDs allows the LEDs to be configured near the central portion of the optical envelope of the lamp. In some embodiments, the LEDs can be mounted on or fixed to a light transmissive submount. In some embodiments, LEDs can be disposed on both sides of a two-sided submount, or on thee or more sides if the submount structure includes three or more mounting surfaces. In example embodiments, the LEDs can be cooled and/or cushioned by a gas in thermal communication with the LED array to enable the LEDs to maintain an appropriate operating temperature for efficient operation and long life. In some embodiments, the gas is at a pressure of from about 0.5 to about 10 atmospheres and has a thermal conductivity of at least about 60 mW/m-K.
摘要翻译： 公开了一种气体冷却的LED灯和底座。 LED的集中性使得LED可以配置在灯的光学外壳的中心部分附近。 在一些实施例中，LED可以安装在透光底座上或固定到透光底座上。 在一些实施例中，如果底座结构包括三个或更多个安装表面，则LED可以设置在双面底座的两侧上，或者在其一侧或更多侧上。 在示例性实施例中，可以通过与LED阵列热连通的气体来冷却和/或缓冲LED，以使得LED能够保持适当的操作温度以有效地操作和长寿命。 在一些实施方案中，气体处于约0.5至约10个大气压的压力，并且具有至少约60mW / m-K的热导率。
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7.发明授权公开(公告)号：US08004172B2
公开(公告)日：2011-08-23
申请号：US12273216
申请日：2008-11-18
IPC分类号： H01J1/62
CPC分类号： F21V15/01 , F21K9/00 , F21K9/61 , F21K9/64 , F21V29/70 , F21Y2115/10 , G02B6/0003 , G02B6/001 , G02B6/0035 , G02B6/005 , G02B6/0096
摘要： A semiconductor light emitting apparatus includes an elongated hollow wavelength conversion tube that includes an elongated wavelength conversion tube wall having wavelength conversion material, such as phosphor, dispersed therein. A semiconductor light emitting device is oriented to emit light inside the elongated hollow wavelength conversion tube to impinge upon the elongated wavelength conversion tube wall and the wavelength conversion material dispersed therein. The elongated hollow wavelength conversion tube may have an open end, a crimped end, a reflective end, and/or other configurations. Multiples tubes and/or multiple semiconductor light emitting devices may also be used in various configurations. Related assembling methods are also described.
摘要翻译： 半导体发光装置包括细长的中空波长转换管，其包括分散在其中的波长转换材料（例如磷光体）的细长波长转换管壁。 半导体发光器件被定向以在细长的中空波长转换管内发光，以照射到分散在其中的细长波长转换管壁和波长转换材料。 细长的中空波长转换管可以具有开口端，压接端，反射端和/或其它构造。 多个管和/或多个半导体发光器件也可以以各种配置使用。 还描述了相关的组装方法。
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公开(公告)号：US09322543B2
公开(公告)日：2016-04-26
申请号：US13467670
申请日：2012-05-09
申请人： Christopher P. Hussell , John Adam Edmond , Gerald H. Negley , Curt Progl , Mark Edmond , Praneet Athalye
发明人： Christopher P. Hussell , John Adam Edmond , Gerald H. Negley , Curt Progl , Mark Edmond , Praneet Athalye
IPC分类号： F21V29/00 , H05K13/00 , F21V29/65 , F21K99/00 , F21V3/04 , H01K1/00 , F21V29/60 , F21V29/85 , F21Y101/02 , F21Y111/00 , F21V29/506 , F21V29/63 , F21V29/67
CPC分类号： F21V29/65 , F21K9/232 , F21V3/10 , F21V29/506 , F21V29/60 , F21V29/63 , F21V29/67 , F21V29/85 , F21Y2107/00 , F21Y2107/30 , F21Y2115/10 , H01K1/00 , Y10T29/49002
摘要： A gas cooled LED lamp and submount is disclosed. The centralized nature of the LEDs allows the LEDs to be configured near the central portion of the optical envelope of the lamp. In example embodiments, the LEDs can be cooled and/or cushioned by a gas in thermal communication with the LED array to enable the LEDs to maintain an appropriate operating temperature for efficient operation and long life. In some embodiments, the LED assembly is mounted on a glass stem. In some embodiments a thermal resistant path is created that prevents overtemperature of the LED array during the making of the lamp. In some embodiments the LED assembly comprises a lead frame and/or metal core board that is bent into a three-dimensional shape to create a desired light pattern in the enclosure or an extruded submount formed into a three-dimensional shape.
