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公开(公告)号：US12119216B2
公开(公告)日：2024-10-15
申请号：US18336552
申请日：2023-06-16
Inventor： Michael X. Yang , Rolf Bremensdorfer , Dave Camm , Joseph Cibere , Dieter Hezler , Shawming Ma , Yun Yang
IPC: H01J61/073 , H01J61/28 , H01J61/52 , H01J61/86 , H05H1/48
CPC classification number: H01J61/86 , H01J61/0732 , H01J61/28 , H01J61/526 , H05H1/48
Abstract: Apparatus, systems, and methods for processing workpieces are provided. An arc lamp can include a tube. The arc lamp can include one or more inlets configured to receive water to be circulated through the arc lamp during operation as a water wall, the water wall configured to cool the arc lamp. The arc lamp can include a plurality of electrodes configured to generate a plasma in a forming gas introduced into the arc lamp via the one or more inlets. The forming gas can be or can include a mixture of a hydrogen gas and an inert gas, the hydrogen gas in the mixture having a concentration less than 4% by volume. The hydrogen gas can be introduced into the arc lamp prior to generating the plasma. The arc lamp may be used for processing workpieces.
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公开(公告)号：US11812523B2
公开(公告)日：2023-11-07
申请号：US16898495
申请日：2020-06-11
Inventor： Michael X. Yang , Rolf Bremensdorfer
CPC classification number: H05B3/0047 , G02F1/163 , H05B1/0233
Abstract: Apparatus, systems, and methods for processing workpieces are provided. In one example, the system includes a processing chamber. The system includes a workpiece support configured to support a workpiece within the processing chamber. The system includes a heat source configured to emit light toward the workpiece. The system includes a shutter disposed between the workpiece and the heat source. The shutter includes an electrochromic material configurable in a translucent state and an opaque state. When the electrochromic material is configured in the opaque state, the shutter reduces transmission of the light through the shutter, and when the electrochromic material is configured in the translucent state, the light at least partially passes through the shutter. The system includes a controller configured to control the shutter to reduce transmission of light through the shutter during a thermal treatment process.
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公开(公告)号：US20230352294A1
公开(公告)日：2023-11-02
申请号：US18336552
申请日：2023-06-16
Inventor： Michael X. Yang , Rolf Bremensdorfer , Dave Camm , Joseph Cibere , Dieter Hezler , Shawming Ma , Yun Yang
IPC: H01J61/86 , H01J61/073 , H05H1/48 , H01J61/52 , H01J61/28
CPC classification number: H01J61/86 , H01J61/0732 , H05H1/48 , H01J61/526 , H01J61/28
Abstract: Apparatus, systems, and methods for processing workpieces are provided. An arc lamp can include a tube. The arc lamp can include one or more inlets configured to receive water to be circulated through the arc lamp during operation as a water wall, the water wall configured to cool the arc lamp. The arc lamp can include a plurality of electrodes configured to generate a plasma in a forming gas introduced into the arc lamp via the one or more inlets. The forming gas can be or can include a mixture of a hydrogen gas and an inert gas, the hydrogen gas in the mixture having a concentration less than 4% by volume. The hydrogen gas can be introduced into the arc lamp prior to generating the plasma. The arc lamp may be used for processing workpieces.
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公开(公告)号：US20220187021A1
公开(公告)日：2022-06-16
申请号：US17546497
申请日：2021-12-09
Inventor： Manuel Sohn , Alex Wansidler , Dieter Hezler , Joseph Cibere , Rolf Bremensdorfer , Martin Zucker , Pete Lembesis , Michael Yang
Abstract: A processing apparatus for a thermal treatment of a workpiece is presented. The processing apparatus includes a processing chamber, a workpiece support disposed within the processing chamber, a rotation system configured to rotate the workpiece support, a gas delivery system configured to flow one or more process gases into the processing chamber from the a first side of the processing chamber, one or more gas exhaust ports for removing gas from the processing chamber such that a vacuum pressure can be maintained, one or more radiative heating sources disposed on the second side of the processing chamber, one or more dielectric windows disposed between the workpiece support and the one or more radiative heating sources, and a workpiece temperature measurement system configured at a temperature measurement wavelength range to obtain a measurement indicative of a temperature of a back side of the workpiece.
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公开(公告)号：US20220059363A1
公开(公告)日：2022-02-24
申请号：US17405142
申请日：2021-08-18
Inventor： Manuel Sohn , Rolf Bremensdorfer , Dieter Hezler
IPC: H01L21/324 , H01L21/66 , H01L21/67
Abstract: Apparatus, systems, and methods for processing workpieces are provided. In one example, such a method for performing a spike anneal rapid thermal process may include controlling a heat source to begin heating a workpiece supported on a workpiece support in a processing chamber. The method may further include receiving data indicative of a temperature of the workpiece. Furthermore, the method may include monitoring the temperature of the workpiece relative to a temperature setpoint. Moreover, the method may include controlling the heat source to stop heating the workpiece based at least in part on the workpiece reaching the temperature setpoint. Additionally, the method may include controlling a cooling system to begin flowing a cooling gas at a rate of about 300 slm or greater over the workpiece based at least in part on the workpiece reaching the temperature setpoint to reduce a t50 peak width of the workpiece.
