摘要:
Lighting systems having unique configurations are provided. For instance, the lighting system may include a light source, a thermal management system and driver electronics, each contained within a housing structure. The light source is configured to provide illumination visible through an opening in the housing structure. The thermal management system includes a plurality of synthetic jets. The synthetic jets are arranged within the lighting system such that they are secured at contact points.
摘要:
Lighting systems having a light source and a thermal management system are provided. The thermal management system includes synthetic jet devices, a heat sink and a heat distribution face plate. The synthetic jet devices are arranged in parallel to one and other and are configured to actively cool the lighting system. The heat distribution face plate is configured to radially transfer heat from the light source into the ambient air.
摘要:
An apparatus for removing heat comprises a heat sink having a cavity, and a synthetic jet stack comprising at least one synthetic jet mounted within the cavity. At least one rod and at least one engaging structure to provide a rigid positioning of the at least one synthetic jet with respect to the at least one rod. The synthetic jet comprises at least one orifice through which a fluid is ejected.
摘要:
Apparatus and method are provided for reducing acoustical noise when cooling a device, such as a lamp system. The apparatus includes at least a set of a first synthetic jet and a second synthetic jet. The first and second synthetic jets are responsive to respective actuating signals having a phase difference (e.g., 180°) between one another chosen to reduce acoustic noise produced by the first and second synthetic jets when cooling the device.
摘要:
A system for heat transfer along with the method of preparation of the same is described. System includes a first surface, a second surface, and an interface material. The interface material is disposed between the first and second surfaces such that it is solid at an assembling temperature and liquid at an operating temperature. The first surface of the system is configured to adhere to the solid and liquid thermal interface material, and the second surface is configured to adhere to the liquid thermal interface material and be detachable from the solid interface material. The method of preparation of the system includes disposing the first surface, an interface material, and a second surface, heating the interface material to above its melting point and then cooling to a temperature below melting point to detach and remove the second surface from the interface material.