摘要翻译： 公开了一种气体冷却的LED灯和底座。 LED的集中性使得LED可以配置在灯的光学外壳的中心部分附近。 在示例性实施例中，可以通过与LED阵列热连通的气体来冷却和/或缓冲LED，以使得LED能够保持适当的操作温度以有效地操作和长寿命。 在一些实施例中，LED组件安装在玻璃杆上。 在一些实施例中，产生耐热路径，其防止在制造灯时LED阵列的过热。 在一些实施例中，LED组件包括引导框架和/或金属芯板，其被弯曲成三维形状以在外壳中产生期望的光图案或形成为三维形状的挤压式基座。
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公开(公告)号：US20130271987A1
公开(公告)日：2013-10-17
申请号：US13467670
申请日：2012-05-09
申请人： Christopher P. Hussell , John Adam Edmond , Gerald H. Negley , Curt Progl , Mark Edmond , Praneet Athalye
发明人： Christopher P. Hussell , John Adam Edmond , Gerald H. Negley , Curt Progl , Mark Edmond , Praneet Athalye
CPC分类号： F21V29/65 , F21K9/232 , F21V3/10 , F21V29/506 , F21V29/60 , F21V29/63 , F21V29/67 , F21V29/85 , F21Y2107/00 , F21Y2107/30 , F21Y2115/10 , H01K1/00 , Y10T29/49002
摘要： A gas cooled LED lamp and submount is disclosed. The centralized nature of the LEDs allows the LEDs to be configured near the central portion of the optical envelope of the lamp. In example embodiments, the LEDs can be cooled and/or cushioned by a gas in thermal communication with the LED array to enable the LEDs to maintain an appropriate operating temperature for efficient operation and long life. In some embodiments, the LED assembly is mounted on a glass stem. In some embodiments a thermal resistant path is created that prevents overtemperature of the LED array during the making of the lamp. In some embodiments the LED assembly comprises a lead frame and/or metal core board that is bent into a three-dimensional shape to create a desired light pattern in the enclosure or an extruded submount formed into a three-dimensional shape.
摘要翻译： 公开了一种气体冷却的LED灯和底座。 LED的集中性使得LED可以配置在灯的光学外壳的中心部分附近。 在示例性实施例中，可以通过与LED阵列热连通的气体来冷却和/或缓冲LED，以使得LED能够保持适当的操作温度以有效地操作和长寿命。 在一些实施例中，LED组件安装在玻璃杆上。 在一些实施例中，产生耐热路径，其防止在制造灯时LED阵列的过热。 在一些实施例中，LED组件包括引导框架和/或金属芯板，其被弯曲成三维形状以在外壳中产生期望的光图案或形成为三维形状的挤压式基座。
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公开(公告)号：US20110310587A1
公开(公告)日：2011-12-22
申请号：US13087510
申请日：2011-04-15
IPC分类号： F21V9/16
CPC分类号： G02B6/0003 , F21K9/232 , F21K9/60 , F21K9/61 , F21K9/64 , F21V29/70 , F21Y2115/10 , G02B5/02 , G02B6/001 , G02B6/0035 , G02B6/005 , G02B6/0073 , G02B6/0096
摘要： A semiconductor light emitting apparatus includes an elongated hollow wavelength conversion tube that co mprises an elongated wavelength conversion tube wall having wavelength conversion material such as phosphor dispersed therein uniformly or non-uniformly. The tube need not be cylindrical. A semiconductor light emitting device is oriented to emit light inside the elongated hollow wavelength conversion tube to impinge upon the elongated wavelength conversion tube wall and the wavelength conversion material dispersed therein.
摘要翻译： 半导体发光装置包括细长的中空波长转换管，其包含具有波长转换材料的细长波长转换管壁，例如均匀或不均匀地分散其中的荧光体。 管不需要是圆柱形的。 半导体发光器件被定向以在细长的中空波长转换管内发光，以照射到分散在其中的细长波长转换管壁和波长转换材料。
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