公开(公告)号：US11999014B2

公开(公告)日：2024-06-04

申请号：US17086946

申请日：2020-11-02

Applicant: Medtronic, Inc.

Inventor： Xiangnan He ,  David A. Ruben ,  Mark E. Henschel ,  Chunho Kim ,  Yongqian Wang ,  Rodney D. Toles

IPC: B23K26/38 ,  B23K26/06 ,  B23K26/082 ,  B23K26/362 ,  B23K26/70 ,  B23K101/38

CPC classification number: B23K26/38 ,  B23K26/0643 ,  B23K26/082 ,  B23K26/362 ,  B23K26/705 ,  B23K2101/38 ,  H05K2203/0207

Abstract: A system may include an emitting device and a controller. The emitting device may be adapted to emit a first laser beam and a second laser beam. The controller may include one or more processors and may be operably coupled to the emitting device to control emission of the first and second laser beams. The controller may be adapted to remove a portion of a workpiece to form an exposed surface of the workpiece with the first laser beam using the emitting device and to remove a portion of the exposed surface with the second laser beam using the emitting device.

公开(公告)号：US10201094B2

公开(公告)日：2019-02-05

申请号：US14561248

申请日：2014-12-05

Applicant: Medtronic, Inc.

Inventor： Chunho Kim ,  Songhua Shi ,  Mark S. Ricotta ,  Scott B. Sleeper ,  Yongqian Wang

IPC: H05K3/28 ,  B29C45/14

Abstract: During a process to encapsulate electronic components and attachment interfaces thereof on a first side of a substrate of a hybrid assembly, a fluid is supplied to a trench of an encapsulation system in which the hybrid assembly is loaded, and a balancing pressure is delivered by the fluid within the trench, during the encapsulation process, to support the hybrid assembly from an opposing second side of the substrate. A regulator of a fluid supply of the system may maintain the balancing pressure, for example, being controlled by a controller of the system that is configured to estimate a pressure within a molding cavity of the system.

公开(公告)号：US20210154772A1

公开(公告)日：2021-05-27

申请号：US17086946

申请日：2020-11-02

Applicant: Medtronic, Inc.

Inventor： Xiangnan He ,  David A. Ruben ,  Mark E. Henschel ,  Chunho Kim ,  Yongqian Wang ,  Rodney D. Toles

IPC: B23K26/38 ,  B23K26/06 ,  B23K26/082 ,  B23K26/70 ,  B23K26/362

Abstract: A system may include an emitting device and a controller. The emitting device may be adapted to emit a first laser beam and a second laser beam. The controller may include one or more processors and may be operably coupled to the emitting device to control emission of the first and second laser beams. The controller may be adapted to remove a portion of a workpiece to form an exposed surface of the workpiece with the first laser beam using the emitting device and to remove a portion of the exposed surface with the second laser beam using the emitting device.