公开(公告)号：US08778211B2

公开(公告)日：2014-07-15

申请号：US13551423

申请日：2012-07-17

申请人： Matthias Stender ,  Glenn Whitener ,  Chul Woo Nam

发明人： Matthias Stender ,  Glenn Whitener ,  Chul Woo Nam

IPC分类号： C09K13/00 ,  C09K13/04 ,  C03C15/00 ,  C03C25/68 ,  H01L21/302 ,  H01L21/461

CPC分类号： C09K3/1463 ,  C09G1/02 ,  C09K3/1436

摘要： The present invention provides chemical-mechanical polishing (CMP) compositions suitable for polishing a substrate comprising a germanium-antimony-tellurium (GST) alloy. The CMP compositions of the present invention are aqueous slurries comprising a particulate abrasive, a water-soluble surface active agent, a complexing agent, and a corrosion inhibitor. The ionic character of the surface active material (e.g., cationic, anionic, or nonionic) is selected based on the zeta potential of the particulate abrasive. A CMP method for polishing a GST alloy-containing substrate utilizing the composition is also disclosed.

摘要翻译： 本发明提供了适用于抛光包含锗 - 锑 - 碲（GST）合金的基材的化学机械抛光（CMP）组合物。 本发明的CMP组合物是包含颗粒磨料，水溶性表面活性剂，络合剂和腐蚀抑制剂的水性浆料。 基于颗粒磨料的ζ电位来选择表面活性材料（例如阳离子，阴离子或非离子）的离子特性。 还公开了利用该组合物研磨含GST合金的基材的CMP方法。

公开(公告)号：US08623766B2

公开(公告)日：2014-01-07

申请号：US13237881

申请日：2011-09-20

申请人： Ji Cui ,  Steven Grumbine ,  Glenn Whitener ,  Chih-An Lin

发明人： Ji Cui ,  Steven Grumbine ,  Glenn Whitener ,  Chih-An Lin

IPC分类号： H01L21/302 ,  H01L21/461

CPC分类号： C09G1/02 ,  C09K3/1436 ,  C09K3/1463 ,  H01L21/3212

摘要： The invention provides a chemical-mechanical polishing composition comprising coated α-alumina particles, an organic carboxylic acid, and water. The invention also provides a chemical-mechanical polishing composition comprising an abrasive having a negative zeta potential in the polishing composition, an organic carboxylic acid, at least one alkyldiphenyloxide disulfonate surfactant, and water, wherein the polishing composition does not further comprise a heterocyclic compound. The abrasive is colloidally stable in the polishing composition. The invention further provides methods of polishing a substrate with the aforesaid polishing compositions.

摘要翻译： 本发明提供了包含涂覆的α-氧化铝颗粒，有机羧酸和水的化学机械抛光组合物。 本发明还提供了一种化学机械抛光组合物，其包括抛光组合物中具有负ζ电位的磨料，有机羧酸，至少一种烷基二苯醚二磺酸盐表面活性剂和水，其中抛光组合物不再含有杂环化合物。 研磨剂在抛光组合物中胶体稳定。 本发明还提供了用前述抛光组合物抛光衬底的方法。

公开(公告)号：US20130072021A1

公开(公告)日：2013-03-21

申请号：US13237881

申请日：2011-09-20

申请人： Ji Cui ,  Steven Grumbine ,  Glenn Whitener ,  Chih-An Lin

发明人： Ji Cui ,  Steven Grumbine ,  Glenn Whitener ,  Chih-An Lin

IPC分类号： H01L21/306 ,  C09K13/00

CPC分类号： C09G1/02 ,  C09K3/1436 ,  C09K3/1463 ,  H01L21/3212

摘要： The invention provides a chemical-mechanical polishing composition comprising coated α-alumina particles, an organic carboxylic acid, and water. The invention also provides a chemical-mechanical polishing composition comprising an abrasive having a negative zeta potential in the polishing composition, an organic carboxylic acid, at least one alkyldiphenyloxide disulfonate surfactant, and water, wherein the polishing composition does not further comprise a heterocyclic compound. The abrasive is colloidally stable in the polishing composition. The invention further provides methods of polishing a substrate with the aforesaid polishing compositions.

摘要翻译： 本发明提供了包含涂覆的α-氧化铝颗粒，有机羧酸和水的化学 - 机械抛光组合物。 本发明还提供了一种化学机械抛光组合物，其包括抛光组合物中具有负ζ电位的磨料，有机羧酸，至少一种烷基二苯醚二磺酸盐表面活性剂和水，其中抛光组合物不再含有杂环化合物。 研磨剂在抛光组合物中胶体稳定。 本发明还提供了用前述抛光组合物抛光衬底的方法。