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公开(公告)号：US20230098442A1
公开(公告)日：2023-03-30
申请号：US18074713
申请日：2022-12-05
Inventor： Rolf Bremensdorfer , Johannes Keppler , Michael X. Yang , Thorsten Hülsmann
IPC: H01L21/67 , H01L21/324 , H01L21/687
Abstract: Support plates for localized heating in thermal processing systems to uniformly heat workpieces are provided. In one example implementation, localized heating is achieved by modifying a heat transmittance of a support plate such that one or more portions of the support plate proximate the areas that cause cold spots transmit more heat than the rest of the support plate. For example, the one or more portions (e.g., arears proximate to one or more support pins) of the support plate have a higher heat transmittance (e.g., a higher optical transmission) than the rest of the support plate. In another example implementation, localized heating is achieved by heating a workpiece via a coherent light source through a transmissive support structure (e.g., one or more support pins, or a ring support) in addition to heating the workpiece globally by light from heat sources.
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公开(公告)号：US11521868B2
公开(公告)日：2022-12-06
申请号：US16356074
申请日：2019-03-18
Inventor： Rolf Bremensdorfer , Johannes Keppler , Michael X. Yang , Thorsten Hülsmann
IPC: H01L21/67 , H01L21/324 , H01L21/687
Abstract: Support plates for localized heating in thermal processing systems to uniformly heat workpieces are provided. In one example implementation, localized heating is achieved by modifying a heat transmittance of a support plate such that one or more portions of the support plate proximate the areas that cause cold spots transmit more heat than the rest of the support plate. For example, the one or more portions (e.g., areas proximate to one or more support pins) of the support plate have a higher heat transmittance (e.g., a higher optical transmission) than the rest of the support plate. In another example implementation, localized heating is achieved by heating a workpiece via a coherent light source through a transmissive support structure (e.g., one or more support pins, or a ring support) in addition to heating the workpiece globally by light from heat sources.
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公开(公告)号：US11193178B2
公开(公告)日：2021-12-07
申请号：US16059148
申请日：2018-08-09
Inventor： Rolf Bremensdorfer , Johannes Keppler , Michael Yang
Abstract: Systems and methods for heat treating closed shape workpieces are provided. In one example implementation, a method can include imparting relative motion of the closed shape workpiece such that the perimeter surface of the closed shape workpiece is moved relative to the lamp heat source from a first position where a first portion of the closed shape workpiece is presented to the lamp heat source to a second position where a second portion of the closed shape workpiece is presented to the lamp heat source. The method can include emitting lamp heat onto the perimeter surface of the closed shape workpiece from the lamp heat source during imparting of relative motion of the closed shape workpiece. The method can include implementing a flux control procedure during emitting of lamp heat onto the perimeter surface of the closed shape workpiece.
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Patent Agency Ranking
公开(公告)号：US20190295869A1
公开(公告)日：2019-09-26
申请号：US16356074
申请日：2019-03-18
Applicant: Mattson Technology, Inc.
Inventor： Rolf Bremensdorfer , Johannes Keppler , Michael X. Yang , Thorsten Hülsmann
IPC: H01L21/67 , H01L21/687 , H01L21/324
Abstract: Support plates for localized heating in thermal processing systems to uniformly heat workpieces are provided. In one example implementation, localized heating is achieved by modifying a heat transmittance of a support plate such that one or more portions of the support plate proximate the areas that cause cold spots transmit more heat than the rest of the support plate. For example, the one or more portions (e.g., arears proximate to one or more support pins) of the support plate have a higher heat transmittance (e.g., a higher optical transmission) than the rest of the support plate. In another example implementation, localized heating is achieved by heating a workpiece via a coherent light source through a transmissive support structure (e.g., one or more support pins, or a ring support) in addition to heating the workpiece globally by light from heat sources.
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公开(公告)号：US20240387205A1
公开(公告)日：2024-11-21
申请号：US18787295
申请日：2024-07-29
Inventor： Rolf Bremensdorfer , Johannes Keppler , Michael X. Yang , Thorsten Hülsmann
IPC: H01L21/67 , H01L21/324 , H01L21/687
Abstract: Support plates for localized heating in thermal processing systems to uniformly heat workpieces are provided. In one example implementation, localized heating is achieved by modifying a heat transmittance of a support plate such that one or more portions of the support plate proximate the areas that cause cold spots transmit more heat than the rest of the support plate. For example, the one or more portions (e.g., areas proximate to one or more support pins) of the support plate have a higher heat transmittance (e.g., a higher optical transmission) than the rest of the support plate. In another example implementation, localized heating is achieved by heating a workpiece via a coherent light source through a transmissive support structure (e.g., one or more support pins, or a ring support) in addition to heating the workpiece globally by light from heat sources.
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公开(公告)号：US12080568B2
公开(公告)日：2024-09-03
申请号：US18074713
申请日：2022-12-05
Inventor： Rolf Bremensdorfer , Johannes Keppler , Michael X. Yang , Thorsten Hülsmann
IPC: H01L21/67 , H01L21/324 , H01L21/687
CPC classification number: H01L21/67115 , H01L21/324 , H01L21/68742 , H01L21/6875 , H01L21/68757
Abstract: Support plates for localized heating in thermal processing systems to uniformly heat workpieces are provided. In one example implementation, localized heating is achieved by modifying a heat transmittance of a support plate such that one or more portions of the support plate proximate the areas that cause cold spots transmit more heat than the rest of the support plate. For example, the one or more portions (e.g., areas proximate to one or more support pins) of the support plate have a higher heat transmittance (e.g., a higher optical transmission) than the rest of the support plate. In another example implementation, localized heating is achieved by heating a workpiece via a coherent light source through a transmissive support structure (e.g., one or more support pins, or a ring support) in addition to heating the workpiece globally by light from heat sources.
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公开(公告)号：US20220090221A1
公开(公告)日：2022-03-24
申请号：US17541425
申请日：2021-12-03
Inventor： Rolf Bremensdorfer , Johannes Keppler , Michael Yang
Abstract: Systems and methods for heat treating closed shape workpieces are provided. In one example implementation, a method can include imparting relative motion of the closed shape workpiece such that the perimeter surface of the closed shape workpiece is moved relative to the lamp heat source from a first position where a first portion of the closed shape workpiece is presented to the lamp heat source to a second position where a second portion of the closed shape workpiece is presented to the lamp heat source. The method can include emitting lamp heat onto the perimeter surface of the closed shape workpiece from the lamp heat source during imparting of relative motion of the closed shape workpiece. The method can include implementing a flux control procedure during emitting of lamp heat onto the perimeter surface of the closed shape workpiece.
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公开(公告)号：US20190127818A1
公开(公告)日：2019-05-02
申请号：US16059148
申请日：2018-08-09
Applicant: Mattson Technology, Inc.
Inventor： Rolf Bremensdorfer , Johannes Keppler , Michael Yang
Abstract: Systems and methods for heat treating closed shape workpieces are provided. In one example implementation, a method can include imparting relative motion of the closed shape workpiece such that the perimeter surface of the closed shape workpiece is moved relative to the lamp heat source from a first position where a first portion of the closed shape workpiece is presented to the lamp heat source to a second position where a second portion of the closed shape workpiece is presented to the lamp heat source. The method can include emitting lamp heat onto the perimeter surface of the closed shape workpiece from the lamp heat source during imparting of relative motion of the closed shape workpiece. The method can include implementing a flux control procedure during emitting of lamp heat onto the perimeter surface of the closed shape workpiece.
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