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公开(公告)号：US07280342B1
公开(公告)日：2007-10-09
申请号：US11639796
申请日：2006-12-15
申请人： Michael S. Randall , Allen Hill , Peter Blais , Garry Renner , Randal Vaughan , Azizuddin Tajuddin
发明人： Michael S. Randall , Allen Hill , Peter Blais , Garry Renner , Randal Vaughan , Azizuddin Tajuddin
摘要： A low inductance multi-layer capacitor. The capacitor comprises interleaved parallel internal electrode plates with dielectric there between. Each internal electrode plate comprises two lead-out tabs and is generally T shaped. A first external electrode terminal is electrically connected to the lead-out tabs of the even internal electrode plates, and a second external electrode terminal is electrically connected to the lead-out tabs of the odd internal electrode plates. The external electrode terminals are on a common first exterior surface and a common opposing second exterior surface of the capacitor.
摘要翻译： 低电感多层电容器。 电容器包括交错并联的内部电极板，其间具有电介质。 每个内部电极板包括两个引出片，并且通常为T形。 第一外部电极端子电连接到偶数内部电极板的引出接线片，第二外部电极端子电连接到奇数内部电极板的引出接线片。 外部电极端子位于电容器的公共第一外表面和公共相对的第二外表面上。
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公开(公告)号：US20070165361A1
公开(公告)日：2007-07-19
申请号：US11639796
申请日：2006-12-15
申请人： Michael S. Randall , Allen Hill , Peter Blais , Garry Renner , Randal Vaughan , Azizuddin Tajuddin
发明人： Michael S. Randall , Allen Hill , Peter Blais , Garry Renner , Randal Vaughan , Azizuddin Tajuddin
IPC分类号： H01G4/228
摘要： A low inductance multi-layer capacitor. The capacitor comprises interleaved parallel internal electrode plates with dielectric there between. Each internal electrode plate comprises two lead-out tabs and is generally T shaped. A first external electrode terminal is electrically connected to the lead-out tabs of the even internal electrode plates, and a second external electrode terminal is electrically connected to the lead-out tabs of the odd internal electrode plates. The external electrode terminals are on a common first exterior surface and a common opposing second exterior surface of the capacitor.
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公开(公告)号：US08873219B2
公开(公告)日：2014-10-28
申请号：US13533576
申请日：2012-06-26
申请人： Maurice Perea , Allen Hill , Reggie Phillips
发明人： Maurice Perea , Allen Hill , Reggie Phillips
摘要： A method of forming a stacked electronic component, and an electronic component formed by the method wherein the method includes: providing a multiplicity of electronic components wherein each electronic component comprises a first external termination and a second external termination; providing a first lead frame plate and a second lead frame plate wherein the first lead frame plate and the second lead frame plate comprises barbs and leads; providing a molded case comprising a cavity and a bottom; and forming a sandwich of electronic components in an array between the first lead frame plate and the second lead frame plate with the barbs protruding towards the electronic components and the leads extending through the bottom.
摘要翻译： 一种形成层叠电子元件的方法，以及通过该方法形成的电子部件，其中该方法包括：提供多个电子部件，其中每个电子部件包括第一外部端接和第二外部端接; 提供第一引线框架板和第二引线框架板，其中第一引线框架板和第二引线框架板包括倒钩和引线; 提供包括空腔和底部的模制外壳; 以及在所述第一引线框架板和所述第二引线框架板之间以阵列形式形成电子部件的夹层，所述倒钩朝向所述电子部件突出并且所述引线延伸穿过所述底部。
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公开(公告)号：US20130343027A1
公开(公告)日：2013-12-26
申请号：US13533576
申请日：2012-06-26
申请人： Maurice Perea , Allen Hill , Reggie Phillips
发明人： Maurice Perea , Allen Hill , Reggie Phillips
摘要： A method of forming a stacked electronic component, and an electronic component formed by the method wherein the method includes: providing a multiplicity of electronic components wherein each electronic component comprises a first external termination and a second external termination; providing a first lead frame plate and a second lead frame plate wherein the first lead frame plate and the second lead frame plate comprises barbs and leads; providing a molded case comprising a cavity and a bottom; and forming a sandwich of electronic components in an array between the first lead frame plate and the second lead frame plate with the barbs protruding towards the electronic components and the leads extending through the bottom.
摘要翻译： 一种形成层叠电子元件的方法，以及通过该方法形成的电子部件，其中该方法包括：提供多个电子部件，其中每个电子部件包括第一外部端接和第二外部端接; 提供第一引线框架板和第二引线框架板，其中第一引线框架板和第二引线框架板包括倒钩和引线; 提供包括空腔和底部的模制外壳; 以及在所述第一引线框架板和所述第二引线框架板之间以阵列形式形成电子部件的夹层，所述倒钩朝向所述电子部件突出并且所述引线延伸穿过所述底部。
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公开(公告)号：US20070175041A1
公开(公告)日：2007-08-02
申请号：US11648899
申请日：2007-01-03
申请人： Geoffrey Hardwick , Henry Coghlan , John Walsh , Allen Hill
发明人： Geoffrey Hardwick , Henry Coghlan , John Walsh , Allen Hill
CPC分类号： E06B3/7015 , B27N3/00 , B27N3/08 , B27N5/00 , E06B3/7001 , E06B3/78 , E06B2003/7025 , Y10T29/49623 , Y10T428/24504 , Y10T428/24603
摘要： The present invention is directed to a method of forming a molded core component. A mat formed from cellulosic fiber and resin is provided. The mat is consolidated in a first press until the resin is substantially fully cured, and then removed from the first press. The consolidated mat is then placed in a second press having a mold cavity shaped to form at least one depression in at least one of the major surfaces. The consolidated mat is reformed in the second press to form a molded core component having at least one depression in at least one of the major surfaces. The molded core component has a variable density, preferably of between about 10 lbs/ft3 and 80 lbs/ft3.
摘要翻译： 本发明涉及一种形成模制芯部件的方法。 提供由纤维素纤维和树脂形成的垫。 垫子被固定在第一压榨机中，直到树脂基本上完全固化，然后从第一压榨机中取出。 然后将固结的垫放置在第二压力机中，所述第二压力机具有成形为在至少一个主表面中形成至少一个凹陷的模腔。 将固结的垫在第二压机中重新形成以形成在至少一个主表面中具有至少一个凹陷的模制芯部件。 模制的芯部件具有可变密度，优选在约10磅/平方英尺和80磅/平方英尺之间。
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