公开(公告)号：US07280342B1

公开(公告)日：2007-10-09

申请号：US11639796

申请日：2006-12-15

申请人： Michael S. Randall ,  Allen Hill ,  Peter Blais ,  Garry Renner ,  Randal Vaughan ,  Azizuddin Tajuddin

发明人： Michael S. Randall ,  Allen Hill ,  Peter Blais ,  Garry Renner ,  Randal Vaughan ,  Azizuddin Tajuddin

IPC分类号： H01G4/005 ,  H01G4/06 ,  H01G4/228

CPC分类号： H01G4/232 ,  H01G4/30

摘要： A low inductance multi-layer capacitor. The capacitor comprises interleaved parallel internal electrode plates with dielectric there between. Each internal electrode plate comprises two lead-out tabs and is generally T shaped. A first external electrode terminal is electrically connected to the lead-out tabs of the even internal electrode plates, and a second external electrode terminal is electrically connected to the lead-out tabs of the odd internal electrode plates. The external electrode terminals are on a common first exterior surface and a common opposing second exterior surface of the capacitor.

摘要翻译： 低电感多层电容器。 电容器包括交错并联的内部电极板，其间具有电介质。 每个内部电极板包括两个引出片，并且通常为T形。 第一外部电极端子电连接到偶数内部电极板的引出接线片，第二外部电极端子电连接到奇数内部电极板的引出接线片。 外部电极端子位于电容器的公共第一外表面和公共相对的第二外表面上。

公开(公告)号：US20070165361A1

公开(公告)日：2007-07-19

申请号：US11639796

申请日：2006-12-15

申请人： Michael S. Randall ,  Allen Hill ,  Peter Blais ,  Garry Renner ,  Randal Vaughan ,  Azizuddin Tajuddin

发明人： Michael S. Randall ,  Allen Hill ,  Peter Blais ,  Garry Renner ,  Randal Vaughan ,  Azizuddin Tajuddin

IPC分类号： H01G4/228

CPC分类号： H01G4/232 ,  H01G4/30

摘要： A low inductance multi-layer capacitor. The capacitor comprises interleaved parallel internal electrode plates with dielectric there between. Each internal electrode plate comprises two lead-out tabs and is generally T shaped. A first external electrode terminal is electrically connected to the lead-out tabs of the even internal electrode plates, and a second external electrode terminal is electrically connected to the lead-out tabs of the odd internal electrode plates. The external electrode terminals are on a common first exterior surface and a common opposing second exterior surface of the capacitor.

公开(公告)号：US20080236717A1

公开(公告)日：2008-10-02

申请号：US12116526

申请日：2008-05-07

申请人： Abhijit Gurav ,  Azizuddin Tajuddin ,  Daniel Skamser ,  Garry Renner ,  March Maguire ,  Michael S. Randall ,  Randal Vaughan

发明人： Abhijit Gurav ,  Azizuddin Tajuddin ,  Daniel Skamser ,  Garry Renner ,  March Maguire ,  Michael S. Randall ,  Randal Vaughan

IPC分类号： B29C65/00

CPC分类号： H01G4/0085 ,  H01G4/12 ,  H01G4/30 ,  Y10T156/10

摘要： A process for forming a multilayer ceramic capacitor. The process includes depositing a ceramic precursor on a substrate and an electrode ink in a predetermined pattern on the ceramic precursor to form a green sheet. The electrode ink has an adhesion promoter incorporated therein. The green sheet is overlayed with at least one second green sheet to form a layered green sheet which is then fused under pressure.

摘要翻译： 一种形成多层陶瓷电容器的工艺。 该方法包括将陶瓷前体沉积在基底上，并在陶瓷前体上以预定图案沉积电极墨以形成生片。 电极油墨具有并入其中的粘合促进剂。 生片与至少一个第二生片重叠以形成分层的生片，然后在压力下熔融。

公开(公告)号：US08717774B2

公开(公告)日：2014-05-06

申请号：US13292267

申请日：2011-11-09

申请人： Michael S. Randall ,  Garry Renner ,  John D. Prymak ,  Azizuddin Tajuddin

发明人： Michael S. Randall ,  Garry Renner ,  John D. Prymak ,  Azizuddin Tajuddin

IPC分类号： H05K7/00

CPC分类号： H01L23/50 ,  H01L23/642 ,  H01L2924/0002 ,  H01L2924/19103 ,  H01L2924/3011 ,  H01L2924/00

摘要： A capacitive interposer, electronic package having the capacitive interposer and electronic device with the electronic package is described. The interposer has a first planar face and a second planar face. An array of upper connections is on the first planar face and opposing lower connections are on the second planar face with conduction paths between each upper connection of the upper connections and a lower connection of the lower connections. At least one power feed-through capacitor is provided. The capacitor is mounted on the first planar face with the first external termination in direct electrical contact with a first upper connection and the second external termination is in direct electrical contact with a second upper connection. At least one upper connection, first external termination and second external termination are arranged for direct electrical contact with element contact pads of a common element.

