公开(公告)号：US20130001710A1

公开(公告)日：2013-01-03

申请号：US13536896

申请日：2012-06-28

申请人： Michael J. DANEMAN ,  Martin LIM ,  Joseph SEEGER ,  Igor TCHERTKOV ,  Steven S. NASIRI

发明人： Michael J. DANEMAN ,  Martin LIM ,  Joseph SEEGER ,  Igor TCHERTKOV ,  Steven S. NASIRI

IPC分类号： H01L21/50 ,  H01L29/84

CPC分类号： H01L23/10 ,  B81B2201/0264 ,  B81B2201/047 ,  B81B2207/115 ,  B81C1/00238 ,  B81C2203/0109 ,  B81C2203/0145 ,  B81C2203/0792 ,  G01P15/0802 ,  G01P15/125 ,  G02B26/0833 ,  H01L2224/48091 ,  H01L2924/1461 ,  H01L2924/00014 ,  H01L2924/00

摘要： A method and system for providing a MEMS device with a portion exposed to an outside environment are disclosed. The method comprises bonding a handle wafer to a device wafer to form a MEMS substrate with a dielectric layer disposed between the handle and device wafers. The method includes lithographically defining at least one standoff on the device wafer and bonding the at least one standoff to an integrated circuit substrate to form a sealed cavity between the MEMS substrate and the integrated circuit substrate. The method includes defining at least one opening in the handle wafer, standoff, or integrated circuit substrate to expose a portion of the to expose a portion of the device wafer to the outside environment.

摘要翻译： 公开了一种用于向MEMS器件提供暴露于外部环境的部分的方法和系统。 该方法包括将处理晶片结合到器件晶片以形成具有设置在手柄和器件晶片之间的介电层的MEMS衬底。 该方法包括光刻地限定器件晶片上的至少一个间隔，并将至少一个支架结合到集成电路衬底，以在MEMS衬底和集成电路衬底之间形成密封空腔。 该方法包括在处理晶片，支座或集成电路基板中限定至少一个开口，以暴露一部分将器件晶片的一部分暴露于外部环境。

公开(公告)号：US20120235251A1

公开(公告)日：2012-09-20

申请号：US13367271

申请日：2012-02-06

申请人： Michael J. DANEMAN ,  Steven S. NASIRI ,  Martin LIM

发明人： Michael J. DANEMAN ,  Steven S. NASIRI ,  Martin LIM

IPC分类号： H01L29/84

CPC分类号： A45D27/42 ,  B81C1/00238 ,  B81C2203/0792 ,  H01L21/76898

摘要： A MEMS device is disclosed. The MEMS device comprises a MEMS substrate and a CMOS substrate having a front surface, a back surface and one or more metallization layers. The front surface being bonded to the MEMS substrate. The MEMS device includes one or more conductive features on the back surface of the CMOS substrate and electrical connections between the one or more metallization layers and the one or more conductive features.

摘要翻译： 公开了MEMS器件。 MEMS器件包括MEMS衬底和具有前表面，后表面和一个或多个金属化层的CMOS衬底。 前表面接合到MEMS基板上。 MEMS器件包括在CMOS衬底的背面上的一个或多个导电特征以及一个或多个金属化层与一个或多个导电特征之间的电连接。

公开(公告)号：US20120235297A1

公开(公告)日：2012-09-20

申请号：US13455494

申请日：2012-04-25

申请人： Michael J. DANEMAN ,  Steven S. NASIRI ,  Martin LIM

发明人： Michael J. DANEMAN ,  Steven S. NASIRI ,  Martin LIM

IPC分类号： H01L23/498

CPC分类号： A45D27/42 ,  B81C1/00238 ,  B81C2203/0792 ,  H01L21/76898

摘要： A MEMS device is disclosed. The MEMS device comprises a MEMS substrate and a CMOS substrate having a front surface, a back surface and one or more metallization layers. The front surface being bonded to the MEMS substrate. The MEMS device includes one or more conductive features on the back surface of the CMOS substrate and electrical connections between the one or more metallization layers and the one or more conductive features.