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公开(公告)号:US20240251499A1
公开(公告)日:2024-07-25
申请号:US18158085
申请日:2023-01-23
Applicant: Meta Platforms Technologies, LLC
Inventor: Qiuming Li , Colden Niles Eldridge , Ming Lei , Yibo Liu , Md Rashidul Islam , Sung Hoon Oh
IPC: H05K1/02
CPC classification number: H05K1/0215 , H05K1/0237 , H05K1/0271 , H05K2201/10098 , H05K2201/10401 , H05K2201/10409
Abstract: A circuit package may comprise (1) a substrate, (2) at least one radio frequency (RF) circuit disposed on the substrate, and (3) a plurality of screw holes that are incorporated into the substrate and configured to support mounting the substrate to an enclosure, wherein at least one of the screw holes is further configured to provide at least one supplemental function in connection with the RF circuit. Various other apparatuses, systems, and methods are also disclosed.
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公开(公告)号:US20250096822A1
公开(公告)日:2025-03-20
申请号:US18630692
申请日:2024-04-09
Applicant: Meta Platforms Technologies, LLC
Inventor: Qiuming Li , Hongyu Zhou , Bo Zhang
Abstract: Disclosed herein are systems and method for using a cellular communication chain integrated with RFID wireless communication to communicate with an external RFID tag and a cellular wireless base station. A front end circuit can receive a first RF signal as input and can provide, as output, a processed first RF signal for wireless communication via a cellular network and be a low-band signal. An RFID circuit can generate a second RF signal for wireless communication with an RF identifier tag. A switch circuit or one or more toggle switches can be configured to route the processed first RF signal for transmission via an antenna for the wireless communication via the cellular network and route the second RF signal for transmission via the antenna for the wireless communication with the RF identifier tag.
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公开(公告)号:US11729897B1
公开(公告)日:2023-08-15
申请号:US17850721
申请日:2022-06-27
Applicant: Meta Platforms Technologies, LLC
Inventor: Qiuming Li , Ming Lei , Colden Niles Eldridge , Yeonsoo Ko
CPC classification number: H05K1/0216 , H05K9/0032 , H05K2201/0715 , H05K2201/10371
Abstract: The disclosed hybrid shielding structure may include a printed circuit board (PCB) that is to be overmolded with at least a portion of molding compound. The PCB may include various electronic components disposed thereon. The hybrid shielding structure may also include conductive trenches and conductive fences that are disposed on the PCB. The conductive trenches and the conductive fences may provide an electromagnetic shield for at least a portion of the electronic components of the PCB. The hybrid shielding structure may further include a conformal shielding and a PCB ground flood and ground layers. Various other systems, electronic devices, apparatuses, and methods of manufacturing are also disclosed.
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公开(公告)号:US12213241B2
公开(公告)日:2025-01-28
申请号:US18158085
申请日:2023-01-23
Applicant: Meta Platforms Technologies, LLC
Inventor: Qiuming Li , Colden Niles Eldridge , Ming Lei , Yibo Liu , Md Rashidul Islam , Sung Hoon Oh
IPC: H05K1/02
Abstract: A circuit package may comprise (1) a substrate, (2) at least one radio frequency (RF) circuit disposed on the substrate, and (3) a plurality of screw holes that are incorporated into the substrate and configured to support mounting the substrate to an enclosure, wherein at least one of the screw holes is further configured to provide at least one supplemental function in connection with the RF circuit. Various other apparatuses, systems, and methods are also disclosed.
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公开(公告)号:US20240097350A1
公开(公告)日:2024-03-21
申请号:US17866094
申请日:2022-07-15
Applicant: Meta Platforms Technologies, LLC
Inventor: Qiuming Li , Abhishek Kumar Agrawal , Xiangyu Kong
Abstract: Disclosed herein are related to systems and methods for wireless communication. In one aspect, a system includes a first wireless interface configured to communicate at a first frequency band and a second frequency band. In one aspect, the system includes a second wireless interface configured to communicate at a third frequency band and a fourth frequency band. In one aspect, the system includes a switch configured to select either communication at the second frequency band or the third frequency band. In one aspect, the system includes a multi-band filter configured to couple i) the first wireless interface, ii) the second wireless interface, and iii) the switch, to a single antenna.
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