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公开(公告)号：US20240184250A1
公开(公告)日：2024-06-06
申请号：US18061847
申请日：2022-12-05
发明人： Md Rashidul Islam , Zhong Ji , Yonghua Wei , Geng Ye , Bruno Cendon Martin
摘要： The disclosed system may include a cradle configured to receive and secure a detachable capsule. The system may further include a printed circuit board mounted within a housing of the cradle. The system may also include a radiating structure positioned on an inner surface of the housing of the cradle. In such cases, the radiating structure may be electrically connected to the PCB of the cradle. Various other mobile electronic devices, apparatuses, and methods of manufacturing are also disclosed.
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公开(公告)号：US20240113420A1
公开(公告)日：2024-04-04
申请号：US17936394
申请日：2022-09-29
发明人： Wenjing Su , Md Rashidul Islam , Juan Manuel Martinez , Jiang Zhu , Huan Liao , Yonghua Wei , Geng Ye , Bruno Cendon Martin
CPC分类号： H01Q1/273 , G01R27/2605 , G04G21/04 , H01Q7/005
摘要： The disclosed system may include a detachable capsule that includes a capsule-side capacitive plate. The system may also include a receiving antenna electrically connected to an antenna-side capacitive plate, and a capacitive sensor electrically connected to the capsule-side capacitive plate. The two plates may be coupled to each other and may transmit RF signals between them. The capacitive sensor may be configured to detect an amount of capacitance between the two capacitive plates. The system may also include an antenna matching tuner electrically connected to the capacitive sensor and to an antenna feed. Then, upon receiving capacitance measurements from the capacitive sensor, the antenna matching tuner may alter various parameters of the antenna feed including impedance matching parameters. Various other apparatuses and mobile wearable devices are also disclosed.
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3.发明公开公开(公告)号：US20240251499A1
公开(公告)日：2024-07-25
申请号：US18158085
申请日：2023-01-23
发明人： Qiuming Li , Colden Niles Eldridge , Ming Lei , Yibo Liu , Md Rashidul Islam , Sung Hoon Oh
IPC分类号： H05K1/02
CPC分类号： H05K1/0215 , H05K1/0237 , H05K1/0271 , H05K2201/10098 , H05K2201/10401 , H05K2201/10409
摘要： A circuit package may comprise (1) a substrate, (2) at least one radio frequency (RF) circuit disposed on the substrate, and (3) a plurality of screw holes that are incorporated into the substrate and configured to support mounting the substrate to an enclosure, wherein at least one of the screw holes is further configured to provide at least one supplemental function in connection with the RF circuit. Various other apparatuses, systems, and methods are also disclosed.
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公开(公告)号：US11764471B1
公开(公告)日：2023-09-19
申请号：US17834612
申请日：2022-06-07
发明人： Zhong Ji , Ulf Jan-Ove Mattsson , Yonghua Wei , Md Rashidul Islam , Geng Ye , Bruno Cendon Martin
摘要： The disclosed system may include a housing that includes a non-conducting substrate and a conductive enclosure that at least partially surrounds the non-conducting substrate. The system may also include an antenna disposed on the non-conducting substrate of the housing. Still further, the system may include a direct electrical connection between the antenna and a first portion of the conductive enclosure. Moreover, the system may include an antenna feed electrically connected to a separate conductive portion on the non-conducting substrate. The separate portion of the non-conducting substrate may be electrically connected to a second portion of the conductive enclosure. Various other apparatuses, wearable electronic devices, and methods of manufacturing are also disclosed.
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公开(公告)号：US20240266731A1
公开(公告)日：2024-08-08
申请号：US18636892
申请日：2024-04-16
发明人： Sung Hoon Oh , Yonghua Wei , Md Rashidul Islam , Qian Qiao , Ulf Jan-Ove Mattsson , Geng Ye , Bruno Cendon Martin
摘要： The disclosed system may include an enclosure that is configured to house internal electrical components disposed on a printed circuit board (PCB). The system may also include a first antenna feed that is electrically connected to the PCB, to the enclosure, and to a radiating coupling arm configured for wireless communication in a first wireless communication band. The system may further include a second antenna feed that is electrically connected to the PCB and to an antenna configured for wireless communication in a second, different wireless communication band. The system may also include a first grounding leg that forms an electrical ground between the PCB and the enclosure, and a second, switchable grounding leg positioned away from the first grounding leg. This switchable grounding leg may provide a controllable electrical ground between the PCB and the enclosure. Various other methods and apparatuses are also disclosed.
