SYSTEM INCLUDING THERMAL INTERFACE MATERIAL
    5.
    发明申请
    SYSTEM INCLUDING THERMAL INTERFACE MATERIAL 审中-公开
    包括热界面材料的系统

    公开(公告)号:US20130224510A1

    公开(公告)日:2013-08-29

    申请号:US13408305

    申请日:2012-02-29

    IPC分类号: B32B15/01 B29C65/48

    摘要: A system for heat transfer along with the method of preparation of the same is described. System includes a first surface, a second surface, and an interface material. The interface material is disposed between the first and second surfaces such that it is solid at an assembling temperature and liquid at an operating temperature. The first surface of the system is configured to adhere to the solid and liquid thermal interface material, and the second surface is configured to adhere to the liquid thermal interface material and be detachable from the solid interface material. The method of preparation of the system includes disposing the first surface, an interface material, and a second surface, heating the interface material to above its melting point and then cooling to a temperature below melting point to detach and remove the second surface from the interface material.

    摘要翻译: 描述了一种用于传热的系统及其制备方法。 系统包括第一表面,第二表面和界面材料。 界面材料设置在第一和第二表面之间,使得其在组装温度下为固体,并且在工作温度下为液体。 系统的第一表面被配置为粘附到固体和液体热界面材料,并且第二表面被配置为粘附到液体热界面材料并且可从固体界面材料上分离。 制备该系统的方法包括设置第一表面,界面材料和第二表面,将界面材料加热到其熔点之上,然后冷却到低于熔点的温度以从界面分离和去除第二表面 材料。