摘要翻译： 描述了一种电容式插入器，具有电容插入器的电子封装和具有电子封装的电子器件。 插入器具有第一平面和第二平面。 上连接的阵列位于第一平面上，相对的下连接在第二平面上，上连接的每个上连接与下连接的下连接之间具有传导路径。 提供至少一个馈电电容器。 电容器安装在第一平面上，第一外部端子与第一上连接件直接电接触，第二外部端子与第二上连接件直接电接触。 至少一个上部连接，第一外部端接和第二外部端接布置成与公共元件的元件接触垫直接电接触。

公开(公告)号：US20120081870A1

公开(公告)日：2012-04-05

申请号：US13292267

申请日：2011-11-09

申请人： Michael S. Randall ,  Garry Renner ,  John D. Prymak ,  Azizuddin Tajuddin

发明人： Michael S. Randall ,  Garry Renner ,  John D. Prymak ,  Azizuddin Tajuddin

IPC分类号： H01R12/70

CPC分类号： H01L23/50 ,  H01L23/642 ,  H01L2924/0002 ,  H01L2924/19103 ,  H01L2924/3011 ,  H01L2924/00

摘要： A capacitive interposer, electronic package having the capacitive interposer and electronic device with the electronic package is described. The interposer has a first planar face and a second planar face. An array of upper connections is on the first planar face and opposing lower connections are on the second planar face with conduction paths between each upper connection of the upper connections and a lower connection of the lower connections. At least one power feed-through capacitor is provided. The capacitor is mounted on the first planar face with the first external termination in direct electrical contact with a first upper connection and the second external termination is in direct electrical contact with a second upper connection. At least one upper connection, first external termination and second external termination are arranged for direct electrical contact with element contact pads of a common element.

摘要翻译： 描述了一种电容式插入器，具有电容插入器的电子封装和具有电子封装的电子器件。 插入器具有第一平面和第二平面。 上连接的阵列位于第一平面上，相对的下连接在第二平面上，上连接的每个上连接与下连接的下连接之间具有传导路径。 提供至少一个馈电电容器。 电容器安装在第一平面上，第一外部端子与第一上连接件直接电接触，第二外部端子与第二上连接件直接电接触。 至少一个上部连接，第一外部端接和第二外部端接布置成与公共元件的元件接触垫直接电接触。

公开(公告)号：US20080192452A1

公开(公告)日：2008-08-14

申请号：US11705260

申请日：2007-02-12

申请人： Michael S. Randall ,  Garry Renner ,  John D. Prymak ,  Azizuddin Tajuddin

发明人： Michael S. Randall ,  Garry Renner ,  John D. Prymak ,  Azizuddin Tajuddin

IPC分类号： H05K7/00 ,  H05K1/16

CPC分类号： H05K1/0231 ,  H01L23/49827 ,  H01L23/50 ,  H01L2224/16225 ,  H01L2924/3011 ,  H05K1/141 ,  H05K2201/10378 ,  H05K2201/10704 ,  H05K2201/10734

摘要： A capacitive interposer, electronic package having the capacitive interposer and electronic device with the electronic package is described. The interposer has a first planar face and a second planar face. An array of upper connections is on the first planar face and opposing lower connections are on the second planar face with conduction paths between each upper connection of the upper connections and a lower connection of the lower connections. At least one capacitor is provided. The capacitor has a plurality of parallel plates with a dielectric there between. At least one first external termination is in electrical contact with a first set of alternate parallel plates and at least one second external termination is in electrical contact with a second set of alternate parallel plates. The capacitor is mounted on the first planar face with the first external termination in direct electrical contact with a first upper connection and the second external termination is in direct electrical contact with a second upper connection. At least one upper connection, first external termination and second external termination are arranged for direct electrical contact with element contact pads of a common element.

