公开(公告)号：US20110195568A1

公开(公告)日：2011-08-11

申请号：US13088954

申请日：2011-04-18

申请人： Meng-Jen WANG ,  Chien-Yu Chen

发明人： Meng-Jen WANG ,  Chien-Yu Chen

IPC分类号： H01L21/768 ,  H01L21/60

CPC分类号： H01L21/76898 ,  H01L21/486 ,  H01L23/147 ,  H01L23/49827 ,  H01L24/16 ,  H01L2224/16225 ,  H01L2924/15311

摘要： A semiconductor structure, a method for manufacturing a semiconductor structure and a semiconductor package are provided. The method for manufacturing a semiconductor structure includes the following steps. Firstly, a silicon substrate is provided. Next, a part of the silicon substrate is removed to form a ring hole and a silicon pillar surrounded by the silicon pillar. Then, a photosensitive material is disposed in the ring hole, wherein the photosensitive material is insulating. After that, the silicon pillar is removed, such that the ring hole forms a through hole and the photosensitive material covers a lateral wall of the through hole. Lastly, the conductive material is disposed in the through hole, wherein the outer surface of the conductive material is surrounded by the photosensitive material.

摘要翻译： 提供半导体结构，半导体结构的制造方法以及半导体封装。 制造半导体结构的方法包括以下步骤。 首先，提供硅基板。 接下来，去除硅衬底的一部分以形成由硅柱包围的环形孔和硅柱。 然后，感光材料设置在环形孔中，其中感光材料是绝缘的。 之后，去除硅柱，使得环孔形成通孔，并且感光材料覆盖通孔的侧壁。 最后，导电材料设置在通孔中，其中导电材料的外表面被感光材料包围。

公开(公告)号：US20090140413A1

公开(公告)日：2009-06-04

申请号：US12137979

申请日：2008-06-12

申请人： Meng-Jen WANG ,  Kuo-Pin Yang ,  Sheng-Yang Peng ,  Wei-Min Hsiao

发明人： Meng-Jen WANG ,  Kuo-Pin Yang ,  Sheng-Yang Peng ,  Wei-Min Hsiao

IPC分类号： H01L23/48 ,  H01L21/60

CPC分类号： B81C1/00269 ,  B81B2201/0257 ,  B81C2203/0118 ,  H01L24/48 ,  H01L24/81 ,  H01L24/85 ,  H01L24/97 ,  H01L2224/16225 ,  H01L2224/48091 ,  H01L2224/73204 ,  H01L2224/81801 ,  H01L2224/85 ,  H01L2224/97 ,  H01L2924/00014 ,  H01L2924/01033 ,  H01L2924/01082 ,  H01L2924/1461 ,  H01L2924/16151 ,  H01L2924/16195 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H01L2224/81 ,  H01L2924/00 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2224/45099

摘要： A semiconductor package structure and the applications thereof and the manufacturing method are disclosed. The semiconductor package structure includes a carrier, a semiconductor device, a first package body, a lid and a second package body. The semiconductor device is electrically connected to the carrier via a first conductive element. The first package body is molded on the carrier to surround the semiconductor device. The lid is disposed on top of the first package body and has at least one protrusion. The second package body is molded on the carrier to encapsulate the protrusion, whereby the protrusion is embedded within the second package body thereby locking the lid in place against the first package body.

摘要翻译： 公开了半导体封装结构及其应用和制造方法。 半导体封装结构包括载体，半导体器件，第一封装体，盖子和第二封装体。 半导体器件经由第一导电元件电连接到载体。 第一封装体模制在载体上以围绕半导体器件。 盖子设置在第一包装体的顶部上并且具有至少一个突出部。 第二包装体被模制在载体上以封装突起，由此突起嵌入第二包装体内，从而将盖锁定在第一包装体上。