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公开(公告)号：US20240113430A1
公开(公告)日：2024-04-04
申请号：US18053292
申请日：2022-11-07
发明人： Zhong Ji , Yonghua Wei , Md Rashidul Islam , Huan Liao , Geng Ye , Bruno Cendon Martin
摘要： The disclosed system may include a conductive enclosure, a first printed circuit board (PCB) that includes multiple antenna feeds, and a second PCB that includes a grounding layer and one or more sensors. A first antenna feed may be electrically connected to the conductive enclosure, and a second antenna feed may be electrically connected to the grounding layer of the second PCB. As such, the grounding layer of the second PCB may act as a radiating element for a second antenna. Various other mobile electronic devices, apparatuses, and methods of manufacturing are also disclosed.
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公开(公告)号：US11990689B2
公开(公告)日：2024-05-21
申请号：US17550963
申请日：2021-12-14
发明人： Sung Hoon Oh , Yonghua Wei , Md Rashidul Islam , Qian Qiao , Ulf Jan-Ove Mattsson , Geng Ye , Bruno Cendon Martin
摘要： The disclosed system may include an enclosure that is configured to house internal electrical components disposed on a printed circuit board (PCB). The system may also include a first antenna feed that is electrically connected to the PCB, to the enclosure, and to a radiating coupling arm configured for wireless communication in a first wireless communication band. The system may further include a second antenna feed that is electrically connected to the PCB and to an antenna configured for wireless communication in a second, different wireless communication band. The system may also include a first grounding leg that forms an electrical ground between the PCB and the enclosure, and a second, switchable grounding leg positioned away from the first grounding leg. This switchable grounding leg may provide a controllable electrical ground between the PCB and the enclosure. Various other methods and apparatuses are also disclosed.
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公开(公告)号：US20220393352A1
公开(公告)日：2022-12-08
申请号：US17550963
申请日：2021-12-14
发明人： Sung Hoon Oh , Yonghua Wei , Md Rashidul Islam , Qian Qiao , Ulf Jan-Ove Mattsson , Geng Ye , Bruno Cendon Martin
摘要： The disclosed system may include an enclosure that is configured to house internal electrical components disposed on a printed circuit board (PCB). The system may also include a first antenna feed that is electrically connected to the PCB, to the enclosure, and to a radiating coupling arm configured for wireless communication in a first wireless communication band. The system may further include a second antenna feed that is electrically connected to the PCB and to an antenna configured for wireless communication in a second, different wireless communication band. The system may also include a first grounding leg that forms an electrical ground between the PCB and the enclosure, and a second, switchable grounding leg positioned away from the first grounding leg. This switchable grounding leg may provide a controllable electrical ground between the PCB and the enclosure. Various other methods and apparatuses are also disclosed.
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公开(公告)号：US20240146340A1
公开(公告)日：2024-05-02
申请号：US18049756
申请日：2022-10-26
发明人： Ce Zhang , Yonghua Wei , Danyang Huang , Md Rashidul Islam , Geng Ye , Bruno Cendon Martin
IPC分类号： H04B1/00
CPC分类号： H04B1/0064 , H04B1/0078
摘要： The disclosed system may include a printed circuit board (PCB) within an enclosure. The system may further include a first antenna affixed to an upper layer of the enclosure above the PCB as well as a second antenna affixed to a lower layer of the enclosure below the PCB. The system may also include a decoupling switch that links the first antenna to the second antenna through the PCB. The decoupling switch may selectively couple the first and second antennas when transmitting or receiving signals above a specified minimum frequency and may decouple the first and second antennas when transmitting or receiving signals below a specified maximum frequency. Various other apparatuses, mobile electronic devices, and methods of manufacturing are also disclosed.
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公开(公告)号：US20220407220A1
公开(公告)日：2022-12-22
申请号：US17550968
申请日：2021-12-14
发明人： Md Rashidul Islam , Ulf Jan-Ove Mattsson , Yonghua Wei , Sung Hoon Oh , Qian Qiao , Geng Ye , Bruno Cendon Martin
摘要： The disclosed system may include an enclosure that is configured to house a printed circuit board (PCB). The PCB may have various internal electrical components mounted thereto. The system may also include a radiating component mounted to an opposite side of the PCB. Still further, the system may include a unified grounding structure that couples the PCB to the enclosure in multiple locations. As such, the radiating component may be grounded to the unified grounding structure at the multiple different locations. Various other methods, systems, and computer-readable media are also disclosed, including methods of manufacturing mobile electronic devices.
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