摘要翻译： 描述了一种电容式插入器，具有电容插入器的电子封装和具有电子封装的电子器件。 插入器具有第一平面和第二平面。 上连接的阵列位于第一平面上，相对的下连接在第二平面上，上连接的每个上连接与下连接的下连接之间具有传导路径。 提供至少一个电容器。 电容器具有多个平行板，其间具有电介质。 至少一个第一外部端接件与第一组交替的平行板电接触，并且至少一个第二外部端接件与第二组交替的平行板电接触。 电容器安装在第一平面上，第一外部端子与第一上连接件直接电接触，第二外部端子与第二上连接件直接电接触。 至少一个上部连接，第一外部端接和第二外部端接布置成与公共元件的元件接触垫直接电接触。

公开(公告)号：US08111524B2

公开(公告)日：2012-02-07

申请号：US12526426

申请日：2008-02-12

申请人： Michael S. Randall ,  Garry Renner ,  John D. Prymak ,  Azizuddin Tajuddin

发明人： Michael S. Randall ,  Garry Renner ,  John D. Prymak ,  Azizuddin Tajuddin

IPC分类号： H05K3/00

CPC分类号： H05K1/0231 ,  H01L23/49827 ,  H01L23/50 ,  H01L2224/16225 ,  H01L2924/3011 ,  H05K1/141 ,  H05K2201/10378 ,  H05K2201/10704 ,  H05K2201/10734

摘要： A capacitive interposer, electronic package having the capacitive interposer and electronic device with the electronic package is described. The interposer has a first planar face and a second planar face. An array of upper connections is on the first planar face and opposing lower connections are on the second planar face with conduction paths between each upper connection of the upper connections and a lower connection of the lower connections. At least one power feed-through capacitor is provided. The capacitor has a plurality of parallel plates with a dielectric there between. At least one first external termination is in electrical contact with a first set of alternate parallel plates and at least one second external termination is in electrical contact with a second set of alternate parallel plates. The capacitor is mounted on the first planar face with the first external termination in direct electrical contact with a first upper connection and the second external termination is in direct electrical contact with a second upper connection. At least one upper connection, first external termination and second external termination are arranged for direct electrical contact with element contact pads of a common element.

摘要翻译： 描述了一种电容式插入器，具有电容插入器的电子封装和具有电子封装的电子器件。 插入器具有第一平面和第二平面。 上连接的阵列位于第一平面上，相对的下连接在第二平面上，上连接的每个上连接与下连接的下连接之间具有传导路径。 提供至少一个馈电电容器。 电容器具有多个平行板，其间具有电介质。 至少一个第一外部端接件与第一组交替的平行板电接触，并且至少一个第二外部端接件与第二组交替的平行板电接触。 电容器安装在第一平面上，第一外部端子与第一上连接件直接电接触，第二外部端子与第二上连接件直接电接触。 至少一个上部连接，第一外部端接和第二外部端接布置成与公共元件的元件接触垫直接电接触。

公开(公告)号：US20080123251A1

公开(公告)日：2008-05-29

申请号：US11605160

申请日：2006-11-28

申请人： Michael S. Randall ,  Peter Blais ,  Pascal Pinceloup ,  Daniel J. Skamser ,  Abhijit Gurav ,  Azizuddin Tajuddin ,  John T. Kinard ,  Philip Lessner

发明人： Michael S. Randall ,  Peter Blais ,  Pascal Pinceloup ,  Daniel J. Skamser ,  Abhijit Gurav ,  Azizuddin Tajuddin ,  John T. Kinard ,  Philip Lessner

IPC分类号： H01G9/00

CPC分类号： H01G9/15 ,  H01G9/0029 ,  H01G9/0032 ,  H01G9/04

摘要： A process for forming a capacitive couple. The process includes forming a highly porous body of a conducting material with interior struts and voids in electrical contact. A dielectric layer is formed in the voids on the struts with a material having a dielectric constant above 100. An insulating layer is formed on the struts not covered by the dielectric layer. A conductive layer is formed on the dielectric layer and on the insulating layer.