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Patent Agency Ranking
公开(公告)号：US20170194133A1
公开(公告)日：2017-07-06
申请号：US15380221
申请日：2016-12-15
Applicant: Mattson Technology, Inc.
Inventor： Markus Lieberer , Christian Seifert , Rolf Bremensdorfer
IPC: H01J61/073 , H01L21/268 , H05H1/48 , H05B3/00 , H05B3/03 , H01L21/67 , H01J61/52
CPC classification number: H01J61/0732 , H01J61/28 , H01J61/526 , H01L21/268 , H01L21/67115 , H01L21/6719 , H05B3/0047 , H05B3/03 , H05H1/48 , H05H2001/488
Abstract: Electrode tips for arc lamps for use in, for instance, a millisecond anneal system are provided. In one example implementation, an electrode for an arc lamp can have an electrode tip. The surface of the electrode tip can have one or more grooves to reduce the transportation of molten material across the surface of the electrode tip. The electrode can include an interface between the electrode tip and a heat sink. The interface can have a shape designed to have a desired lateral temperature distribution across the surface of the electrode tip.
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公开(公告)号：US20240379390A1
公开(公告)日：2024-11-14
申请号：US18779944
申请日：2024-07-22
Inventor： Manuel Sohn , Rolf Bremensdorfer , Silke Hamm , Dieter Hezler
IPC: H01L21/67
Abstract: Apparatus, systems, and methods for processing workpieces are provided. In one example, such a method for performing a spike anneal rapid thermal process may include controlling a heat source to begin heating a workpiece supported on a workpiece support in a processing chamber. The method may further include receiving data indicative of a temperature of the workpiece. Furthermore, the method may include monitoring the temperature of the workpiece relative to a temperature setpoint. Moreover, the method may include controlling the heat source to stop heating the workpiece based at least in part on the workpiece reaching the temperature setpoint. Additionally, the method may include controlling a cooling system to begin flowing a cooling gas at a rate of about 300 slm or greater over the workpiece based at least in part on the workpiece reaching the temperature setpoint to reduce a t50 peak width of the workpiece.
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公开(公告)号：US12046489B2
公开(公告)日：2024-07-23
申请号：US17550154
申请日：2021-12-14
Inventor： Rolf Bremensdorfer , Dieter Hezler
CPC classification number: H01L21/67115 , F27B17/0025 , F27D7/02 , G01J5/10 , G01J5/58 , H01L21/67248 , H05B1/0233 , H05B3/0047 , G01J5/0007
Abstract: A processing apparatus for a thermal treatment of a workpiece is presented. The processing apparatus includes a processing chamber, a workpiece support disposed within the processing chamber, a gas delivery system configured to flow one or more process gases into the processing chamber from the a first side of the processing chamber, one or more radiative heating sources disposed on the second side of the processing chamber, one or more dielectric windows disposed between the workpiece support and the one or more radiative heating sources, a rotation system configured to rotate the one or more radiative heating sources, and a workpiece temperature measurement system configured at a temperature measurement wavelength range to obtain a measurement indicative of a temperature of a back side of the workpiece.
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公开(公告)号：US20220208572A1
公开(公告)日：2022-06-30
申请号：US17550154
申请日：2021-12-14
Inventor： Rolf Bremensdorfer
Abstract: A processing apparatus for a thermal treatment of a workpiece is presented. The processing apparatus includes a processing chamber, a workpiece support disposed within the processing chamber, a gas delivery system configured to flow one or more process gases into the processing chamber from the a first side of the processing chamber, one or more radiative heating sources disposed on the second side of the processing chamber, one or more dielectric windows disposed between the workpiece support and the one or more radiative heating sources, a rotation system configured to rotate the one or more radiative heating sources, and a workpiece temperature measurement system configured at a temperature measurement wavelength range to obtain a measurement indicative of a temperature of a back side of the workpiece.
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公开(公告)号：US20220059371A1
公开(公告)日：2022-02-24
申请号：US17405150
申请日：2021-08-18
Inventor： Manuel Sohn , Rolf Bremensdorfer , Silke Hamm , Dieter Hezler
IPC: H01L21/67
Abstract: Apparatus, systems, and methods for processing workpieces are provided. In one example, such a method for performing a spike anneal rapid thermal process may include controlling a heat source to begin heating a workpiece supported on a workpiece support in a processing chamber. The method may further include receiving data indicative of a temperature of the workpiece. Furthermore, the method may include monitoring the temperature of the workpiece relative to a temperature setpoint. Moreover, the method may include controlling the heat source to stop heating the workpiece based at least in part on the workpiece reaching the temperature setpoint. Additionally, the method may include controlling a cooling system to begin flowing a cooling gas at a rate of about 300 slm or greater over the workpiece based at least in part on the workpiece reaching the temperature setpoint to reduce a t50 peak width of the workpiece.
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