公开(公告)号：US20170248849A1

公开(公告)日：2017-08-31

申请号：US15441332

申请日：2017-02-24

Applicant: Mattson Technology, Inc.

Inventor： Wei-Hua Liou ,  Chun-Yen Kang ,  Vijay M. Vaniapura ,  Hai-Au M. Phan-Vu ,  Shawming Ma

IPC: G03F7/42 ,  H01L21/306 ,  H01L21/66 ,  H01L21/3065

CPC classification number: G03F7/42 ,  G03F7/423 ,  G03F7/427 ,  H01J2237/3342 ,  H01L21/31133 ,  H01L21/31138 ,  H01L22/24

Abstract: Processes for removing a photoresist from a substrate after, for instance, ion implantation are provided. In one example implementation, a process can include placing a substrate having a bulk photoresist and a crust formed on the bulk photoresist in a processing chamber. The process can include initiating a first strip process in the processing chamber. The process can include accessing an optical emission signal associated with a plasma during the first strip process. The process can include identifying an endpoint for the first strip process based at least in part on the optical emission signal. The process can include terminating the first strip process based at least in part on the endpoint. The process can include initiating a second strip process to remove the photoresist from the substrate.

公开(公告)号：US10078266B2

公开(公告)日：2018-09-18

申请号：US15441332

申请日：2017-02-24

Applicant: Mattson Technology, Inc.

Inventor： Wei-Hua Liou ,  Chun-Yen Kang ,  Vijay M. Vaniapura ,  Hai-Au M. Phan-Vu ,  Shawming Ma

IPC: G03F7/42 ,  H01L21/66 ,  H01L21/311

CPC classification number: G03F7/42 ,  G03F7/423 ,  G03F7/427 ,  H01J2237/3342 ,  H01L21/31133 ,  H01L21/31138 ,  H01L22/24

Abstract: Processes for removing a photoresist from a substrate after, for instance, ion implantation are provided. In one example implementation, a process can include placing a substrate having a bulk photoresist and a crust formed on the bulk photoresist in a processing chamber. The process can include initiating a first strip process in the processing chamber. The process can include accessing an optical emission signal associated with a plasma during the first strip process. The process can include identifying an endpoint for the first strip process based at least in part on the optical emission signal. The process can include terminating the first strip process based at least in part on the endpoint. The process can include initiating a second strip process to remove the photoresist from the substrate.