摘要翻译： 一种用于形成电容耦合的过程。 该方法包括形成具有内部支柱和电气接触的空隙的导电材料的高度多孔体。 在介质常数高于100的材料上，在支柱上的空隙中形成电介质层。绝缘层形成在未被电介质层覆盖的支柱上。 导电层形成在绝缘层和绝缘层上。

公开(公告)号：US20070193675A1

公开(公告)日：2007-08-23

申请号：US11359074

申请日：2006-02-22

申请人： Abhijit Gurav ,  Azizuddin Tajuddin ,  Daniel Skamser ,  Gary Renner ,  March Maguire ,  Michael Randall ,  Randal Vaughan

发明人： Abhijit Gurav ,  Azizuddin Tajuddin ,  Daniel Skamser ,  Gary Renner ,  March Maguire ,  Michael Randall ,  Randal Vaughan

IPC分类号： C03B29/00 ,  H01G4/06

CPC分类号： H01G4/0085 ,  H01G4/12 ,  H01G4/30 ,  Y10T156/10

摘要： A process for forming a multilayer ceramic capacitor. The process includes depositing a ceramic precursor on a substrate and an electrode ink in a predetermined pattern on the ceramic precursor to form a green sheet. The electrode ink has an adhesion promoter incorporated therein. The green sheet is overlayed with at least one second green sheet to form a layered green sheet which is then fused under pressure.

摘要翻译： 一种形成多层陶瓷电容器的工艺。 该方法包括将陶瓷前体沉积在基底上，并在陶瓷前体上以预定图案沉积电极墨以形成生片。 电极油墨具有并入其中的粘合促进剂。 生片与至少一个第二生片重叠以形成分层的生片，然后在压力下熔融。

公开(公告)号：US20090046411A1

公开(公告)日：2009-02-19

申请号：US12257532

申请日：2008-10-24

申请人： Michael S. Randall ,  Corey Antoniades ,  Daniel E. Barber ,  Xilin Xu ,  James Beeson ,  Pascal Pinceloup ,  Abhijit Gurav ,  Thomas Poole ,  Azizuddin Tajuddin ,  Ian Burn

发明人： Michael S. Randall ,  Corey Antoniades ,  Daniel E. Barber ,  Xilin Xu ,  James Beeson ,  Pascal Pinceloup ,  Abhijit Gurav ,  Thomas Poole ,  Azizuddin Tajuddin ,  Ian Burn

IPC分类号： H01G4/258

CPC分类号： C04B35/49 ,  C04B35/64 ,  C04B2235/3206 ,  C04B2235/3208 ,  C04B2235/3213 ,  C04B2235/3215 ,  C04B2235/3217 ,  C04B2235/3224 ,  C04B2235/3225 ,  C04B2235/3227 ,  C04B2235/3229 ,  C04B2235/3239 ,  C04B2235/3241 ,  C04B2235/3244 ,  C04B2235/3251 ,  C04B2235/3256 ,  C04B2235/3258 ,  C04B2235/3262 ,  C04B2235/3267 ,  C04B2235/3275 ,  C04B2235/3281 ,  C04B2235/3286 ,  C04B2235/3287 ,  C04B2235/3409 ,  C04B2235/3418 ,  C04B2235/5445 ,  C04B2235/6025 ,  C04B2235/656 ,  C04B2235/6584 ,  C04B2235/663 ,  H01G4/1209 ,  H01G4/1227 ,  H01G4/30

摘要： A dielectric ceramic composition in a multilayer ceramic capacitor with a composition of formula: {[(CaO)t(SrO)1-t]m[(ZrO2)v(TiO2)1-v]}1-s-xAsEx wherein: A is a transition metal oxide; E is an oxide of an element selected from the group consisting of Ge, Si, Ga and combinations thereof; m is 0.98 to 1.02; t is 0.50 to 0.90; v is 0.8 to 1.0; s and x are selected from the group consisting of: a) 0≦x≦0.08, 0.0001≦s≦0.043 and x≧1.86s; and b) 0≦x≦0.0533, 0.0001≦s≦0.08 and x≦0.667s.

摘要翻译： 一种具有下列组成的多层陶瓷电容器中的介电陶瓷组合物：<？in-line-formula description =“In-line Formulas”end =“lead”？> {[（CaO）t（SrO）1-t] m [（ZrO 2）v（TiO 2）1-v]} 1-s-x A​​sEx <？in-line-formula description =“In-line Formulas”end =“tail”？>其中：A是过渡金属氧化物; E是选自Ge，Si，Ga及其组合的元素的氧化物; m为0.98〜1.02; t为0.50〜0.90; v为0.8〜1.0; s和x选自：a）0 <= x <= 0.08,0 0.0001 <= s <= 0.043和x> = 1.86s; 和b）0 <= x <= 0.0533，0.0001 <= s <= 0.08和x <= 0.667s。