High resistivity thin film composition and fabrication method
    1.
    发明授权
    High resistivity thin film composition and fabrication method 有权
    高电阻薄膜组成及制备方法

    公开(公告)号:US07609144B2

    公开(公告)日:2009-10-27

    申请号:US11608668

    申请日:2006-12-08

    IPC分类号: H01C1/012

    CPC分类号: H01C7/006 Y10T29/49082

    摘要: A thin film composition is made from silicon, an insulator such as alumina or silicon dioxide, and at least one additional material such as chromium, nickel, boron and/or carbon. These materials are combined to provide a thin film having a ρ of at least 0.02 Ω-cm (typically 0.02-1.0 Ω-cm), and a TCR of less than ±1000 ppm/° C. (typically less than ±300 ppm/° C.). A sheet resistance of at least 20 kΩ/□ may also be obtained. The resulting thin film is preferably at least 200 thick, to reduce surface scattering conduction currents.

    摘要翻译: 薄膜组合物由硅,诸如氧化铝或二氧化硅的绝缘体和至少一种另外的材料如铬,镍,硼和/或碳制成。 将这些材料组合以提供具有至少0.02Ω·cm(通常为0.02-1.0Ω·cm)的rho和小于±1000ppm /℃(通常小于±300ppm /℃)的TCR的薄膜, C。)。 也可以获得至少20kOmega /□的薄层电阻。 所得薄膜优选为至少200 厚,以减少表面散射传导电流。

    HIGH RESISTIVITY THIN FILM COMPOSITION AND FABRICATION METHOD
    2.
    发明申请
    HIGH RESISTIVITY THIN FILM COMPOSITION AND FABRICATION METHOD 有权
    高电阻薄膜组合物和制造方法

    公开(公告)号:US20080136579A1

    公开(公告)日:2008-06-12

    申请号:US11608668

    申请日:2006-12-08

    IPC分类号: H01C1/012 H01C17/06 B05D5/12

    CPC分类号: H01C7/006 Y10T29/49082

    摘要: A thin film composition is made from silicon, an insulator such as alumina or silicon dioxide, and at least one additional material such as chromium, nickel, boron and/or carbon. These materials are combined to provide a thin film having a ρ of at least 0.02 Ω-cm (typically 0.02-1.0 Ω-cm), and a TCR of less than ±1000 ppm/° C. (typically less than ±300 ppm/° C.). A sheet resistance of at least 20 kΩ/□ may also be obtained. The resulting thin film is preferably at least 200 Å thick, to reduce surface scattering conduction currents.

    摘要翻译: 薄膜组合物由硅,诸如氧化铝或二氧化硅的绝缘体和至少一种另外的材料如铬,镍,硼和/或碳制成。 将这些材料组合以提供具有至少0.02Ω·cm(通常为0.02-1.0Ω·cm)的rho和小于±1000ppm /℃(通常小于±300ppm /℃)的TCR的薄膜, C。)。 也可以获得至少20kOmega /□的薄层电阻。 所得薄膜优选至少为200埃,以减少表面散射传导电流。